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ISO7021FD

Texas Instruments

ISO7021FD by Texas Instruments

ISO7021FD by Texas Instruments is a CMOS interface IC with 2 channels. It operates b/w -55 to 125 °C and has a supply voltage range of 1.71V to 5.5V, making it suitable for military-grade applications requiring small outline packages and dual terminal positions.

Median Price

$4.260

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,665 parts In-Stock

1+ parts

$2.642

100+ parts

$2.315

1k+ parts

$1.308

10k+ parts

-

1,665

$2.642

$2.315

$1.308

-

DigiKey

USA . 1,515 parts In-Stock

1+ parts

$4.260

100+ parts

$2.729

1k+ parts

$2.456

10k+ parts

$2.321

1,515

$4.260

$2.729

$2.456

$2.321

Mouser Electronics

USA . 17,732 parts In-Stock

1+ parts

$4.310

100+ parts

$2.690

1k+ parts

$2.530

10k+ parts

$2.320

17,732

$4.310

$2.690

$2.530

$2.320

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$2.131

100+ parts

-

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-

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450

$2.131

-

-

-

Digiode

USA . 2,497 parts In-Stock

1+ parts

$2.510

100+ parts

-

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-

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2,497

$2.510

-

-

-

Vyrian

USA . 7,858 parts In-Stock

1+ parts

-

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7,858

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-

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ComSIT Distribution GmbH

Germany . 155 parts In-Stock

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155

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 2,027 parts In-Stock

1+ parts

$2.131

100+ parts

-

1k+ parts

-

10k+ parts

$2.088

2,027

$2.131

-

-

$2.088

Argo Parts USA

USA . 824 parts In-Stock

1+ parts

$2.131

100+ parts

-

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-

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824

$2.131

-

-

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Semicontronic

India . 7,441 parts In-Stock

1+ parts

$2.250

100+ parts

$2.194

1k+ parts

$2.182

10k+ parts

-

7,441

$2.250

$2.194

$2.182

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Ampacity Inc.

Singapore . 7,377 parts In-Stock

1+ parts

$2.250

100+ parts

-

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7,377

$2.250

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Corphita

USA . 4,076 parts In-Stock

1+ parts

$2.378

100+ parts

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4,076

$2.378

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Parana Technologies

USA . 2,174 parts In-Stock

1+ parts

$2.741

100+ parts

-

1k+ parts

$3.225

10k+ parts

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2,174

$2.741

-

$3.225

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DigiPath Technology Company

USA . 1,340 parts In-Stock

1+ parts

$3.018

100+ parts

$2.777

1k+ parts

-

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1,340

$3.018

$2.777

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ChromeModa Solutions

Germany . 3,999 parts In-Stock

1+ parts

$3.080

100+ parts

$2.526

1k+ parts

-

10k+ parts

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3,999

$3.080

$2.526

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IDEA Electronic Components Group

UK . 1,672 parts In-Stock

1+ parts

$3.080

100+ parts

-

1k+ parts

$2.772

10k+ parts

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1,672

$3.080

-

$2.772

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Corohmni

South Africa . 1,066 parts In-Stock

1+ parts

$12.284

100+ parts

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1,066

$12.284

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Advanced Electronics

New Zealand . 54 parts In-Stock

1+ parts

$15.175

100+ parts

$14.416

1k+ parts

$14.416

10k+ parts

-

54

$15.175

$14.416

$14.416

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Lixinc

USA . 12,972 parts In-Stock

1+ parts

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12,972

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Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$2.088

1k+ parts

$2.024

10k+ parts

$1.982

50

-

$2.088

$2.024

$1.982

Overview

Elevate your projects with the top-notch quality and reliability of the Texas Instruments ISO7021FD. Crafted by a renowned manufacturer, this interface IC offers unparalleled performance in a compact package. Perfect for a wide range of applications, this product provides maximum supply voltage of 5.5V and operates flawlessly even in extreme temperatures. With its cutting-edge technology and innovative design, the ISO7021FD ensures seamless integration and superior functionality. Upgrade your systems today and experience the exceptional value and benefits that this product brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material is durable and cost-effective, making the product reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easier and more efficient assembly of electronic components compared to through-hole mounting.

Maximum Supply Voltage: 5.5 V

Higher maximum supply voltage allows for flexibility in power source options, accommodating various applications.

Package Shape: RECTANGULAR

Rectangular shape is common and convenient for PCB layout and integration into electronic systems.

No. of Terminals: 8

Having multiple terminals provides connectivity options for interfacing with other components and peripherals.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the product.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures the product can withstand harsh environmental conditions and operate in extreme temperatures.

Nominal Supply Voltage: 1.8 V

Low nominal supply voltage allows for energy efficiency and compatibility with a wide range of devices.

Terminal Pitch: 1.27 mm

Narrow terminal pitch enables compact design and space-saving integration on PCBs.

Technical Specifications

Other Function Interface ICs ISO7021FD attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7021FD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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