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XISO7041DBQR

Texas Instruments

XISO7041DBQR by Texas Instruments

XISO7041DBQR by Texas Instruments is a 16-terminal interface IC with 4 functions. It operates b/w -40 to 125 °C and supports supply voltage range of 2.25-3.6 V, making it ideal for automotive applications requiring small outline package with gull wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,456 parts In-Stock

1+ parts

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7,456

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Digiode

USA . 4,487 parts In-Stock

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4,487

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Nova Conductors

Japan . 58 parts In-Stock

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58

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,555 parts In-Stock

1+ parts

$1.500

100+ parts

-

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1,555

$1.500

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Corohmni

South Africa . 293 parts In-Stock

1+ parts

$4.591

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293

$4.591

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Semicontronic

India . 371 parts In-Stock

1+ parts

$5.500

100+ parts

$5.362

1k+ parts

$5.335

10k+ parts

-

371

$5.500

$5.362

$5.335

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Advanced Electronics

New Zealand . 69 parts In-Stock

1+ parts

$7.525

100+ parts

$7.149

1k+ parts

$7.149

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69

$7.525

$7.149

$7.149

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Parana Technologies

USA . 1,863 parts In-Stock

1+ parts

$10.505

100+ parts

-

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$11.015

10k+ parts

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1,863

$10.505

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$11.015

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DigiPath Technology Company

USA . 1,689 parts In-Stock

1+ parts

$11.567

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1,689

$11.567

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ChromeModa Solutions

Germany . 5,751 parts In-Stock

1+ parts

$11.803

100+ parts

$9.678

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5,751

$11.803

$9.678

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IDEA Electronic Components Group

UK . 1,757 parts In-Stock

1+ parts

$11.803

100+ parts

$11.213

1k+ parts

$10.623

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1,757

$11.803

$11.213

$10.623

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AZTECH Wire

Italy . 819 parts In-Stock

1+ parts

$17.318

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819

$17.318

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Ampacity Inc.

Singapore . 1,320 parts In-Stock

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$33.500

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1,320

$33.500

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Corphita

USA . 2,473 parts In-Stock

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2,473

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Argo Parts USA

USA . 2,197 parts In-Stock

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Continental Prestige Electronics

USA . 1,105 parts In-Stock

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1,105

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Bastille Electronics

Australia . 1,000 parts In-Stock

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1,000

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

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100+ parts

$1.970

1k+ parts

$1.970

10k+ parts

$1.970

300

-

$1.970

$1.970

$1.970

Overview

Elevate your electronic designs with the Texas Instruments XISO7041DBQR. Crafted with precision by a trusted manufacturer, this interface IC offers unparalleled quality and reliability. Perfect for a variety of applications in the automotive industry and beyond, this versatile product boasts four functions in a compact package. With a wide operating temperature range and low supply voltage requirements, the XISO7041DBQR delivers superior performance while maximizing efficiency. Discover the value and benefits this innovative solution brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight package for the IC, ideal for a wide range of applications.

Surface Mount: YES

Enables easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options, accommodating various voltage requirements.

No. of Functions: 4

Offers multiple functions in a single IC, reducing the need for additional components and simplifying circuit design.

Package Shape: RECTANGULAR

Facilitates easy integration into existing circuit layouts and packaging designs.

No. of Terminals: 16

Provides multiple connection points for interfacing with other components, increasing versatility.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package design saves space on the PCB, important for devices with limited board real estate.

Minimum Supply Voltage: 2.25 V

Allows for operation in low voltage scenarios, enhancing energy efficiency and reducing power consumption.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions, making it suitable for a wide range of environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and improved electrical connection reliability.

Maximum Seated Height: 1.75 mm

Low profile design makes it suitable for applications where space constraints are a concern.

Width: 3.895 mm

Narrow width allows for compact placement on the PCB, optimizing board layout.

Length: 4.905 mm

Compact length makes it suitable for applications where board space is limited.

Temperature Grade: AUTOMOTIVE

Certified for automotive use, ensuring reliability in challenging automotive environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing performance.

Terminal Form: GULL WING

Gull wing terminals provide reliable solder connections, enhancing durability and longevity.

Nominal Supply Voltage: 2.5 V

Stable supply voltage ensures consistent performance under various operating conditions.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density mounting, saving space on the PCB.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface applications, ensuring optimal performance and compatibility.

Technical Specifications

Other Function Interface ICs XISO7041DBQR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

4.905 mm

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

3.895 mm

Trade Compliance

XISO7041DBQR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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