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XISO6742FDWR

Texas Instruments

XISO6742FDWR by Texas Instruments

XISO6742FDWR by Texas Instruments is a small outline interface IC with 16 terminals. It operates in automotive-grade temperatures from -40 to 125°C, with a supply voltage range of 1.71V to 5.5V. This IC is suitable for various applications requiring an interface circuit in surface-mount packages.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,500 parts In-Stock

1+ parts

-

100+ parts

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7,500

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Digiode

USA . 1,634 parts In-Stock

1+ parts

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1,634

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$3.856

100+ parts

$3.664

1k+ parts

$3.664

10k+ parts

-

500

$3.856

$3.664

$3.664

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Corohmni

South Africa . 916 parts In-Stock

1+ parts

$4.139

100+ parts

-

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916

$4.139

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Parana Technologies

USA . 713 parts In-Stock

1+ parts

$6.231

100+ parts

-

1k+ parts

$6.989

10k+ parts

-

713

$6.231

-

$6.989

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DigiPath Technology Company

USA . 1,575 parts In-Stock

1+ parts

$6.861

100+ parts

$6.312

1k+ parts

-

10k+ parts

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1,575

$6.861

$6.312

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ChromeModa Solutions

Germany . 1,173 parts In-Stock

1+ parts

$7.001

100+ parts

$5.741

1k+ parts

-

10k+ parts

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1,173

$7.001

$5.741

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IDEA Electronic Components Group

UK . 910 parts In-Stock

1+ parts

$7.001

100+ parts

-

1k+ parts

$6.301

10k+ parts

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910

$7.001

-

$6.301

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One Stop Electronics

USA . 1,453 parts In-Stock

1+ parts

$9.500

100+ parts

-

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10k+ parts

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1,453

$9.500

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AZTECH Wire

Italy . 750 parts In-Stock

1+ parts

$10.092

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750

$10.092

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Semicontronic

India . 1,057 parts In-Stock

1+ parts

$35.500

100+ parts

$34.612

1k+ parts

$34.435

10k+ parts

-

1,057

$35.500

$34.612

$34.435

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Ampacity Inc.

Singapore . 805 parts In-Stock

1+ parts

$35.500

100+ parts

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805

$35.500

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Continental Prestige Electronics

USA . 5,745 parts In-Stock

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5,745

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Corphita

USA . 933 parts In-Stock

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933

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Argo Parts USA

USA . 503 parts In-Stock

1+ parts

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503

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Bastille Electronics

Australia . 54 parts In-Stock

1+ parts

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54

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Overview

Discover the cutting-edge XISO6742FDWR by Texas Instruments, a top-tier manufacturer known for delivering high-quality products. This interface IC falls under the category of Other Function Interface ICs, providing seamless connectivity solutions. With a wide supply voltage range, compact package size, and exceptional temperature tolerance, this product is perfect for automotive applications and beyond. Experience unmatched reliability and performance with the XISO6742FDWR, offering customers unparalleled value and benefits in their projects. Elevate your designs with this versatile solution from Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, making it a good choice for long-term use.

Surface Mount: YES

Being surface mountable allows for easy installation and space-saving on circuit boards, making this product a convenient choice for compact designs.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can withstand fluctuations in power input, ensuring reliable performance in various applications.

Package Shape: RECTANGULAR

The rectangular package shape offers easy integration into existing designs, making this product a versatile choice for different projects.

No. of Terminals: 16

The ample number of terminals provide flexibility in connecting to other components, making this product suitable for complex interface requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, making this product a practical choice for designs with limited room.

Minimum Supply Voltage: 1.71 V

With a low minimum supply voltage requirement, this product is energy-efficient and can operate in power-sensitive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh environments, making this product suitable for industrial use.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows this product to function in cold conditions without compromising performance.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance, ensuring stable connections for enhanced reliability.

Terminal Position: DUAL

Dual terminal positions offer versatility in mounting orientations, making this product adaptable to different PCB layouts.

Maximum Seated Height: 2.65 mm

The low maximum seated height saves space on PCBs and allows for compact designs, making this product ideal for applications with height constraints.

Technical Specifications

Other Function Interface ICs XISO6742FDWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

XISO6742FDWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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