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XISO6721BDR

Texas Instruments

XISO6721BDR by Texas Instruments

XISO6721BDR by Texas Instruments is an 8-terminal IC with dual terminals, operating b/w -40 to 125 °C. It has a supply voltage range of 1.71V to 5.5V and is designed for automotive applications as an interface circuit in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,170 parts In-Stock

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7,170

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Digiode

USA . 2,449 parts In-Stock

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2,449

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Distributors (Availability)

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Advanced Electronics

New Zealand . 85 parts In-Stock

1+ parts

$7.185

100+ parts

$6.826

1k+ parts

$6.826

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85

$7.185

$6.826

$6.826

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Corohmni

South Africa . 35 parts In-Stock

1+ parts

$8.172

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35

$8.172

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Ampacity Inc.

Singapore . 738 parts In-Stock

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$9.500

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738

$9.500

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Parana Technologies

USA . 298 parts In-Stock

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$11.377

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$11.800

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298

$11.377

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$11.800

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DigiPath Technology Company

USA . 2,188 parts In-Stock

1+ parts

$12.527

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$11.525

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2,188

$12.527

$11.525

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IDEA Electronic Components Group

UK . 2,113 parts In-Stock

1+ parts

$12.783

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$12.144

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$11.505

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2,113

$12.783

$12.144

$11.505

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ChromeModa Solutions

Germany . 1,070 parts In-Stock

1+ parts

$12.783

100+ parts

$10.482

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1,070

$12.783

$10.482

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AZTECH Wire

Italy . 775 parts In-Stock

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$16.985

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775

$16.985

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One Stop Electronics

USA . 400 parts In-Stock

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$26.500

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400

$26.500

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Semicontronic

India . 943 parts In-Stock

1+ parts

$31.500

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$30.712

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$30.555

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943

$31.500

$30.712

$30.555

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Argo Parts USA

USA . 1,457 parts In-Stock

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Continental Prestige Electronics

USA . 1,028 parts In-Stock

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Corphita

USA . 148 parts In-Stock

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148

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Unlock the power of seamless connectivity with the XISO6721BDR by Texas Instruments. Manufactured with precision and quality in mind, this INTERFACE CIRCUIT IC offers unparalleled reliability and performance. Ideal for a wide range of applications, this small outline package delivers exceptional value and benefits to customers looking for a versatile and robust solution. Experience the convenience and efficiency that comes with Texas Instruments' cutting-edge technology in every interaction with the XISO6721BDR.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body material ensures durability and reliability of the product.

Surface Mount: YES

Being surface mountable makes the product versatile and easy to integrate into various electronic systems.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this product is suitable for applications requiring higher voltage levels.

No. of Functions: 2

Having multiple functions in a single IC reduces the need for additional components, saving space and cost.

Package Shape: RECTANGULAR

The rectangular package shape is common and easy to handle during assembly and installation.

No. of Terminals: 8

Having 8 terminals provides enough connectivity options for various interfaces and functions.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact designs.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage allows the product to operate efficiently even at lower power levels.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature makes the product reliable in harsh environments and automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the product can function in a wide range of temperature conditions.

Terminal Position: DUAL

Dual terminal positions provide design flexibility and options for PCB layout.

Maximum Seated Height: 1.75 mm

The low maximum seated height helps in keeping the overall profile of the electronic system compact.

Width: 3.895 mm

The narrow width of the product allows for dense packing and efficient use of PCB space.

Length: 4.905 mm

The compact length of the product contributes to space-saving in electronic designs.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the product can withstand the temperature variations in automotive environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Terminal Form: GULL WING

The gull wing terminal form eases soldering during assembly and provides mechanical strength to the connections.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage is ideal for stable and efficient operation of the product.

Terminal Pitch: 1.27 mm

The standard terminal pitch makes it easy to integrate the product into various PCB designs.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC, this product facilitates communication and data exchange between different electronic components.

Technical Specifications

Other Function Interface ICs XISO6721BDR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRE SUPPLY FROM 2.25V TO 5.5V

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G8

Length:

4.905 mm

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.895 mm

Trade Compliance

XISO6721BDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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