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ISO7763FDBQ

Texas Instruments

ISO7763FDBQ by Texas Instruments

ISO7763FDBQ by Texas Instruments is a 16-terminal IC with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and uses CMOS technology. This small outline interface circuit is ideal for military-grade applications requiring high reliability in harsh environments.

Median Price

$4.400

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 650 parts In-Stock

1+ parts

$3.978

100+ parts

$3.286

1k+ parts

$1.776

10k+ parts

-

650

$3.978

$3.286

$1.776

-

Mouser Electronics

USA . 10,071 parts In-Stock

1+ parts

$4.400

100+ parts

$2.830

1k+ parts

$2.820

10k+ parts

$2.380

10,071

$4.400

$2.830

$2.820

$2.380

DigiKey

USA . 82 parts In-Stock

1+ parts

$4.930

100+ parts

$3.187

1k+ parts

-

10k+ parts

-

82

$4.930

$3.187

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 70 parts In-Stock

1+ parts

$2.664

100+ parts

-

1k+ parts

-

10k+ parts

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70

$2.664

-

-

-

Digiode

USA . 3,126 parts In-Stock

1+ parts

$3.779

100+ parts

-

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-

10k+ parts

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3,126

$3.779

-

-

-

Chip Stock

USA . 27,264 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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27,264

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-

-

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Vyrian

USA . 3,502 parts In-Stock

1+ parts

-

100+ parts

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3,502

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-

-

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Speed Components Ltd

Israel . 190 parts In-Stock

1+ parts

-

100+ parts

-

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190

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 3,256 parts In-Stock

1+ parts

$2.664

100+ parts

-

1k+ parts

-

10k+ parts

$2.611

3,256

$2.664

-

-

$2.611

Netroflash

USA . 500 parts In-Stock

1+ parts

$2.664

100+ parts

-

1k+ parts

-

10k+ parts

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500

$2.664

-

-

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Argo Parts USA

USA . 92 parts In-Stock

1+ parts

$2.664

100+ parts

-

1k+ parts

-

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92

$2.664

-

-

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Corohmni

South Africa . 967 parts In-Stock

1+ parts

$2.842

100+ parts

-

1k+ parts

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10k+ parts

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967

$2.842

-

-

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Ampacity Inc.

Singapore . 3,265 parts In-Stock

1+ parts

$3.380

100+ parts

-

1k+ parts

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10k+ parts

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3,265

$3.380

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-

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Corphita

USA . 4,660 parts In-Stock

1+ parts

$3.580

100+ parts

-

1k+ parts

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10k+ parts

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4,660

$3.580

-

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Parana Technologies

USA . 1,505 parts In-Stock

1+ parts

$6.177

100+ parts

-

1k+ parts

$6.944

10k+ parts

-

1,505

$6.177

-

$6.944

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DigiPath Technology Company

USA . 1,177 parts In-Stock

1+ parts

$6.801

100+ parts

$6.257

1k+ parts

-

10k+ parts

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1,177

$6.801

$6.257

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ChromeModa Solutions

Germany . 6,602 parts In-Stock

1+ parts

$6.940

100+ parts

$5.691

1k+ parts

-

10k+ parts

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6,602

$6.940

$5.691

-

-

IDEA Electronic Components Group

UK . 1,843 parts In-Stock

1+ parts

$6.940

100+ parts

-

1k+ parts

$6.246

10k+ parts

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1,843

$6.940

-

$6.246

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Semicontronic

India . 3,512 parts In-Stock

1+ parts

$7.360

100+ parts

$7.176

1k+ parts

$7.139

10k+ parts

-

3,512

$7.360

$7.176

$7.139

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Lixinc

USA . 5,362 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,362

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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2,000

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Overview

Discover the unparalleled quality and reliability of the Texas Instruments ISO7763FDBQ, a cutting-edge Other Function Interface IC. With a focus on innovation and excellence, Texas Instruments delivers a product that exceeds expectations in a wide range of applications. Offering six functions in a compact package, this interface circuit provides unmatched value and benefits to customers seeking top-tier performance and efficiency. Experience the advantages of Texas Instruments technology with the ISO7763FDBQ.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making it versatile for different applications.

No. of Functions: 6

Offers multiple functions in a single IC, reducing the need for additional components and saving space.

Package Shape: RECTANGULAR

Rectangular package shape is compact and space-saving for efficient PCB layout.

No. of Terminals: 16

Sufficient number of terminals for connectivity and signal transmission within the IC.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for reliable performance in challenging environments.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures functionality in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish offers good corrosion resistance and ensures signal integrity.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB design and layout.

Width: 3.895 mm

Compact width for space-constrained applications.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time minimizes thermal stress on the IC during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature for reliable solder connections.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliability in harsh operating conditions.

No. of Channels: 6

Multiple channels for versatile interface capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy and secure soldering onto PCBs.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage for consistent performance.

Terminal Pitch: 0.635 mm

Optimal terminal pitch for reliable connectivity and signal transmission.

Moisture Sensitivity Level (MSL): 2

Moisture sensitivity level 2 ensures proper handling and storage requirements are met.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, making it suitable for a wide range of applications.

Technical Specifications

Other Function Interface ICs ISO7763FDBQ attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7763FDBQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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