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XISO6742QDWRQ1

Texas Instruments

XISO6742QDWRQ1 by Texas Instruments

XISO6742QDWRQ1 by Texas Instruments is an automotive-grade interface IC with 16 terminals, operating b/w -40 to 125°C. It features a supply voltage range of 1.71V to 5.5V and utilizes CMOS technology. This small outline package IC is ideal for automotive applications requiring high reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,891 parts In-Stock

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2,891

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Digiode

USA . 669 parts In-Stock

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669

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Nova Conductors

Japan . 93 parts In-Stock

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93

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Distributors (Availability)

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AZTECH Wire

Italy . 512 parts In-Stock

1+ parts

$5.337

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512

$5.337

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Parana Technologies

USA . 2,076 parts In-Stock

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$11.934

100+ parts

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$12.339

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2,076

$11.934

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$12.339

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One Stop Electronics

USA . 1,269 parts In-Stock

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$12.500

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1,269

$12.500

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DigiPath Technology Company

USA . 1,985 parts In-Stock

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$13.141

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$12.090

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1,985

$13.141

$12.090

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ChromeModa Solutions

Germany . 5,792 parts In-Stock

1+ parts

$13.409

100+ parts

$10.995

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5,792

$13.409

$10.995

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IDEA Electronic Components Group

UK . 2,080 parts In-Stock

1+ parts

$13.409

100+ parts

$12.739

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$12.068

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2,080

$13.409

$12.739

$12.068

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Ampacity Inc.

Singapore . 568 parts In-Stock

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$13.500

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568

$13.500

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Corohmni

South Africa . 508 parts In-Stock

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$14.588

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508

$14.588

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Semicontronic

India . 1,455 parts In-Stock

1+ parts

$30.500

100+ parts

$29.738

1k+ parts

$29.585

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1,455

$30.500

$29.738

$29.585

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Continental Prestige Electronics

USA . 4,543 parts In-Stock

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Corphita

USA . 3,123 parts In-Stock

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Argo Parts USA

USA . 1,844 parts In-Stock

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Advanced Electronics

New Zealand . 600 parts In-Stock

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600

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Bastille Electronics

Australia . 500 parts In-Stock

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500

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Overview

Enhance your automotive electronic systems with the XISO6742QDWRQ1 by Texas Instruments. This Interface IC offers unparalleled quality and reliability from a trusted manufacturer, making it the perfect solution for a wide range of applications. With a compact design and advanced technology, this product delivers exceptional performance in any environment. Experience the value and benefits that this innovative IC brings to your projects, ensuring smooth operation and seamless integration. Choose Texas Instruments for superior quality and cutting-edge solutions.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and cost-effective, making it a good choice for electronic components.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the IC onto circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage tolerance provides flexibility in power supply design and operation.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality standards for automotive applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for compact and efficient placement on PCBs, optimizing overall board space.

No. of Terminals: 16

Having 16 terminals allows for a variety of input/output connections, providing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space, making it suitable for applications with limited board space.

Minimum Supply Voltage: 1.71 V

Low minimum supply voltage requirement allows for operation in low-power scenarios, helping conserve energy.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Wide range of minimum operating temperature allows for operation in extreme cold environments, enhancing versatility.

Terminal Position: DUAL

Dual terminal position offers redundancy and improved connectivity, enhancing overall system reliability.

Maximum Seated Height: 2.65 mm

Low seated height enables compact PCB design and facilitates space-saving in electronic applications.

Width: 7.5 mm

Narrow width dimensions make the IC suitable for applications with space constraints, providing versatility in design.

Length: 10.3 mm

Compact length dimensions offer flexibility in placement on PCBs, contributing to efficient circuit design.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures reliable performance in automotive applications where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC suitable for various electronic devices.

Terminal Form: GULL WING

Gull wing terminal form provides secure solder connections and ease of installation, ensuring reliable electrical connections.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage provides consistent power delivery, enhancing the overall performance of the IC.

Terminal Pitch: 1.27 mm

Fine terminal pitch spacing allows for compact design and high-density PCB layouts, maximizing board space efficiency.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC, it facilitates communication between different components or subsystems, adding functionality to electronic devices.

Technical Specifications

Other Function Interface ICs XISO6742QDWRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO HAS 2.25 TO 5.5 SUPPLY VOLTAGE 2

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

Length:

10.3 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

XISO6742QDWRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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