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NCP1092DBRG

Onsemi

NCP1092DBRG by Onsemi

NCP1092DBRG by Onsemi is an 8-terminal interface IC with a max supply voltage of 57V, suitable for industrial applications. It operates b/w -40 to 85 °C and has a small outline package style. With surface mount capability, it's ideal for various electronic systems requiring precise interface circuitry.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,362 parts In-Stock

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Digiode

USA . 178 parts In-Stock

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Vigor

Singapore . 808 parts In-Stock

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$0.730

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808

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AZTECH Wire

Italy . 691 parts In-Stock

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$8.260

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SupplyDigital Components

Austria . 6,432 parts In-Stock

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Kulean Microsystems

USA . 4,354 parts In-Stock

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Corphita

USA . 1,854 parts In-Stock

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Problanco Electronics

Mexico . 1,799 parts In-Stock

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Microchip USA

USA . 1,658 parts In-Stock

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TANS Electronics

Latvia . 908 parts In-Stock

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Corohmni

South Africa . 464 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 32 parts In-Stock

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Overview

Enhance your electronic designs with the NCP1092DBRG by Onsemi, a top-tier manufacturer known for delivering high-quality products that exceed industry standards. This versatile interface IC is designed for a wide range of applications, offering customers unmatched value, reliability, and performance. With its compact package and advanced features, this product provides seamless integration and optimal functionality in various electronic systems. Upgrade your projects with the NCP1092DBRG and experience the benefits of superior engineering and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the IC, ensuring it can withstand various environmental conditions.

Surface Mount: YES

Being surface mountable makes the IC suitable for automated assembly processes, saving time and cost during production.

Maximum Supply Voltage: 57 V

The high maximum supply voltage allows for flexibility in usage scenarios and compatibility with a wide range of power sources.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of board space and easy integration into electronic circuits.

No. of Terminals: 8

Having 8 terminals provides connectivity options and versatility in interfacing the IC with other components or systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style helps in conserving space on the circuit board, making it ideal for compact electronic designs.

Minimum Supply Voltage: 0 V

The minimum supply voltage of 0V ensures compatibility with a wide range of power sources, allowing for flexibility in design and application.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the IC can function reliably in industrial environments with elevated temperatures.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the IC to operate effectively in cold environments without any performance issues.

Terminal Position: DUAL

The dual terminal position provides redundancy and ensures reliable connections, minimizing the risk of signal loss or disconnection.

Maximum Seated Height: 1.1 mm

The low maximum seated height allows for a slim profile, making the IC suitable for applications where space is limited.

Width: 3 mm

The compact width of 3mm enables easy placement on the circuit board and facilitates efficient routing of signals.

Length: 4.4 mm

The compact length of 4.4mm helps in saving space on the board and ensures a neat and organized layout of components.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh environmental conditions typically found in industrial settings.

Terminal Form: GULL WING

The gull wing terminal form is easy to solder, providing a secure and stable connection to the PCB for enhanced reliability.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65mm allows for high-density mounting of the IC on the board, enabling compact and space-efficient designs.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type indicates that the IC is designed specifically for interfacing purposes, ensuring seamless connectivity and communication between different components.

Technical Specifications

Other Function Interface ICs NCP1092DBRG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.4 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

57 V

Minimum Supply Voltage:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

NCP1092DBRG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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