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ISO7741FQDBQRQ1

Texas Instruments

ISO7741FQDBQRQ1 by Texas Instruments

ISO7741FQDBQRQ1 by Texas Instruments is a 16-terminal IC with 4 functions, operating at -40 to 125°C. It has a supply voltage range of 2.25V to 5.5V and is AEC-Q100 compliant for automotive applications. The package style is small outline, shrink pitch, making it suitable for surface mount designs in various interface circuits.

Median Price

$1.670

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,881 parts In-Stock

1+ parts

$1.669

100+ parts

$1.378

1k+ parts

$0.745

10k+ parts

-

15,881

$1.669

$1.378

$0.745

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Mouser Electronics

USA . 83 parts In-Stock

1+ parts

$3.200

100+ parts

$1.980

1k+ parts

$1.800

10k+ parts

$1.700

83

$3.200

$1.980

$1.800

$1.700

DigiKey

USA . 1,856 parts In-Stock

1+ parts

-

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$1.670

1,856

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$1.670

Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$1.508

100+ parts

-

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100

$1.508

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Digiode

USA . 4,916 parts In-Stock

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$1.586

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4,916

$1.586

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Chip Stock

USA . 24,100 parts In-Stock

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24,100

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Vyrian

USA . 9,728 parts In-Stock

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9,728

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ComSIT Distribution GmbH

Germany . 100 parts In-Stock

1+ parts

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100

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ComSIT USA

USA . 100 parts In-Stock

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100

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AGACORP

USA . 71 parts In-Stock

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71

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Cyclops Electronics Ltd

UK . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 9,601 parts In-Stock

1+ parts

$1.420

100+ parts

-

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9,601

$1.420

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-

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Semicontronic

India . 9,520 parts In-Stock

1+ parts

$1.420

100+ parts

$1.384

1k+ parts

$1.377

10k+ parts

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9,520

$1.420

$1.384

$1.377

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Corphita

USA . 1,449 parts In-Stock

1+ parts

$1.502

100+ parts

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1,449

$1.502

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Argo Parts USA

USA . 3,104 parts In-Stock

1+ parts

$1.508

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3,104

$1.508

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Continental Prestige Electronics

USA . 906 parts In-Stock

1+ parts

$1.508

100+ parts

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$1.478

906

$1.508

-

-

$1.478

Corohmni

South Africa . 525 parts In-Stock

1+ parts

$8.617

100+ parts

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525

$8.617

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Parana Technologies

USA . 322 parts In-Stock

1+ parts

$9.906

100+ parts

-

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$10.475

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322

$9.906

-

$10.475

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$10.446

100+ parts

$9.924

1k+ parts

$9.924

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40

$10.446

$9.924

$9.924

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DigiPath Technology Company

USA . 1,731 parts In-Stock

1+ parts

$10.907

100+ parts

$10.035

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1,731

$10.907

$10.035

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ChromeModa Solutions

Germany . 4,775 parts In-Stock

1+ parts

$11.130

100+ parts

$9.127

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4,775

$11.130

$9.127

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IDEA Electronic Components Group

UK . 2,244 parts In-Stock

1+ parts

$11.130

100+ parts

$10.574

1k+ parts

$10.017

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2,244

$11.130

$10.574

$10.017

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Authorized Procurement Solutions

USA . 3,700 parts In-Stock

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3,700

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Lixinc

USA . 1,878 parts In-Stock

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1,878

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

$1.478

1k+ parts

$1.433

10k+ parts

$1.403

1,000

-

$1.478

$1.433

$1.403

Robosynatics

Brazil . 20 parts In-Stock

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20

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Lucentia Tech

USA . 20 parts In-Stock

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100+ parts

$74.117

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$74.117

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$74.117

20

-

$74.117

$74.117

$74.117

Overview

Unlock the potential of your automotive applications with the ISO7741FQDBQRQ1 by Texas Instruments. This cutting-edge interface IC offers unmatched quality and reliability, backed by Texas Instruments' stellar reputation in the industry. With four functions in one package, this device is perfect for a wide range of automotive electronics, ensuring seamless communication and optimal performance. Experience the value and advantages this product brings to your projects, from its high-quality construction to its advanced technology, making it a must-have for any automotive design. Elevate your designs with the ISO7741FQDBQRQ1 and see the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, making it versatile for a variety of applications.

No. of Functions: 4

Provides multiple functionalities in a single component, saving space and simplifying circuit design.

Screening Level: AEC-Q100

Complies with automotive industry standards for reliability and quality assurance, suitable for automotive applications.

Package Shape: RECTANGULAR

Allows for compact and efficient placement on the PCB, optimizing board space.

No. of Terminals: 16

Offers multiple connection points for interfacing with other components, enhancing versatility.

Minimum Supply Voltage: 2.25 V

Can operate at low voltage levels, conserving energy and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, ensuring reliable performance in various conditions.

Minimum Operating Temperature: -40 °C

Capable of operating in cold environments, making it suitable for a wide range of applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides a reliable and corrosion-resistant finish for the terminals, ensuring long-term performance.

Terminal Position: DUAL

Dual terminal positioning allows for better connectivity and stability in the circuit.

Maximum Seated Height: 1.75 mm

Low profile design saves space on the PCB and enables compact device designs.

Width: 3.895 mm

Compact width dimension allows for efficient placement on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for 30 seconds, ensuring proper soldering during assembly.

Peak Reflow Temperature °C: 260

Designed to withstand high peak reflow temperatures, ensuring proper soldering and reliability.

Length: 4.905 mm

Compact length dimension allows for efficient placement on the circuit board.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature range and reliability.

No. of Channels: 4

Multiple channels provide the capability to handle multiple signals or functions simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for various applications.

Terminal Form: GULL WING

Gull wing terminals provide secure and reliable connections to the circuit board.

Nominal Supply Voltage: 2.5 V

Operates at a standard nominal voltage level, compatible with many systems and devices.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for compact terminal layout and efficient PCB design.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates that the product is capable of withstanding moderate humidity environments.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other components or systems, making it a specialized and effective choice.

Technical Specifications

Other Function Interface ICs ISO7741FQDBQRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED (VCC2) 2.25-5.5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7741FQDBQRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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