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ISOUSB111DWR

Texas Instruments

ISOUSB111DWR by Texas Instruments

ISOUSB111DWR by Texas Instruments is a small outline interface IC with 16 terminals. It operates b/w -40 to 125 °C, with supply voltage range of 4.25-5.25 V. Ideal for applications requiring USB interface circuitry in compact designs.

Median Price

$9.050

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,000 parts In-Stock

1+ parts

$7.268

100+ parts

$5.925

1k+ parts

$3.950

10k+ parts

-

8,000

$7.268

$5.925

$3.950

-

DigiKey

USA . 869 parts In-Stock

1+ parts

$9.050

100+ parts

$5.980

1k+ parts

$5.427

10k+ parts

$5.319

869

$9.050

$5.980

$5.427

$5.319

Mouser Electronics

USA . 951 parts In-Stock

1+ parts

$9.320

100+ parts

$6.060

1k+ parts

$6.000

10k+ parts

$4.490

951

$9.320

$6.060

$6.000

$4.490

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$6.420

100+ parts

-

1k+ parts

-

10k+ parts

-

15

$6.420

-

-

-

Digiode

USA . 557 parts In-Stock

1+ parts

$6.905

100+ parts

-

1k+ parts

-

10k+ parts

-

557

$6.905

-

-

-

Vyrian

USA . 2,627 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,627

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 2,920 parts In-Stock

1+ parts

$6.180

100+ parts

$6.026

1k+ parts

$5.995

10k+ parts

-

2,920

$6.180

$6.026

$5.995

-

Ampacity Inc.

Singapore . 2,443 parts In-Stock

1+ parts

$6.180

100+ parts

-

1k+ parts

-

10k+ parts

-

2,443

$6.180

-

-

-

Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$6.292

100+ parts

-

1k+ parts

$6.040

10k+ parts

-

2,000

$6.292

-

$6.040

-

Continental Prestige Electronics

USA . 2,509 parts In-Stock

1+ parts

$6.420

100+ parts

-

1k+ parts

-

10k+ parts

$6.292

2,509

$6.420

-

-

$6.292

Corphita

USA . 2,805 parts In-Stock

1+ parts

$6.541

100+ parts

-

1k+ parts

-

10k+ parts

-

2,805

$6.541

-

-

-

Parana Technologies

USA . 1,637 parts In-Stock

1+ parts

$10.227

100+ parts

-

1k+ parts

$10.763

10k+ parts

-

1,637

$10.227

-

$10.763

-

ChromeModa Solutions

Germany . 1,273 parts In-Stock

1+ parts

$11.491

100+ parts

$9.423

1k+ parts

-

10k+ parts

-

1,273

$11.491

$9.423

-

-

IDEA Electronic Components Group

UK . 381 parts In-Stock

1+ parts

$11.491

100+ parts

$10.916

1k+ parts

$10.342

10k+ parts

-

381

$11.491

$10.916

$10.342

-

Argo Parts USA

USA . 2,400 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,400

-

-

-

-

DigiPath Technology Company

USA . 2,046 parts In-Stock

1+ parts

-

100+ parts

$10.360

1k+ parts

-

10k+ parts

-

2,046

-

$10.360

-

-

Corohmni

South Africa . 101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

101

-

-

-

-

Overview

Enhance your electronic designs with the Texas Instruments ISOUSB111DWR, a high-quality interface IC that promises reliability and performance. Manufactured by a trusted industry leader, this product offers a wide range of applications in the realm of Other Function Interface ICs. With its durable plastic/epoxy package body material and small outline package style, the ISOUSB111DWR ensures seamless integration into various projects. Bring efficiency and innovation to your designs with this cutting-edge product, providing customers with exceptional value and unmatched benefits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the IC, making it a reliable choice for long-term use.

Surface Mount: YES

Surface mounting allows for easy installation on circuit boards, saving space and making assembly more efficient.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage ensures compatibility with a wide range of systems and applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy integration into various designs and layouts.

No. of Terminals: 16

Having 16 terminals provides ample connectivity options, making this IC versatile and adaptable to different requirements.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, allowing for more components to be placed in a compact design.

Minimum Supply Voltage: 4.25 V

The low minimum supply voltage ensures efficient power consumption and compatibility with various voltage sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the IC to perform reliably in a wide range of environments without overheating.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature means the IC can function in cold conditions, making it suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring a reliable connection for the terminals.

Terminal Position: DUAL

Having dual terminal positions offers flexibility in circuit board layout and allows for easy connection to other components.

Maximum Seated Height: 2.65 mm

The low seated height helps in reducing the overall profile of the IC, making it suitable for compact designs.

Width: 7.5 mm

The narrow width of the IC allows for efficient use of space on the circuit board, enabling more components to be placed in a limited area.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time minimizes the risk of damage to the IC during the assembly process, ensuring its reliability.

Peak Reflow Temperature °C: 260

Being able to withstand high peak reflow temperatures enables easy and efficient soldering during the manufacturing process.

Length: 10.3 mm

The compact length of the IC allows for efficient placement on the circuit board, contributing to a streamlined overall design.

Terminal Form: GULL WING

The gull-wing terminal form offers secure connections and easy soldering, making installation hassle-free and reliable.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a standard voltage level, ensuring compatibility with many systems and applications.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting, making the IC suitable for compact designs with a high number of components.

Moisture Sensitivity Level (MSL): 3

The MSL of 3 indicates that the IC is moderately sensitive to moisture, which is a common consideration for reliability in humid environments.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type makes the IC suitable for bridging connections between different components or systems, enhancing its versatility.

Technical Specifications

Other Function Interface ICs ISOUSB111DWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.25 V

Minimum Supply Voltage:

4.25 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISOUSB111DWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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