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ISO7742FQDWRQ1

Texas Instruments

ISO7742FQDWRQ1 by Texas Instruments

ISO7742FQDWRQ1 by Texas Instruments is a 16-terminal IC with 4 functions, operating at -40 to 125°C. It features a CMOS technology, AEC-Q100 screening level, and automotive-grade temperature rating. With a small outline package style and dual terminal position, it's ideal for interface circuit applications in automotive electronics.

Median Price

$3.680

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 44,749 parts In-Stock

1+ parts

$1.971

100+ parts

$1.628

1k+ parts

$0.880

10k+ parts

-

44,749

$1.971

$1.628

$0.880

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DigiKey

USA . 1,624 parts In-Stock

1+ parts

$3.680

100+ parts

$2.296

1k+ parts

$2.156

10k+ parts

-

1,624

$3.680

$2.296

$2.156

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Mouser Electronics

USA . 1,569 parts In-Stock

1+ parts

$3.680

100+ parts

$2.300

1k+ parts

$2.100

10k+ parts

$1.950

1,569

$3.680

$2.300

$2.100

$1.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,496 parts In-Stock

1+ parts

$1.872

100+ parts

-

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3,496

$1.872

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Vyrian

USA . 16,746 parts In-Stock

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16,746

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ComSIT Distribution GmbH

Germany . 9,750 parts In-Stock

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9,750

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Chip Stock

USA . 5,500 parts In-Stock

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5,500

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Nova Conductors

Japan . 75 parts In-Stock

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75

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 16,721 parts In-Stock

1+ parts

$0.980

100+ parts

$0.956

1k+ parts

$0.951

10k+ parts

-

16,721

$0.980

$0.956

$0.951

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Ampacity Inc.

Singapore . 16,547 parts In-Stock

1+ parts

$0.980

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16,547

$0.980

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Corphita

USA . 2,672 parts In-Stock

1+ parts

$1.774

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2,672

$1.774

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Corohmni

South Africa . 166 parts In-Stock

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$8.140

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166

$8.140

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Parana Technologies

USA . 210 parts In-Stock

1+ parts

$9.247

100+ parts

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$9.884

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210

$9.247

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$9.884

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DigiPath Technology Company

USA . 1,262 parts In-Stock

1+ parts

$10.182

100+ parts

$9.368

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1,262

$10.182

$9.368

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IDEA Electronic Components Group

UK . 1,595 parts In-Stock

1+ parts

$10.390

100+ parts

$9.870

1k+ parts

$9.351

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1,595

$10.390

$9.870

$9.351

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ChromeModa Solutions

Germany . 1,151 parts In-Stock

1+ parts

$10.390

100+ parts

$8.520

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1,151

$10.390

$8.520

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$12.916

100+ parts

$12.270

1k+ parts

$12.270

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500

$12.916

$12.270

$12.270

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Lixinc

USA . 7,695 parts In-Stock

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7,695

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Argo Parts USA

USA . 3,999 parts In-Stock

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3,999

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Continental Prestige Electronics

USA . 3,588 parts In-Stock

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3,588

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Bastille Electronics

Australia . 75 parts In-Stock

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75

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Overview

Elevate your automotive applications with the ISO7742FQDWRQ1 by Texas Instruments, a top-tier manufacturer known for delivering high-quality interface ICs. This versatile product offers customers unmatched value and benefits, with its advanced technology and reliable performance. With 4 functions, small outline package style, and AEC-Q100 screening level, this interface circuit ensures durability and precision in every use. Trust Texas Instruments to provide cutting-edge solutions for your automotive needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good protection for the integrated circuits inside, ensuring reliability and durability.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly onto circuit boards, saving space and reducing production time.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this IC can handle a wide range of power inputs, making it versatile for different applications.

No. of Functions: 4

Having multiple functions in a single IC reduces the need for additional components, simplifying circuit design and saving space on the PCB.

Screening Level: AEC-Q100

This screening level ensures that the IC meets automotive industry standards for quality and reliability, making it suitable for automotive applications.

Package Shape: RECTANGULAR

Rectangular packages are easy to handle and place on circuit boards, making the assembly process more efficient.

No. of Terminals: 16

Having multiple terminals allows for more connections and flexibility in designing custom circuit configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Minimum Supply Voltage: 2.25 V

With a low minimum supply voltage, this IC can operate in low-power applications without needing high voltage inputs.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in harsh environments or under heavy load conditions.

Minimum Operating Temperature: -40 °C

The wide operating temperature range allows the IC to function in both hot and cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides good conductivity and corrosion resistance, ensuring reliable connections over time.

Terminal Position: DUAL

Dual terminal position allows for more stable connections and better heat dissipation, improving overall performance.

Maximum Seated Height: 2.65 mm

The low profile of this IC makes it suitable for applications where space is limited.

Width: 7.5 mm

The compact width of the IC allows for densely populated PCB layouts without sacrificing functionality.

Peak Reflow Temperature °C: 260

This high reflow temperature ensures proper soldering during assembly, reducing the risk of solder joint failure.

Length: 10.3 mm

The moderate length of the IC provides a good balance between functionality and space-saving on the PCB.

Temperature Grade: AUTOMOTIVE

Being automotive-grade means the IC is designed to withstand the harsh conditions and requirements of automotive applications.

No. of Channels: 4

Having multiple channels allows for simultaneous processing of multiple signals or data streams, increasing efficiency.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC suitable for battery-powered or noise-sensitive applications.

Terminal Form: GULL WING

The gull wing terminal form provides good mechanical strength and facilitates easy soldering during assembly.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage ensures stable operation within typical voltage ranges, reducing the risk of overvoltage damage.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for compact IC layouts on the PCB, saving space and enabling high-density designs.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates that the IC is moisture resistant, reducing the risk of moisture-related damage during storage or operation.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different parts of a system, enabling seamless operation.

Technical Specifications

Other Function Interface ICs ISO7742FQDWRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED (VCC2) 2.25-5.5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

ISO7742FQDWRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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