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NCP1094MNG

Onsemi

NCP1094MNG by Onsemi

NCP1094MNG by Onsemi is a surface mount IC with max supply voltage of 57V, suitable for industrial applications. It features small outline package style, dual terminal position, and operates b/w -40 to 85 °C. Ideal for interface circuits requiring compact design and high temperature tolerance.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Chip Stock

USA . 32,000 parts In-Stock

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USA . 7,232 parts In-Stock

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Digiode

USA . 1,045 parts In-Stock

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AZTECH Wire

Italy . 907 parts In-Stock

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SupplyDigital Components

Austria . 6,956 parts In-Stock

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TANS Electronics

Latvia . 4,946 parts In-Stock

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Problanco Electronics

Mexico . 3,917 parts In-Stock

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Kulean Microsystems

USA . 1,827 parts In-Stock

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Corphita

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Corohmni

South Africa . 491 parts In-Stock

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Microchip USA

USA . 361 parts In-Stock

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UHIMA Technologies

Türkiye . 80 parts In-Stock

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Overview

Unlock the potential of your electronic devices with the NCP1094MNG by Onsemi. Known for their high-quality manufacturing, Onsemi delivers reliable products that exceed industry standards. The NCP1094MNG falls under the category of Other Function Interface ICs, offering versatility for a wide range of applications. With a maximum supply voltage of 57V and a small outline package style, this product is perfect for industrial use. Experience seamless connectivity and improved performance with the NCP1094MNG, providing value and benefits that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY package body material provides good durability and resistance to environmental factors, making this product suitable for use in various conditions.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 57 V

High maximum supply voltage of 57V allows for versatile application in systems requiring higher voltage levels.

Minimum Supply Voltage: 0 V

Low minimum supply voltage of 0V ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature of 85 °C ensures reliable performance even in elevated temperature environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40 °C allows for operation in cold temperature conditions without compromising performance.

Width: 3 mm

Compact width of 3mm enables space-saving installation in tight layouts or small enclosures.

Length: 3 mm

Short length of 3mm further enhances the product's space-efficient design, making it suitable for compact applications.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures stable operation in harsh industrial environments where temperature fluctuations are common.

Terminal Pitch: 0.5 mm

Small terminal pitch of 0.5mm allows for high-density mounting on PCBs, ideal for applications where space is limited.

Technical Specifications

Other Function Interface ICs NCP1094MNG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-N10

Length:

3 mm

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

57 V

Minimum Supply Voltage:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3 mm

Trade Compliance

NCP1094MNG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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