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XISOUSB211DPR

Texas Instruments

XISOUSB211DPR by Texas Instruments

XISOUSB211DPR by Texas Instruments is a small outline interface IC with 28 terminals. It operates b/w -40 to 125 °C, with supply voltage range of 1.71V to 1.94V. Ideal for applications requiring dual terminal position and Gull Wing form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,412 parts In-Stock

1+ parts

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2,412

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Digiode

USA . 1,671 parts In-Stock

1+ parts

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1,671

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 2,500 parts In-Stock

1+ parts

$5.664

100+ parts

$5.381

1k+ parts

$5.381

10k+ parts

-

2,500

$5.664

$5.381

$5.381

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Corohmni

South Africa . 144 parts In-Stock

1+ parts

$8.757

100+ parts

-

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144

$8.757

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Parana Technologies

USA . 1,362 parts In-Stock

1+ parts

$9.196

100+ parts

-

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$9.841

10k+ parts

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1,362

$9.196

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$9.841

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DigiPath Technology Company

USA . 513 parts In-Stock

1+ parts

$10.126

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513

$10.126

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ChromeModa Solutions

Germany . 2,525 parts In-Stock

1+ parts

$10.333

100+ parts

$8.473

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2,525

$10.333

$8.473

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IDEA Electronic Components Group

UK . 445 parts In-Stock

1+ parts

$10.333

100+ parts

$9.816

1k+ parts

$9.300

10k+ parts

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445

$10.333

$9.816

$9.300

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AZTECH Wire

Italy . 662 parts In-Stock

1+ parts

$14.795

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662

$14.795

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Ampacity Inc.

Singapore . 1,569 parts In-Stock

1+ parts

$15.500

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1,569

$15.500

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Semicontronic

India . 1,004 parts In-Stock

1+ parts

$16.500

100+ parts

$16.088

1k+ parts

$16.005

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1,004

$16.500

$16.088

$16.005

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One Stop Electronics

USA . 883 parts In-Stock

1+ parts

$32.500

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883

$32.500

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Argo Parts USA

USA . 4,710 parts In-Stock

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Continental Prestige Electronics

USA . 4,562 parts In-Stock

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4,562

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Corphita

USA . 2,361 parts In-Stock

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2,361

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Modulus Dynamics

Lithuania . 750 parts In-Stock

1+ parts

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750

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Robosynatics

Brazil . 200 parts In-Stock

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200

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Lucentia Tech

USA . 200 parts In-Stock

1+ parts

-

100+ parts

$1.767

1k+ parts

$1.767

10k+ parts

$1.767

200

-

$1.767

$1.767

$1.767

Overview

Unlock seamless connectivity and enhanced functionality with the Texas Instruments XISOUSB211DPR. Crafted with precision and expertise, this innovative product offers unparalleled quality and reliability. Ideal for a wide range of applications in the Other Function Interface ICs category, this device delivers exceptional performance and efficiency. Experience the value and benefits of this cutting-edge interface circuit, designed to elevate your projects to new heights. Trust Texas Instruments for superior technology that empowers you to do more.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product easy to handle and withstands rough handling.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 1.94 V

The high maximum supply voltage ensures reliable and stable operation within the specified limits.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to integrate into various designs and layouts of electronic devices.

No. of Terminals: 28

Having a higher number of terminals allows for more connectivity options and flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch design saves space on the circuit board and allows for compact and efficient layout.

Minimum Operating Temperature: -40 °C

The wide range of operating temperature makes the product suitable for use in extreme environmental conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and performance even under high temperature conditions.

Width: 7.5 mm

Narrow width allows for tighter integration on the circuit board, saving valuable space in electronic designs.

Length: 10.3 mm

Compact length makes the product suitable for smaller electronic devices and space-constrained applications.

Terminal Form: GULL WING

Gull wing terminals provide secure soldering connections and easy handling during assembly.

Nominal Supply Voltage: 1.8 V

Standard nominal supply voltage ensures compatibility with most electronic devices and circuits.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting on the circuit board, enabling more functionality in a compact space.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications, ensuring optimal performance and functionality in communication systems.

Technical Specifications

Other Function Interface ICs XISOUSB211DPR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

also available with 3.3 supply

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

1.94 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

XISOUSB211DPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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