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ISOUSB111DWXR

Texas Instruments

ISOUSB111DWXR by Texas Instruments

ISOUSB111DWXR by Texas Instruments is a small outline interface IC with 16 terminals. It operates b/w -40 to 125°C, with supply voltage ranging from 4.25V to 5.25V. Ideal for applications requiring USB interface circuits in compact designs.

Median Price

$7.268

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,318 parts In-Stock

1+ parts

$7.268

100+ parts

$5.925

1k+ parts

$3.950

10k+ parts

-

4,318

$7.268

$5.925

$3.950

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 78 parts In-Stock

1+ parts

$6.420

100+ parts

-

1k+ parts

-

10k+ parts

-

78

$6.420

-

-

-

Digiode

USA . 681 parts In-Stock

1+ parts

$6.905

100+ parts

-

1k+ parts

-

10k+ parts

-

681

$6.905

-

-

-

Vyrian

USA . 1,953 parts In-Stock

1+ parts

-

100+ parts

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1,953

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,879 parts In-Stock

1+ parts

$6.420

100+ parts

-

1k+ parts

-

10k+ parts

$6.292

2,879

$6.420

-

-

$6.292

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$6.420

100+ parts

-

1k+ parts

$6.099

10k+ parts

$5.971

1,000

$6.420

-

$6.099

$5.971

Corphita

USA . 1,986 parts In-Stock

1+ parts

$6.541

100+ parts

-

1k+ parts

-

10k+ parts

-

1,986

$6.541

-

-

-

Ampacity Inc.

Singapore . 1,747 parts In-Stock

1+ parts

$13.450

100+ parts

-

1k+ parts

-

10k+ parts

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1,747

$13.450

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-

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Argo Parts USA

USA . 3,572 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,572

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Corohmni

South Africa . 60 parts In-Stock

1+ parts

-

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60

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Overview

Unlock the power of seamless data transfer with the Texas Instruments ISOUSB111DWXR. Crafted with precision and expertise, this innovative product offers reliability and performance like no other. Whether you're in the automotive industry, consumer electronics, or industrial automation, this interface IC will elevate your applications to new heights. Say goodbye to connectivity issues and hello to efficiency with the ISOUSB111DWXR. Trust Texas Instruments to deliver excellence in every aspect of your project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring long-lasting performance.

Surface Mount: YES

Allows for easy and convenient installation onto PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 5.25 V

Can handle a wide range of supply voltages, making it versatile for different applications.

Minimum Supply Voltage: 4.25 V

Operates efficiently even at lower supply voltages, maximizing energy efficiency.

Maximum Operating Temperature: 125 °C

Withstands high temperatures without compromising performance, ensuring reliability in various environments.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for a wide range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent corrosion resistance and conductivity for reliable connections.

Width: 5.85 mm

Compact size allows for efficient use of space on the PCB.

Length: 7.5 mm

Optimal dimensions for fitting into various electronic devices without taking up too much space.

Nominal Supply Voltage: 5 V

Standard voltage requirement that is commonly available, making it compatible with many power sources.

Technical Specifications

Other Function Interface ICs ISOUSB111DWXR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

7.5 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.6 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.25 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.85 mm

Trade Compliance

ISOUSB111DWXR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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