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XISO6742DWR

Texas Instruments

XISO6742DWR by Texas Instruments

XISO6742DWR by Texas Instruments is a small outline interface IC with 16 terminals. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 1.71V to 5.5V, it features nickel palladium gold terminal finish and gull wing form factor for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,590 parts In-Stock

1+ parts

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4,590

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Vyrian

USA . 4,567 parts In-Stock

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4,567

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$5.366

100+ parts

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627

$5.366

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Ampacity Inc.

Singapore . 1,276 parts In-Stock

1+ parts

$5.500

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1,276

$5.500

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Corohmni

South Africa . 340 parts In-Stock

1+ parts

$6.392

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340

$6.392

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Parana Technologies

USA . 2,369 parts In-Stock

1+ parts

$6.499

100+ parts

$603.510

1k+ parts

$5.849

10k+ parts

-

2,369

$6.499

$603.510

$5.849

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DigiPath Technology Company

USA . 2,328 parts In-Stock

1+ parts

$7.156

100+ parts

$6.583

1k+ parts

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2,328

$7.156

$6.583

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ChromeModa Solutions

Germany . 2,923 parts In-Stock

1+ parts

$7.302

100+ parts

$5.988

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2,923

$7.302

$5.988

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IDEA Electronic Components Group

UK . 923 parts In-Stock

1+ parts

$7.302

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$6.572

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923

$7.302

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$6.572

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Advanced Electronics

New Zealand . 261 parts In-Stock

1+ parts

$12.979

100+ parts

$12.330

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$12.330

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261

$12.979

$12.330

$12.330

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One Stop Electronics

USA . 1,229 parts In-Stock

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$28.500

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1,229

$28.500

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Semicontronic

India . 1,157 parts In-Stock

1+ parts

$30.500

100+ parts

$29.738

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$29.585

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1,157

$30.500

$29.738

$29.585

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Continental Prestige Electronics

USA . 6,862 parts In-Stock

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6,862

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Argo Parts USA

USA . 4,798 parts In-Stock

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4,798

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Corphita

USA . 151 parts In-Stock

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151

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Overview

Experience top-notch quality with the XISO6742DWR by Texas Instruments, a leading manufacturer in the industry. This interface IC offers unparalleled value and benefits for various applications, thanks to its reliable performance and innovative design. Whether you're looking to enhance your automotive systems or optimize your industrial processes, this product's advanced features and exceptional durability make it the ideal choice for all your needs. Trust Texas Instruments to deliver excellence with the XISO6742DWR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures the IC can withstand various environmental conditions and handling.

Surface Mount: YES

Facilitates easy and efficient installation on circuit boards.

Maximum Supply Voltage: 5.5 V

Allows for a wide operating range, making it versatile for different applications.

Package Shape: RECTANGULAR

Compact shape that can fit into tight spaces on the PCB.

No. of Terminals: 16

Sufficient number of terminals for a variety of connections and functions.

Package Style (Meter): SMALL OUTLINE

Space-saving design suitable for applications with size constraints.

Minimum Supply Voltage: 1.71 V

Allows for low power operation, enhancing energy efficiency.

Maximum Operating Temperature: 125 °C

High operating temperature range for reliable performance in challenging environments.

Minimum Operating Temperature: -40 °C

Can withstand low temperatures without compromising functionality.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal design for enhanced connectivity and stability.

Maximum Seated Height: 2.65 mm

Low-profile design suitable for compact electronic devices.

Width: 7.5 mm

Narrow width for easy integration into PCB layouts.

Peak Reflow Temperature °C: 260

Can withstand high-temperature reflow processes during assembly.

Length: 10.3 mm

Optimal length for compatibility with standard PCB sizes.

Temperature Grade: AUTOMOTIVE

Meets automotive industry standards for reliability and performance in vehicle applications.

Terminal Form: GULL WING

Gull wing terminals for secure soldering and mechanical stability.

Nominal Supply Voltage: 1.8 V

Stable supply voltage for consistent operation and performance.

Terminal Pitch: 1.27 mm

Optimal terminal spacing for efficient PCB layout and assembly.

Moisture Sensitivity Level (MSL): 2

Meets MSL 2 standard for moisture sensitivity, ensuring reliability during storage and assembly.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing functions, making it ideal for a wide range of applications.

Technical Specifications

Other Function Interface ICs XISO6742DWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

XISO6742DWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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