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NCP1091DBRG

Onsemi

NCP1091DBRG by Onsemi

NCP1091DBRG by Onsemi is an 8-terminal interface IC with a max supply voltage of 57V, suitable for industrial applications. It operates b/w -40 to 85 °C, in a small outline package style ideal for surface mount assembly. The IC features gull wing terminals and a rectangular shape, making it versatile for various other function interface requirements.

Median Price

$0.662

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.617

10k+ parts

-

4,000

-

-

$0.617

-

Rochester

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

$0.708

1k+ parts

$0.588

10k+ parts

$0.524

3,500

-

$0.708

$0.588

$0.524

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,547 parts In-Stock

1+ parts

$0.552

100+ parts

-

1k+ parts

-

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1,547

$0.552

-

-

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Vyrian

USA . 2,837 parts In-Stock

1+ parts

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100+ parts

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2,837

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,385 parts In-Stock

1+ parts

$0.523

100+ parts

-

1k+ parts

-

10k+ parts

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2,385

$0.523

-

-

-

Corohmni

South Africa . 85 parts In-Stock

1+ parts

$0.581

100+ parts

-

1k+ parts

-

10k+ parts

-

85

$0.581

-

-

-

AZTECH Wire

Italy . 137 parts In-Stock

1+ parts

$8.750

100+ parts

-

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137

$8.750

-

-

-

Problanco Electronics

Mexico . 7,689 parts In-Stock

1+ parts

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100+ parts

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7,689

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TANS Electronics

Latvia . 6,868 parts In-Stock

1+ parts

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6,868

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SupplyDigital Components

Austria . 6,009 parts In-Stock

1+ parts

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6,009

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Perfect Parts

USA . 3,519 parts In-Stock

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3,519

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Microchip USA

USA . 1,621 parts In-Stock

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1,621

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UHIMA Technologies

Türkiye . 326 parts In-Stock

1+ parts

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326

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Vigor

Singapore . 239 parts In-Stock

1+ parts

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239

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Kulean Microsystems

USA . 181 parts In-Stock

1+ parts

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181

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Overview

Unlock the power of seamless connectivity with the NCP1091DBRG by Onsemi. Known for their high-quality products, Onsemi has crafted this interface IC to deliver unmatched performance and reliability. Ideal for a variety of applications, this product offers customers unparalleled value and benefits. Enhance your projects with the cutting-edge technology of the NCP1091DBRG, providing ease of use and efficiency like never before. Trust Onsemi to elevate your experience and take your innovations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package lightweight and durable, contributing to the overall reliability of the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly, saving time and labor costs during production.

Maximum Supply Voltage: 57 V

Support for a high maximum supply voltage of 57V enables this product to be used in a wide range of applications that require robust power supply capabilities.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and allows for easier integration into circuit design.

No. of Terminals: 8

With 8 terminals, this product offers flexibility in connectivity options for various external devices or components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact electronic devices.

Minimum Supply Voltage: 0 V

Support for a minimum supply voltage of 0V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C allows the product to withstand harsh environmental conditions and extended operation.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C ensures reliable performance even in cold environments.

Terminal Position: DUAL

Dual terminal position provides redundancy and increased reliability in the connection between the device and external components.

Maximum Seated Height: 1.1 mm

Low maximum seated height of 1.1mm allows for a compact profile, ideal for space-constrained applications.

Width: 3 mm

With a width of 3mm, this product is suitable for applications where space is limited and compact design is essential.

Length: 4.4 mm

Compact length of 4.4mm further enhances the space-saving design of this product.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures reliable performance in demanding industrial environments.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical stability and ease of soldering during assembly.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65mm allows for high-density mounting and compact layout on the PCB.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, this product offers specialized functionality for various communication and control applications.

Technical Specifications

Other Function Interface ICs NCP1091DBRG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

57 V

Minimum Supply Voltage:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

NCP1091DBRG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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