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SN6507DGQRQ1

Texas Instruments

SN6507DGQRQ1 by Texas Instruments

SN6507DGQRQ1 by Texas Instruments is a small outline interface IC with 10 terminals. It operates b/w -55 to 125 °C and supports supply voltages from 3V to 36V. Ideal for automotive applications due to AEC-Q100 screening level and nickel palladium gold terminal finish.

Median Price

$2.600

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 12,997 parts In-Stock

1+ parts

$2.600

100+ parts

$2.278

1k+ parts

$1.287

10k+ parts

-

12,997

$2.600

$2.278

$1.287

-

Mouser Electronics

USA . 4,513 parts In-Stock

1+ parts

$3.740

100+ parts

$2.340

1k+ parts

$2.180

10k+ parts

$2.110

4,513

$3.740

$2.340

$2.180

$2.110

DigiKey

USA . 64 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$2.219

64

-

-

-

$2.219

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 870 parts In-Stock

1+ parts

$1.816

100+ parts

-

1k+ parts

-

10k+ parts

-

870

$1.816

-

-

-

Digiode

USA . 175 parts In-Stock

1+ parts

$2.470

100+ parts

-

1k+ parts

-

10k+ parts

-

175

$2.470

-

-

-

Maritex

Poland . 4 parts In-Stock

1+ parts

$4.998

100+ parts

$3.120

1k+ parts

$2.532

10k+ parts

-

4

$4.998

$3.120

$2.532

-

Vyrian

USA . 6,078 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,078

-

-

-

-

Chip Stock

USA . 3,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,769

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 4,680 parts In-Stock

1+ parts

$1.816

100+ parts

-

1k+ parts

-

10k+ parts

$1.780

4,680

$1.816

-

-

$1.780

Argo Parts USA

USA . 1,019 parts In-Stock

1+ parts

$1.816

100+ parts

-

1k+ parts

-

10k+ parts

-

1,019

$1.816

-

-

-

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.816

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$1.816

-

-

-

Modulus Dynamics

Lithuania . 700 parts In-Stock

1+ parts

$2.016

100+ parts

$1.996

1k+ parts

$1.935

10k+ parts

-

700

$2.016

$1.996

$1.935

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$2.107

100+ parts

$1.938

1k+ parts

$1.816

10k+ parts

-

1,000

$2.107

$1.938

$1.816

-

Semicontronic

India . 6,045 parts In-Stock

1+ parts

$2.210

100+ parts

$2.155

1k+ parts

$2.144

10k+ parts

-

6,045

$2.210

$2.155

$2.144

-

Corphita

USA . 2,735 parts In-Stock

1+ parts

$2.340

100+ parts

-

1k+ parts

-

10k+ parts

-

2,735

$2.340

-

-

-

Corohmni

South Africa . 1,150 parts In-Stock

1+ parts

$2.952

100+ parts

-

1k+ parts

-

10k+ parts

-

1,150

$2.952

-

-

-

Ampacity Inc.

Singapore . 6,166 parts In-Stock

1+ parts

$4.810

100+ parts

-

1k+ parts

-

10k+ parts

-

6,166

$4.810

-

-

-

Microchip USA

USA . 1,887 parts In-Stock

1+ parts

$11.240

100+ parts

$11.170

1k+ parts

$11.130

10k+ parts

$11.100

1,887

$11.240

$11.170

$11.130

$11.100

Robosynatics

Brazil . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

100

-

-

-

-

Overview

Unlock the power of connectivity with the SN6507DGQRQ1 by Texas Instruments. This cutting-edge interface IC offers unparalleled quality and reliability, backed by the trusted name of its manufacturer. Ideal for a wide range of applications, this product provides customers with exceptional value and benefits. Experience seamless integration and enhanced performance with the SN6507DGQRQ1, setting new standards in the world of Other Function Interface ICs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the components inside, making it a reliable choice for long-term use.

Surface Mount: YES

Being surface mountable simplifies the assembly process and allows for a more compact and efficient design.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this IC is suitable for a wide range of applications that require higher power capabilities.

Screening Level: AEC-Q100

This screening level ensures the IC meets stringent automotive industry standards for reliability and performance.

Package Shape: SQUARE

The square shape maximizes space efficiency, making it easy to integrate this IC into various electronic designs.

No. of Terminals: 10

The ample number of terminals provide flexibility for connecting to other components and devices in a circuit.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

This package style offers a compact form factor with efficient heat dissipation, ideal for applications with limited space and high power requirements.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage, this IC can operate in low-power environments, saving energy and reducing costs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in harsh environmental conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature makes this IC suitable for use in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring a reliable connection over time.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and eases the integration into various circuit layouts.

Maximum Seated Height: 1.1 mm

With a low seated height, this IC can be mounted in compact spaces without sacrificing performance.

Width: 3 mm

The narrow width of this IC makes it suitable for applications where space is limited.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for reliable soldering during assembly processes.

Length: 3 mm

The short length of this IC contributes to its compact design and ease of integration into electronic systems.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and provides mechanical stability in various mounting orientations.

Nominal Supply Voltage: 24 V

The nominal supply voltage is suitable for many common electrical systems, offering compatibility with a wide range of applications.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting, making this IC ideal for compact electronic designs.

Moisture Sensitivity Level (MSL): 2

The MSL 2 rating indicates that this IC is less prone to moisture-related damage during storage and handling.

Interface IC Type: INTERFACE CIRCUIT

This IC is specifically designed to facilitate communication between different parts of a circuit, making it a crucial component in many electronic systems.

Technical Specifications

Other Function Interface ICs SN6507DGQRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP10,.20,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

SN6507DGQRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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