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PCA9517ADP/DG

NXP Semiconductors

PCA9517ADP/DG by NXP Semiconductors

PCA9517ADP/DG by NXP Semiconductors is an 8-terminal IC with a supply voltage range of 0.9V to 5.5V, suitable for industrial applications. It features a small square package style, CMOS technology, and operates b/w -40°C to 85°C. Ideal for interface circuits requiring a compact design and surface mount capability.

Median Price

$1.313

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 23 parts In-Stock

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$1.313

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23

$1.313

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Chip Stock

USA . 50,800 parts In-Stock

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50,800

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Digiode

USA . 3,859 parts In-Stock

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3,859

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Vyrian

USA . 1,203 parts In-Stock

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1,203

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Anansix

USA . 1,120 parts In-Stock

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1,120

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Microfarads

USA . 21 parts In-Stock

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21

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 300 parts In-Stock

1+ parts

$13.000

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300

$13.000

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AZTECH Wire

Italy . 584 parts In-Stock

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$15.043

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584

$15.043

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Semicontronic

India . 278 parts In-Stock

1+ parts

$20.500

100+ parts

$19.988

1k+ parts

$19.885

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278

$20.500

$19.988

$19.885

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One Stop Electronics

USA . 1,647 parts In-Stock

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$34.500

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1,647

$34.500

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Corohmni

South Africa . 8 parts In-Stock

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$47.991

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8

$47.991

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Ampacity Inc.

Singapore . 1,161 parts In-Stock

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$49.500

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1,161

$49.500

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A-Z Elektronik GmbH

Germany . 6,542 parts In-Stock

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Continental Prestige Electronics

USA . 5,497 parts In-Stock

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UNI Independent Distributors

Spain . 2,303 parts In-Stock

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Corphita

USA . 2,074 parts In-Stock

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2,074

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Kepictronics

USA . 1,217 parts In-Stock

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Argo Parts USA

USA . 684 parts In-Stock

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684

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Robosynatics

Brazil . 300 parts In-Stock

1+ parts

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100+ parts

$3.220

1k+ parts

$3.220

10k+ parts

$3.220

300

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$3.220

$3.220

$3.220

Lixinc

USA . 189 parts In-Stock

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189

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unlock seamless communication and connectivity with the PCA9517ADP/DG by NXP Semiconductors. Known for their top-notch quality and reliable performance, NXP Semiconductors delivers cutting-edge interface ICs that cater to a range of applications. From industrial settings to consumer electronics, this product offers unmatched value and benefits, ensuring smooth operation and enhanced efficiency. Say goodbye to connectivity issues and embrace innovation with the PCA9517ADP/DG.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and cost-effective.

Surface Mount: YES

Surface mount design makes it easy to integrate into PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power supply options.

Package Shape: SQUARE

Square package shape provides a compact form factor for efficient use of board space.

No. of Terminals: 8

Having 8 terminals allows for multiple connection options and versatility in usage.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style enable high-density mounting and improved thermal performance.

Minimum Supply Voltage: 0.9 V

Low minimum supply voltage allows for operation in low-power applications.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in a wide range of environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature makes the product suitable for harsh environmental conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and enhances signal integrity.

Maximum Seated Height: 1.1 mm

Low seated height enables a slim profile for space-constrained applications.

Width: 3 mm

Narrow width allows for efficient use of board space and compact design.

Length: 3 mm

Compact length enhances the product's overall size efficiency.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, suitable for a wide range of applications.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and robust mechanical connection.

Nominal Supply Voltage: 3.3 V

Standard nominal supply voltage of 3.3V is widely compatible with common power sources.

Terminal Pitch: 0.65 mm

Fine terminal pitch allows for high-density mounting and miniaturization of designs.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing functions, making it ideal for various communication and control applications.

Technical Specifications

Other Function Interface ICs PCA9517ADP/DG attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Additional Features:

OPERATES WITH 2.7 V TO 5.5 V

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

Length:

3 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

PCA9517ADP/DG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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