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XISOW7741FDFMR

Texas Instruments

XISOW7741FDFMR by Texas Instruments

XISOW7741FDFMR by Texas Instruments is a small outline interface IC with 4 functions, operating at -40 to 125 °C. It has a supply voltage range of 1.71-1.89 V and is suitable for automotive applications due to its gull wing terminals and compact size (12.83mm x 7.5mm).

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 7,619 parts In-Stock

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7,619

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Digiode

USA . 3,080 parts In-Stock

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3,080

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Advanced Electronics

New Zealand . 49 parts In-Stock

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$5.464

100+ parts

$5.191

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$5.191

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49

$5.464

$5.191

$5.191

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AZTECH Wire

Italy . 379 parts In-Stock

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$7.643

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379

$7.643

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Parana Technologies

USA . 671 parts In-Stock

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$11.645

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$1,081.393

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$10.480

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671

$11.645

$1,081.393

$10.480

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DigiPath Technology Company

USA . 1,115 parts In-Stock

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$12.822

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$12.822

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ChromeModa Solutions

Germany . 4,383 parts In-Stock

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$13.084

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$10.729

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$13.084

$10.729

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IDEA Electronic Components Group

UK . 433 parts In-Stock

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$13.084

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$12.430

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$11.776

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433

$13.084

$12.430

$11.776

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Corohmni

South Africa . 793 parts In-Stock

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$14.981

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793

$14.981

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Semicontronic

India . 718 parts In-Stock

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$32.500

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$31.688

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$31.525

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718

$32.500

$31.688

$31.525

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Ampacity Inc.

Singapore . 458 parts In-Stock

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$36.500

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458

$36.500

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One Stop Electronics

USA . 553 parts In-Stock

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$43.500

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Continental Prestige Electronics

USA . 6,297 parts In-Stock

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Corphita

USA . 2,946 parts In-Stock

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Argo Parts USA

USA . 2,623 parts In-Stock

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2,623

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Modulus Dynamics

Lithuania . 650 parts In-Stock

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650

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Bastille Electronics

Australia . 120 parts In-Stock

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120

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Overview

Unlock the potential of your electronic devices with the XISOW7741FDFMR by Texas Instruments. Crafted with precision and expertise, this high-quality interface IC offers unparalleled performance and reliability in a compact package. Ideal for automotive applications, this innovative product boasts 4 functions and a wide operating temperature range, ensuring seamless integration and optimal functionality. Experience the value and benefits of Texas Instruments technology with the XISOW7741FDFMR, where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material offers good insulation and durability, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy and efficient integration into circuit boards.

Maximum Supply Voltage: 1.89 V

High maximum supply voltage provides flexibility in power input options.

No. of Functions: 4

Having multiple functions in one IC increases convenience and space efficiency in designs.

Package Shape: RECTANGULAR

Rectangular shape is standard and easy to work with in circuit board layouts.

No. of Terminals: 20

Having a higher number of terminals allows for more connectivity options.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and is often preferred in compact electronic designs.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to withstand tough conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures operation in cold environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and flexibility in connection options.

Maximum Seated Height: 3.55 mm

Low seated height allows for a compact overall device profile.

Width: 7.5 mm

Narrow width makes the product suitable for space-constrained applications.

Length: 12.83 mm

Compact length facilitates easy integration into circuit designs.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliability in automotive applications.

Terminal Form: GULL WING

Gull wing terminal form offers secure and reliable solder connections.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 1.27 mm

Standard terminal pitch for ease of PCB layout and assembly.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications, ensuring optimal performance in such scenarios.

Technical Specifications

Other Function Interface ICs XISOW7741FDFMR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G20

Length:

12.83 mm

No. of Functions:

4

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

3.55 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

XISOW7741FDFMR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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