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TXS0102YZPR

Texas Instruments

TXS0102YZPR by Texas Instruments

TXS0102YZPR by Texas Instruments is a 2-bit interface IC with max supply voltage of 5.5V and min operating temp of -40°C. It is used in industrial applications requiring 3-state output characteristics, with package style including grid array and very thin profile for space-constrained designs.

Median Price

$0.556

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

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Texas Instruments

USA . 20,161 parts In-Stock

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$0.556

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$0.428

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$0.556

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DigiKey

USA . 1,183 parts In-Stock

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$0.900

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$0.513

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$0.457

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$0.407

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Arrow

USA . 39,000 parts In-Stock

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Verical

USA . 2,000 parts In-Stock

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RS (Exports)

UK . 850 parts In-Stock

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$0.597

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$0.572

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Distributors (In-Stock)

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DF Sales Co.

USA . 8,550 parts In-Stock

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$0.280

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DF Sales Co.

USA . 5,550 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Digiode

USA . 894 parts In-Stock

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Chip Stock

USA . 87,060 parts In-Stock

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TME

Poland . 33,000 parts In-Stock

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Bristol Electronics

USA . 15,000 parts In-Stock

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Vyrian

USA . 14,154 parts In-Stock

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Cyclops Electronics Ltd

UK . 8,175 parts In-Stock

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Zilex Electronics Inc.

Canada . 7,100 parts In-Stock

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Microfarads

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ACDS - Activité Composants Distribution Service

France . 5,694 parts In-Stock

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SPM Sales

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Component Sense

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Velocity Electronics

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Semtec, LLC

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Euro-Tech

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Prism Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,320 parts In-Stock

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$0.275

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$0.275

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Semicontronic

India . 14,216 parts In-Stock

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$0.275

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$0.268

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$0.267

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Argo Parts USA

USA . 1,882 parts In-Stock

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$0.444

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$0.431

1,882

$0.444

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Continental Prestige Electronics

USA . 901 parts In-Stock

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$0.444

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$0.435

901

$0.444

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$0.435

Netroflash

USA . 50 parts In-Stock

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$0.457

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$0.434

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$0.425

50

$0.457

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$0.425

Corphita

USA . 2,109 parts In-Stock

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$0.500

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$0.500

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Advanced Electronics

New Zealand . 350 parts In-Stock

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$0.530

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$0.488

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$0.530

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$0.457

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Parana Technologies

USA . 2,026 parts In-Stock

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$8.659

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$9.332

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$8.659

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$9.332

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Corohmni

South Africa . 526 parts In-Stock

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$8.719

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526

$8.719

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DigiPath Technology Company

USA . 2,195 parts In-Stock

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$9.534

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$8.772

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$9.534

$8.772

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IDEA Electronic Components Group

UK . 2,083 parts In-Stock

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$9.729

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$9.243

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$8.756

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2,083

$9.729

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$8.756

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ChromeModa Solutions

Germany . 747 parts In-Stock

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$9.729

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$7.978

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747

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Perfect Parts

USA . 109,729 parts In-Stock

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Infinite Electronics LLP (Excess)

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Formix International (Excess)

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Futuretech Components

Singapore . 20,000 parts In-Stock

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Lixinc

USA . 11,856 parts In-Stock

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GreenTree Electronics

Israel . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,833 parts In-Stock

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Assy Fe

Spain . 7,214 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 6,832 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Glotronic Ltd.

UK . 910 parts In-Stock

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Robosynatics

Brazil . 900 parts In-Stock

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Lucentia Tech

USA . 900 parts In-Stock

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900

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Kepictronics

USA . 667 parts In-Stock

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ChipstoGo Electronic ltd

UK . 265 parts In-Stock

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Authorized Procurement Solutions

USA . 30 parts In-Stock

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Overview

Experience seamless connectivity and enhanced performance with the TXS0102YZPR by Texas Instruments. Recognized for its superior quality and reliability, this interface IC is perfect for a variety of applications in the electronics industry. From ensuring smooth data transmission to optimizing power efficiency, this product offers unmatched value and benefits to customers. Trust Texas Instruments to deliver cutting-edge solutions that meet your needs and exceed your expectations. Elevate your projects with the TXS0102YZPR today.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on PCB boards.

Maximum Supply Voltage: 3.6 V

Supports a wide range of supply voltages, making it versatile for various applications.

Package Shape: RECTANGULAR

Rectangular package shape is commonly used and easy to handle during assembly.

No. of Bits: 2

Provides basic functionality for interfacing and connectivity.

Output Characteristics: 3-STATE

3-STATE output allows for high impedance state when not actively driving a signal, reducing power consumption.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, suitable for industrial applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Provides good conductivity and corrosion resistance for reliable connections.

Width: 0.9 mm

Narrow width saves space on PCB boards, allowing for compact designs.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface functions, ensuring seamless communication between different components.

Technical Specifications

Other Function Interface ICs TXS0102YZPR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-XBGA-B8

JESD-609 Code:

e1

Length:

1.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA8,2X4,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.3,2.5/5

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.01 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

2.3 V

Nominal Supply Voltage-1:

2.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.9 mm

Trade Compliance

TXS0102YZPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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