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SN65HVS885PWPR

Texas Instruments

SN65HVS885PWPR by Texas Instruments

SN65HVS885PWPR by Texas Instruments is a small outline interface IC with 28 terminals. It operates in automotive-grade temperatures from -40 to 125°C, with a supply voltage range of 4.5-5.5V. This IC is suitable for various applications requiring a robust and reliable interface circuit in compact electronic systems.

Median Price

$3.985

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 108,152 parts In-Stock

1+ parts

$3.200

100+ parts

$2.804

1k+ parts

$1.584

10k+ parts

-

108,152

$3.200

$2.804

$1.584

-

Mouser Electronics

USA . 1,180 parts In-Stock

1+ parts

$4.770

100+ parts

-

1k+ parts

-

10k+ parts

$2.930

1,180

$4.770

-

-

$2.930

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.584

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1.584

-

-

-

Digiode

USA . 3,468 parts In-Stock

1+ parts

$3.040

100+ parts

-

1k+ parts

-

10k+ parts

-

3,468

$3.040

-

-

-

Vyrian

USA . 54,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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54,643

-

-

-

-

Chip Stock

USA . 9,750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,750

-

-

-

-

Bristol Electronics

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,622 parts In-Stock

1+ parts

$1.584

100+ parts

-

1k+ parts

-

10k+ parts

$1.552

3,622

$1.584

-

-

$1.552

Argo Parts USA

USA . 1,938 parts In-Stock

1+ parts

$1.584

100+ parts

-

1k+ parts

-

10k+ parts

-

1,938

$1.584

-

-

-

Ampacity Inc.

Singapore . 54,835 parts In-Stock

1+ parts

$1.730

100+ parts

-

1k+ parts

-

10k+ parts

-

54,835

$1.730

-

-

-

Corphita

USA . 1,896 parts In-Stock

1+ parts

$2.880

100+ parts

-

1k+ parts

-

10k+ parts

-

1,896

$2.880

-

-

-

iBuyXS LLC

. 4,000 parts In-Stock

1+ parts

$3.000

100+ parts

-

1k+ parts

-

10k+ parts

-

4,000

$3.000

-

-

-

Parana Technologies

USA . 2,355 parts In-Stock

1+ parts

$8.927

100+ parts

-

1k+ parts

$9.598

10k+ parts

-

2,355

$8.927

-

$9.598

-

ChromeModa Solutions

Germany . 5,703 parts In-Stock

1+ parts

$10.030

100+ parts

$8.225

1k+ parts

-

10k+ parts

-

5,703

$10.030

$8.225

-

-

IDEA Electronic Components Group

UK . 1,471 parts In-Stock

1+ parts

$10.030

100+ parts

$9.528

1k+ parts

$9.027

10k+ parts

-

1,471

$10.030

$9.528

$9.027

-

QUARKTWIN TECHNOLOGY LTD

USA . 29,523 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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29,523

-

-

-

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Lixinc

USA . 16,912 parts In-Stock

1+ parts

-

100+ parts

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16,912

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-

-

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BidChips

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.000

10k+ parts

-

4,000

-

-

$3.000

-

DigiPath Technology Company

USA . 1,030 parts In-Stock

1+ parts

-

100+ parts

$9.043

1k+ parts

-

10k+ parts

-

1,030

-

$9.043

-

-

Metaverse IC Inc.

Canada . 365 parts In-Stock

1+ parts

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100+ parts

-

1k+ parts

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10k+ parts

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365

-

-

-

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Netroflash

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$1.552

1k+ parts

$1.505

10k+ parts

$1.473

100

-

$1.552

$1.505

$1.473

Overview

Unlock seamless connectivity with the SN65HVS885PWPR by Texas Instruments. Crafted with precision and expertise, this Interface IC offers unparalleled performance and reliability. Whether in automotive applications or industrial settings, this innovative product ensures optimal functionality and efficiency. Experience the value of cutting-edge technology with Texas Instruments, where quality meets innovation. Elevate your projects with the SN65HVS885PWPR and discover a world of possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, making it versatile and compatible with a wide range of systems.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of space on the PCB and easy integration into existing designs.

No. of Terminals: 28

Having a higher number of terminals provides more connectivity options and flexibility in circuit configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

The small outline, heat sink/slug, thin profile, and shrink pitch design enhances thermal performance and space-saving capabilities.

Minimum Supply Voltage: 4.5 V

Can operate at relatively low supply voltages, making it energy efficient and suitable for battery-powered devices.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely low temperatures, making it suitable for automotive and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The Ni/Pd/Au terminal finish provides excellent conductivity, corrosion resistance, and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position offers redundancy and improves the overall reliability of the connection.

Maximum Seated Height: 1.2 mm

The low seated height allows for compact PCB designs and saves space in tight enclosures.

Width: 4.4 mm

The narrow width makes the product suitable for applications where space is limited, enhancing flexibility in design.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, the product can withstand lead-free soldering processes without damage.

Length: 9.7 mm

The compact length of the product saves space on the PCB and allows for efficient layout designs.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature and reliability, making it ideal for automotive applications.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical stability and ease of soldering during assembly.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V ensures compatibility with standard power sources and ease of integration into existing systems.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for high-density mounting and efficient use of PCB real estate.

Moisture Sensitivity Level (MSL): 2

With an MSL of 2, the product can withstand a limited exposure to moisture during assembly or storage.

Interface IC Type: INTERFACE CIRCUIT

The specified interface circuit type ensures seamless communication between different parts of the system, improving overall performance and reliability.

Technical Specifications

Other Function Interface ICs SN65HVS885PWPR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

SN65HVS885PWPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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