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NCP1090DG

Onsemi

NCP1090DG by Onsemi

INTERFACE CIRCUIT; Terminal Finish: MATTE TIN; JESD-609 Code: e3; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 2; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

$1.141

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 29 parts In-Stock

1+ parts

$1.050

100+ parts

$0.787

1k+ parts

$0.754

10k+ parts

-

29

$1.050

$0.787

$0.754

-

Mouser Electronics

USA . 213 parts In-Stock

1+ parts

$1.930

100+ parts

$1.310

1k+ parts

$0.887

10k+ parts

$0.821

213

$1.930

$1.310

$0.887

$0.821

DigiKey

USA . 161 parts In-Stock

1+ parts

$2.860

100+ parts

$1.232

1k+ parts

$1.112

10k+ parts

-

161

$2.860

$1.232

$1.112

-

Rochester

USA . 13,457 parts In-Stock

1+ parts

-

100+ parts

$1.110

1k+ parts

$0.921

10k+ parts

$0.821

13,457

-

$1.110

$0.921

$0.821

Verical

USA . 7,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.141

10k+ parts

$1.018

7,178

-

-

$1.141

$1.018

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.741

100+ parts

-

1k+ parts

-

10k+ parts

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100

$0.741

-

-

-

Digiode

USA . 445 parts In-Stock

1+ parts

$0.859

100+ parts

-

1k+ parts

-

10k+ parts

-

445

$0.859

-

-

-

Flip Electronics

USA . 13,536 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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13,536

-

-

-

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Vyrian

USA . 4,374 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,374

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 5,648 parts In-Stock

1+ parts

$0.741

100+ parts

-

1k+ parts

-

10k+ parts

$0.726

5,648

$0.741

-

-

$0.726

Argo Parts USA

USA . 4,754 parts In-Stock

1+ parts

$0.741

100+ parts

-

1k+ parts

-

10k+ parts

-

4,754

$0.741

-

-

-

Ampacity Inc.

Singapore . 4,160 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

-

10k+ parts

-

4,160

$0.770

-

-

-

Corphita

USA . 1,747 parts In-Stock

1+ parts

$0.814

100+ parts

-

1k+ parts

-

10k+ parts

-

1,747

$0.814

-

-

-

Corohmni

South Africa . 230 parts In-Stock

1+ parts

$0.904

100+ parts

-

1k+ parts

-

10k+ parts

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230

$0.904

-

-

-

Vigor

Singapore . 198 parts In-Stock

1+ parts

$1.630

100+ parts

-

1k+ parts

-

10k+ parts

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198

$1.630

-

-

-

Aztec Data Supply Inc.

USA . 2,480 parts In-Stock

1+ parts

$7.380

100+ parts

-

1k+ parts

-

10k+ parts

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2,480

$7.380

-

-

-

Microchip USA

USA . 2,536 parts In-Stock

1+ parts

$10.985

100+ parts

-

1k+ parts

-

10k+ parts

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2,536

$10.985

-

-

-

Problanco Electronics

Mexico . 6,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,820

-

-

-

-

Kulean Microsystems

USA . 6,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,525

-

-

-

-

SupplyDigital Components

Austria . 6,046 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,046

-

-

-

-

TANS Electronics

Latvia . 4,959 parts In-Stock

1+ parts

-

100+ parts

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4,959

-

-

-

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Perfect Parts

USA . 1,180 parts In-Stock

1+ parts

-

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1,180

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-

-

-

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.726

1k+ parts

$0.704

10k+ parts

$0.689

1,000

-

$0.726

$0.704

$0.689

UHIMA Technologies

Türkiye . 433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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433

-

-

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Kepictronics

USA . 86 parts In-Stock

1+ parts

-

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10k+ parts

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86

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-

-

-

Technical Specifications

Other Function Interface ICs NCP1090DG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

Peak Reflow Temperature (C):

260

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NCP1090DG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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