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ISO7220CDRG4

Texas Instruments

ISO7220CDRG4 by Texas Instruments

ISO7220CDRG4 by Texas Instruments is an 8-terminal interface IC with a small outline package. It features nickel palladium gold terminal finish, gull wing form, and dual position. Widely used in automotive applications due to its high temperature grade of 260°C peak reflow temperature.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 14,452 parts In-Stock

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14,452

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Vyrian

USA . 6,765 parts In-Stock

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6,765

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Digiode

USA . 4,070 parts In-Stock

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4,070

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$4.046

100+ parts

$3.844

1k+ parts

$3.844

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-

350

$4.046

$3.844

$3.844

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Parana Technologies

USA . 1,840 parts In-Stock

1+ parts

$6.764

100+ parts

$628.140

1k+ parts

$6.088

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-

1,840

$6.764

$628.140

$6.088

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DigiPath Technology Company

USA . 1,560 parts In-Stock

1+ parts

$7.448

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$6.852

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1,560

$7.448

$6.852

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ChromeModa Solutions

Germany . 2,896 parts In-Stock

1+ parts

$7.600

100+ parts

$6.232

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2,896

$7.600

$6.232

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IDEA Electronic Components Group

UK . 749 parts In-Stock

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$7.600

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$6.840

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749

$7.600

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$6.840

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One Stop Electronics

USA . 1,298 parts In-Stock

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$10.500

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1,298

$10.500

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Corohmni

South Africa . 964 parts In-Stock

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$12.715

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964

$12.715

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Ampacity Inc.

Singapore . 419 parts In-Stock

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$16.500

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419

$16.500

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AZTECH Wire

Italy . 856 parts In-Stock

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$17.888

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856

$17.888

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Semicontronic

India . 329 parts In-Stock

1+ parts

$41.500

100+ parts

$40.462

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$40.255

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329

$41.500

$40.462

$40.255

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Continental Prestige Electronics

USA . 3,341 parts In-Stock

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Corphita

USA . 3,151 parts In-Stock

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Argo Parts USA

USA . 1,735 parts In-Stock

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1,735

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Kepictronics

USA . 200 parts In-Stock

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200

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Robosynatics

Brazil . 150 parts In-Stock

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150

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Lucentia Tech

USA . 150 parts In-Stock

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$1.020

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$1.020

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$1.020

150

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$1.020

$1.020

$1.020

iodParts Technologies Inc.

India . 44 parts In-Stock

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44

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Overview

Discover the ISO7220CDRG4 by Texas Instruments, a high-quality interface circuit designed to meet the rigorous standards of automotive applications. With its durable plastic/epoxy package and small outline design, this IC offers reliable performance in a compact form factor. Whether you're looking to enhance communication systems or improve signal integrity, this versatile component delivers exceptional value and benefits. Trust Texas Instruments for cutting-edge technology and innovative solutions that drive success in your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and cost-effective.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying assembly.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, making it versatile for various applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures good conductivity and resistance to corrosion, enhancing the reliability and longevity of the product.

Temperature Grade: AUTOMOTIVE

With an automotive temperature grade, this product is suitable for use in automotive applications where temperature fluctuations are common.

Interface IC Type: INTERFACE CIRCUIT

The product is designed as an interface circuit, making it ideal for connecting different electronic components and systems together.

Technical Specifications

Other Function Interface ICs ISO7220CDRG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

ISO7220CDRG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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