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NCP1093MNG

Onsemi

NCP1093MNG by Onsemi

NCP1093MNG by Onsemi is a small outline, heat sink IC with 10 terminals. It operates in industrial temperatures from -40 to 85 °C and has a max supply voltage of 57V. This interface circuit is ideal for applications requiring a surface-mount, low-profile solution.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 587 parts In-Stock

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Vyrian

USA . 504 parts In-Stock

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Netsource Technology, Inc.

USA . 103 parts In-Stock

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Kulean Microsystems

USA . 7,243 parts In-Stock

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TANS Electronics

Latvia . 6,515 parts In-Stock

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SupplyDigital Components

Austria . 4,092 parts In-Stock

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Corphita

USA . 2,139 parts In-Stock

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Problanco Electronics

Mexico . 1,345 parts In-Stock

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UHIMA Technologies

Türkiye . 655 parts In-Stock

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Corohmni

South Africa . 400 parts In-Stock

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Overview

Enhance your electronic designs with the NCP1093MNG by Onsemi. As a trusted manufacturer in the industry, Onsemi ensures top-notch quality and reliability in all their products. This interface IC is versatile and can be used in a wide range of applications. With a maximum supply voltage of 57V and a compact square package style, this product offers unmatched value and convenience to customers. Don't compromise on performance - choose the NCP1093MNG for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and helps in reducing the overall weight of the product.

Surface Mount: YES

Allows for easy installation on PCBs and saves space, making it suitable for compact designs.

Maximum Supply Voltage: 57 V

High maximum supply voltage allows for versatile power input options.

Package Shape: SQUARE

Square package shape facilitates easier placement and alignment on the circuit board.

No. of Terminals: 10

Sufficient number of terminals for connecting various external components and interfaces.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Compact package style with heat sink/slug and thin profile for efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 0 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures functionality even in extreme cold conditions.

Terminal Finish: TIN

Tin terminal finish provides good electrical conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal position for enhanced stability and easy connection to external devices.

Maximum Seated Height: 1 mm

Low seated height for a compact and streamlined design.

Width: 3 mm

Narrow width for compatibility with space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient and reliable soldering during manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature for robust soldering and component bonding.

Length: 3 mm

Compact length for a space-saving design.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance for reliable operation in harsh environments.

Terminal Form: NO LEAD

Lead-free terminal form for compliance with environmental regulations and improved soldering quality.

Terminal Pitch: 0.5 mm

Fine terminal pitch for high-density mounting and connectivity.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, suitable for most assembly processes.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interface circuit applications for efficient signal processing and communication.

Technical Specifications

Other Function Interface ICs NCP1093MNG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

57 V

Minimum Supply Voltage:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NCP1093MNG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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