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ISO1641BDR

Texas Instruments

ISO1641BDR by Texas Instruments

ISO1641BDR by Texas Instruments is an 8-terminal interface IC with a supply voltage range of 2.25V to 5.5V, suitable for automotive applications. It features dual terminal position, Gull Wing form, and operates in temperatures from -40°C to 125°C. The small outline package has a rectangular shape and measures 4.905mm x 3.895mm with a max seated height of 1.75mm.

Median Price

$2.273

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 22,383 parts In-Stock

1+ parts

$2.273

100+ parts

$1.991

1k+ parts

$1.125

10k+ parts

-

22,383

$2.273

$1.991

$1.125

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DigiKey

USA . 18,509 parts In-Stock

1+ parts

$4.140

100+ parts

$2.603

1k+ parts

$2.459

10k+ parts

-

18,509

$4.140

$2.603

$2.459

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Mouser Electronics

USA . 2,036 parts In-Stock

1+ parts

$4.170

100+ parts

$2.610

1k+ parts

$2.300

10k+ parts

$2.250

2,036

$4.170

$2.610

$2.300

$2.250

Arrow

USA . 3,000 parts In-Stock

1+ parts

-

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$1.486

3,000

-

-

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$1.486

Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

-

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$1.419

3,000

-

-

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$1.419

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$1.870

100+ parts

-

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150

$1.870

-

-

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Digiode

USA . 3,932 parts In-Stock

1+ parts

$2.159

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3,932

$2.159

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Vyrian

USA . 6,751 parts In-Stock

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Chip Stock

USA . 4,290 parts In-Stock

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4,290

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Distributors (Availability)

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Ampacity Inc.

Singapore . 7,549 parts In-Stock

1+ parts

$1.210

100+ parts

-

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7,549

$1.210

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-

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Semicontronic

India . 7,546 parts In-Stock

1+ parts

$1.210

100+ parts

$1.180

1k+ parts

$1.174

10k+ parts

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7,546

$1.210

$1.180

$1.174

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Argo Parts USA

USA . 3,797 parts In-Stock

1+ parts

$1.590

100+ parts

-

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3,797

$1.590

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Continental Prestige Electronics

USA . 909 parts In-Stock

1+ parts

$1.590

100+ parts

-

1k+ parts

-

10k+ parts

$1.558

909

$1.590

-

-

$1.558

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$1.870

100+ parts

$1.833

1k+ parts

-

10k+ parts

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1,000

$1.870

$1.833

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Corphita

USA . 4,706 parts In-Stock

1+ parts

$2.046

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4,706

$2.046

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Corohmni

South Africa . 141 parts In-Stock

1+ parts

$2.624

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141

$2.624

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Parana Technologies

USA . 115 parts In-Stock

1+ parts

$8.041

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$8.623

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115

$8.041

-

$8.623

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IDEA Electronic Components Group

UK . 1,803 parts In-Stock

1+ parts

$9.035

100+ parts

$8.583

1k+ parts

$8.132

10k+ parts

-

1,803

$9.035

$8.583

$8.132

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ChromeModa Solutions

Germany . 1,250 parts In-Stock

1+ parts

$9.035

100+ parts

$7.409

1k+ parts

-

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1,250

$9.035

$7.409

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$11.269

100+ parts

$10.706

1k+ parts

$10.706

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1,000

$11.269

$10.706

$10.706

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Lixinc

USA . 11,613 parts In-Stock

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11,613

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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Futuretech Components

Singapore . 1,800 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,768 parts In-Stock

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1,768

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DigiPath Technology Company

USA . 207 parts In-Stock

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100+ parts

$8.146

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207

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$8.146

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Infinite Electronics LLP (Excess)

. 107 parts In-Stock

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107

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Robosynatics

Brazil . 10 parts In-Stock

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10

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Lucentia Tech

USA . 10 parts In-Stock

1+ parts

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100+ parts

$9.239

1k+ parts

$9.239

10k+ parts

$9.239

10

-

$9.239

$9.239

$9.239

Overview

Enhance your next project with the high-quality ISO1641BDR from Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch products like the ISO1641BDR, known for its reliability and performance. This versatile interface IC is perfect for a wide range of applications, offering customers unparalleled value and benefits. Trust Texas Instruments to provide you with the solutions you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components, making the product reliable and long-lasting.

Surface Mount: YES

Surface mount technology allows for easy installation and space-saving on printed circuit boards, increasing efficiency.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing flexibility in various applications.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into existing circuit designs and provides a standard form factor for compatibility.

No. of Terminals: 8

Having 8 terminals allows for multiple connection points, enabling versatile connectivity options for different devices or systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and makes the product suitable for compact electronic devices.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage, this product can operate efficiently even in low-power scenarios, making it energy-efficient.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures stable performance even in demanding environments, increasing the product's reliability.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows this product to function in extreme cold conditions, expanding its range of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish offers excellent conductivity, corrosion resistance, and durability, ensuring reliable connections for the product.

Technical Specifications

Other Function Interface ICs ISO1641BDR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT HAS 2.5 TO 5.5 V AS VCC2 SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO1641BDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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