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NCP1093MNRG

Onsemi

NCP1093MNRG by Onsemi

NCP1093MNRG by Onsemi is a small outline, heat sink IC with 10 terminals. It operates b/w -40 to 85°C and supports a supply voltage range of 0-57V. Ideal for industrial applications requiring an interface circuit in compact spaces.

Median Price

$1.195

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 808 parts In-Stock

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-

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$1.195

808

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$1.195

Distributors (In-Stock)

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Nova Conductors

Japan . 97 parts In-Stock

1+ parts

$1.070

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97

$1.070

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Chip Stock

USA . 18,490 parts In-Stock

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18,490

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Vyrian

USA . 5,124 parts In-Stock

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Digiode

USA . 2,065 parts In-Stock

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2,065

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Distributors (Availability)

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Argo Parts USA

USA . 4,851 parts In-Stock

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$1.070

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-

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4,851

$1.070

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Netroflash

USA . 1,000 parts In-Stock

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$1.070

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1,000

$1.070

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Continental Prestige Electronics

USA . 768 parts In-Stock

1+ parts

$1.070

100+ parts

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$1.049

768

$1.070

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$1.049

Ampacity Inc.

Singapore . 152 parts In-Stock

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$2.970

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152

$2.970

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Advanced Electronics

New Zealand . 800 parts In-Stock

1+ parts

$4.313

100+ parts

$4.270

1k+ parts

$4.097

10k+ parts

-

800

$4.313

$4.270

$4.097

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AZTECH Wire

Italy . 729 parts In-Stock

1+ parts

$13.685

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729

$13.685

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Microchip USA

USA . 4,784 parts In-Stock

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$14.040

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4,784

$14.040

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RC Electronics

USA . 36,320 parts In-Stock

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Perfect Parts

USA . 31,728 parts In-Stock

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Kepictronics

USA . 7,539 parts In-Stock

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TANS Electronics

Latvia . 7,439 parts In-Stock

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

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Kulean Microsystems

USA . 2,981 parts In-Stock

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Lixinc

USA . 2,231 parts In-Stock

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Corphita

USA . 2,105 parts In-Stock

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Problanco Electronics

Mexico . 1,689 parts In-Stock

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1,689

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SupplyDigital Components

Austria . 1,311 parts In-Stock

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Corohmni

South Africa . 193 parts In-Stock

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UHIMA Technologies

Türkiye . 149 parts In-Stock

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Overview

Discover the innovative NCP1093MNRG by Onsemi, a high-quality interface IC designed to deliver exceptional performance and reliability. With Onsemi's reputation for excellence in manufacturing, this product offers unmatched value and benefits for a wide range of applications. From industrial automation to consumer electronics, the NCP1093MNRG provides a seamless interface solution with its compact design and wide operating temperature range. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the IC, making it long-lasting and resistant to external elements.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 57 V

High maximum supply voltage of 57V ensures compatibility with various power sources, making it versatile for different applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on the circuit board, optimizing layout and design.

No. of Terminals: 10

Having 10 terminals provides ample connection options, allowing for flexibility in circuit design and connectivity.

Minimum Operating Temperature: -40 °C

Wide operating temperature range of -40 to 85°C ensures reliability in extreme environmental conditions, making it suitable for industrial use.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good electrical conductivity and solderability, enhancing the performance and reliability of the IC.

Width: 3 mm

Compact width of 3mm enables space-saving integration in small or crowded PCB layouts, making it ideal for compact electronic devices.

Maximum Time At Peak Reflow Temperature (s): 30

Short peak reflow time of 30 seconds minimizes the risk of thermal damage and ensures safe and efficient soldering during manufacturing process.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C allows for reliable solder joints and ensures durable connections, improving overall product quality.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature rating ensures stable performance and reliability in demanding environments, making it suitable for industrial applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and improves safety during handling and disposal of the IC.

Technical Specifications

Other Function Interface ICs NCP1093MNRG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-N10

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

10

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

57 V

Minimum Supply Voltage:

0 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NCP1093MNRG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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