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ISOUSB211DPR

Texas Instruments

ISOUSB211DPR by Texas Instruments

ISOUSB211DPR by Texas Instruments is a small outline interface IC with 28 terminals. It operates b/w -40 to 125°C and has a supply voltage range of 1.71-1.94V. Ideal for applications requiring dual terminal positions and surface mount compatibility.

Median Price

$11.960

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,498 parts In-Stock

1+ parts

$9.794

100+ parts

$8.555

1k+ parts

$5.900

10k+ parts

-

15,498

$9.794

$8.555

$5.900

-

Mouser Electronics

USA . 6,052 parts In-Stock

1+ parts

$11.960

100+ parts

$7.950

1k+ parts

$7.550

10k+ parts

$6.940

6,052

$11.960

$7.950

$7.550

$6.940

DigiKey

USA . 4,407 parts In-Stock

1+ parts

$13.110

100+ parts

$8.843

1k+ parts

$8.801

10k+ parts

-

4,407

$13.110

$8.843

$8.801

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,253 parts In-Stock

1+ parts

$9.304

100+ parts

-

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1,253

$9.304

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-

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$9.465

100+ parts

-

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500

$9.465

-

-

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Maritex

Poland . 162 parts In-Stock

1+ parts

$16.907

100+ parts

$11.603

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-

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162

$16.907

$11.603

-

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Vyrian

USA . 8,170 parts In-Stock

1+ parts

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8,170

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Chip Stock

USA . 5,160 parts In-Stock

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NexGen Digital

USA . 1,150 parts In-Stock

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1,150

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$3.811

100+ parts

$3.620

1k+ parts

$3.620

10k+ parts

-

40

$3.811

$3.620

$3.620

-

Continental Prestige Electronics

USA . 4,959 parts In-Stock

1+ parts

$7.887

100+ parts

-

1k+ parts

-

10k+ parts

$7.730

4,959

$7.887

-

-

$7.730

Ampacity Inc.

Singapore . 8,159 parts In-Stock

1+ parts

$8.320

100+ parts

-

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8,159

$8.320

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Semicontronic

India . 8,141 parts In-Stock

1+ parts

$8.320

100+ parts

$8.112

1k+ parts

$8.070

10k+ parts

-

8,141

$8.320

$8.112

$8.070

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Corphita

USA . 4,422 parts In-Stock

1+ parts

$8.815

100+ parts

-

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4,422

$8.815

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$9.465

100+ parts

-

1k+ parts

$8.992

10k+ parts

$8.802

1,000

$9.465

-

$8.992

$8.802

QUARKTWIN TECHNOLOGY LTD

USA . 26,821 parts In-Stock

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Modulus Dynamics

Lithuania . 8,523 parts In-Stock

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8,523

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Argo Parts USA

USA . 4,223 parts In-Stock

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GreenTree Electronics

Israel . 3,746 parts In-Stock

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3,746

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iodParts Technologies Inc.

India . 3,735 parts In-Stock

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3,735

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Futuretech Components

Singapore . 2,000 parts In-Stock

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Robosynatics

Brazil . 1,884 parts In-Stock

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1,884

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Lucentia Tech

USA . 1,884 parts In-Stock

1+ parts

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100+ parts

$0.467

1k+ parts

$0.467

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$0.467

1,884

-

$0.467

$0.467

$0.467

Corohmni

South Africa . 184 parts In-Stock

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184

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Overview

Unleash the power of connectivity with the Texas Instruments ISOUSB211DPR! Crafted with precision and excellence, this interface IC offers unparalleled quality and reliability. Whether you're looking to enhance your USB capabilities or streamline your communication systems, this product is your go-to solution. With its innovative design and top-notch performance, the ISOUSB211DPR ensures seamless integration and maximum efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets your every need. Elevate your projects and unlock endless possibilities with the ISOUSB211DPR today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and reducing manufacturing costs.

Maximum Supply Voltage: 1.94 V

Operates within a safe voltage range, reducing the risk of damage to the IC and connected components.

Package Shape: RECTANGULAR

Fits easily into standard PCB layouts, making integration into existing designs straightforward.

No. of Terminals: 28

Provides enough connection points for complex interface requirements, allowing for versatile functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact design saves space on the PCB, ideal for applications where size is a critical factor.

Minimum Supply Voltage: 1.71 V

Allows for operation at low voltage levels, reducing power consumption and heat generation.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

Operates reliably in cold environments, ensuring consistent performance in a wide range of conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Offers flexibility in PCB layout and connection options, allowing for versatile design possibilities.

Maximum Seated Height: 2.65 mm

Low-profile design is suitable for applications with limited vertical space, optimizing component placement.

Width: 7.5 mm

Compact width allows for efficient use of PCB real estate, enabling high-density designs.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand high reflow temperatures for a short duration, simplifying the manufacturing process.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during the soldering process, ensuring reliable solder joints.

Length: 10.3 mm

Compact length allows for space-saving PCB layouts, ideal for designs with limited board space.

Terminal Form: GULL WING

Easy to solder and provides mechanical strength to the connections, ensuring durability in various operating conditions.

Nominal Supply Voltage: 1.8 V

Operates at a standard voltage level, making it compatible with a wide range of power sources.

Terminal Pitch: 0.65 mm

Fine pitch terminals enable high-density PCB designs, allowing for more functionality in a compact form factor.

Moisture Sensitivity Level (MSL): 3

Withstands moderate moisture exposure during storage and handling, ensuring reliability in humid environments.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing with other components or systems, making it a versatile choice for a wide range of applications.

Technical Specifications

Other Function Interface ICs ISOUSB211DPR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

also available with 3.3 supply

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

1.94 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISOUSB211DPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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