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ISO7742DW

Texas Instruments

ISO7742DW by Texas Instruments

ISO7742DW by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and uses CMOS technology. This interface circuit in a small outline package is ideal for military-grade applications requiring high reliability and dual terminal positions.

Median Price

$3.914

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,428 parts In-Stock

1+ parts

$3.468

100+ parts

$2.864

1k+ parts

$1.548

10k+ parts

-

3,428

$3.468

$2.864

$1.548

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DigiKey

USA . 1,226 parts In-Stock

1+ parts

$4.360

100+ parts

$2.930

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$2.460

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1,226

$4.360

$2.930

$2.460

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Mouser Electronics

USA . 2,089 parts In-Stock

1+ parts

$5.780

100+ parts

$3.810

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$2.400

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$2.280

2,089

$5.780

$3.810

$2.400

$2.280

Arrow

USA . 160 parts In-Stock

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$1.947

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$1.902

160

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$1.947

$1.902

Distributors (In-Stock)

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Nova Conductors

Japan . 450 parts In-Stock

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$2.322

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$2.322

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Digiode

USA . 2,176 parts In-Stock

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$3.295

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2,176

$3.295

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Bristol Electronics

USA . 35 parts In-Stock

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$6.840

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$3.420

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35

$6.840

$3.420

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Chip Stock

USA . 23,900 parts In-Stock

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23,900

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IBS Electronics

USA . 14,108 parts In-Stock

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-

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$7.743

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$2.921

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14,108

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$7.743

$2.921

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Vyrian

USA . 1,580 parts In-Stock

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1,580

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Cyclops Electronics Ltd

UK . 78 parts In-Stock

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78

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Microfarads

USA . 34 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,499 parts In-Stock

1+ parts

$1.650

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$1.650

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Semicontronic

India . 1,472 parts In-Stock

1+ parts

$1.650

100+ parts

$1.609

1k+ parts

$1.600

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1,472

$1.650

$1.609

$1.600

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Continental Prestige Electronics

USA . 3,973 parts In-Stock

1+ parts

$2.320

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$2.274

3,973

$2.320

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$2.274

Argo Parts USA

USA . 1,439 parts In-Stock

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$2.320

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1,439

$2.320

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Bastille Electronics

Australia . 300 parts In-Stock

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$2.322

100+ parts

$2.206

1k+ parts

$2.096

10k+ parts

$2.067

300

$2.322

$2.206

$2.096

$2.067

Corohmni

South Africa . 217 parts In-Stock

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$2.380

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217

$2.380

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Advanced Electronics

New Zealand . 60 parts In-Stock

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$2.451

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$2.329

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$2.329

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60

$2.451

$2.329

$2.329

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Corphita

USA . 4,191 parts In-Stock

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$3.121

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$3.121

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Parana Technologies

USA . 712 parts In-Stock

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$12.395

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$12.834

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$12.395

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ChromeModa Solutions

Germany . 2,753 parts In-Stock

1+ parts

$13.927

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$11.420

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2,753

$13.927

$11.420

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IDEA Electronic Components Group

UK . 1,066 parts In-Stock

1+ parts

$13.927

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$13.231

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$12.534

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1,066

$13.927

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$12.534

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A-Z Elektronik GmbH

Germany . 555 parts In-Stock

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555

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DigiPath Technology Company

USA . 356 parts In-Stock

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$12.557

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356

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Lixinc

USA . 127 parts In-Stock

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Overview

Discover the high-quality and reliable ISO7742DW by Texas Instruments, a cutting-edge Interface IC that offers unparalleled performance and versatility. With its advanced technology and military-grade temperature grade, this product is perfect for a wide range of applications. From industrial automation to automotive electronics, the ISO7742DW provides customers with the assurance of top-notch quality and precision. Experience the benefits of seamless connectivity and efficient functionality with this innovative solution. Choose Texas Instruments for outstanding results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the IC, ensuring a longer lifespan.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly on circuit boards, saving time and space.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this IC can handle a wide range of input voltages, making it versatile for different applications.

No. of Functions: 4

Having multiple functions in one IC reduces the need for additional components, resulting in a more compact and cost-effective design.

Package Shape: RECTANGULAR

The rectangular package shape is a standard form factor, making it compatible with various PCB layouts and designs.

No. of Terminals: 16

More terminals allow for greater connectivity options and flexibility in circuit design.

Package Style: SMALL OUTLINE

The small outline package saves space on the PCB and is ideal for compact electronic devices.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage, this IC can operate efficiently even at lower power levels, helping to conserve energy.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the IC can perform reliably in challenging environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows the IC to function in cold environments without any loss in performance.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold finish provides excellent corrosion resistance and ensures reliable electrical connections.

Terminal Position: DUAL

Dual terminal positions offer flexibility in mounting options and enhance overall connectivity in the circuit.

Maximum Seated Height: 2.65 mm

The low seated height helps to reduce the overall profile of the IC, making it suitable for slim and compact device designs.

Width: 7.5 mm

The compact width of the IC allows for efficient use of space on the PCB and enables dense packing of components.

Maximum Time At Peak Reflow Temperature: 30s

The short time at peak reflow temperature ensures quick and effective soldering during assembly, reducing the risk of thermal damage.

Peak Reflow Temperature: 260C

The high peak reflow temperature allows for reliable soldering of the IC on the PCB, ensuring strong connections.

Length: 10.3 mm

The moderate length of the IC provides a balance between space-saving design and easy handling during assembly.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures that the IC can withstand extreme conditions and operate reliably in harsh environments.

No. of Channels: 4

Multiple channels allow for simultaneous data transmission or processing, increasing the efficiency and versatility of the IC.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and reliable connections, enhancing the overall durability of the IC.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage specifies the standard operating voltage for the IC, ensuring optimal performance and efficiency.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for close spacing of terminals, enabling high-density mounting on the PCB.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface applications, this IC offers reliable communication between different components or systems.

Technical Specifications

Other Function Interface ICs ISO7742DW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7742DW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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