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ISO7220CDG4

Texas Instruments

ISO7220CDG4 by Texas Instruments

ISO7220CDG4 by Texas Instruments is an 8-terminal interface IC in a small outline package. With nickel palladium gold finish, it has a peak reflow temperature of 260°C and is suitable for automotive applications. Its compact size (4.9mm x 3.9mm x 1.75mm) makes it ideal for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,095 parts In-Stock

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2,095

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Digiode

USA . 1,376 parts In-Stock

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1,376

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Nova Conductors

Japan . 59 parts In-Stock

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59

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,096 parts In-Stock

1+ parts

$3.500

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-

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1,096

$3.500

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Corohmni

South Africa . 427 parts In-Stock

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$8.426

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427

$8.426

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Advanced Electronics

New Zealand . 26 parts In-Stock

1+ parts

$8.474

100+ parts

$8.050

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$8.050

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26

$8.474

$8.050

$8.050

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Semicontronic

India . 753 parts In-Stock

1+ parts

$10.500

100+ parts

$10.238

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$10.185

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753

$10.500

$10.238

$10.185

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AZTECH Wire

Italy . 420 parts In-Stock

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$11.374

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420

$11.374

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Parana Technologies

USA . 1,487 parts In-Stock

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$12.014

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$12.422

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1,487

$12.014

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$12.422

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ChromeModa Solutions

Germany . 3,027 parts In-Stock

1+ parts

$13.499

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$11.069

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3,027

$13.499

$11.069

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IDEA Electronic Components Group

UK . 713 parts In-Stock

1+ parts

$13.499

100+ parts

$12.824

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$12.149

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713

$13.499

$12.824

$12.149

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One Stop Electronics

USA . 241 parts In-Stock

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$23.500

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241

$23.500

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Argo Parts USA

USA . 4,871 parts In-Stock

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Corphita

USA . 2,036 parts In-Stock

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2,036

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DigiPath Technology Company

USA . 2,004 parts In-Stock

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$12.171

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2,004

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$12.171

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Continental Prestige Electronics

USA . 477 parts In-Stock

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477

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Discover the cutting-edge technology and superior quality of the ISO7220CDG4 by Texas Instruments, a leading manufacturer in the industry. This innovative product falls under the category of Other Function Interface ICs, offering unparalleled performance and reliability. Ideal for automotive applications, this interface circuit ensures seamless communication and functionality. Experience the value and benefits of Texas Instruments' expertise with the ISO7220CDG4, providing customers with unmatched advantages in their projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and quick installation on circuit boards, saving time and effort during assembly.

No. of Terminals: 8

With 8 terminals, this product provides multiple connection points, increasing flexibility and compatibility with different systems.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish ensures excellent conductivity and corrosion resistance, promoting a reliable and long-lasting connection.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certifies that this product is designed to withstand high temperatures, making it suitable for automotive applications that require reliable performance in challenging environments.

Technical Specifications

Other Function Interface ICs ISO7220CDG4 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

ISO7220CDG4 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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