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ISO7760FDW

Texas Instruments

ISO7760FDW by Texas Instruments

ISO7760FDW by Texas Instruments is a CMOS interface IC with 6 functions, suitable for military-grade applications. It operates b/w -55 to 125 °C and supports a supply voltage range of 2.25-5.5 V. This small outline package has 16 terminals in a rectangular shape, making it ideal for surface mount designs.

Median Price

$4.641

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 48,408 parts In-Stock

1+ parts

$4.641

100+ parts

$3.833

1k+ parts

$2.072

10k+ parts

-

48,408

$4.641

$3.833

$2.072

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Mouser Electronics

USA . 137 parts In-Stock

1+ parts

$5.550

100+ parts

-

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$3.420

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137

$5.550

-

$3.420

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Arrow

USA . 120 parts In-Stock

1+ parts

-

100+ parts

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$3.397

10k+ parts

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120

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$3.397

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$3.108

100+ parts

-

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68

$3.108

-

-

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Digiode

USA . 4,782 parts In-Stock

1+ parts

$4.409

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4,782

$4.409

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Chip Stock

USA . 34,592 parts In-Stock

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34,592

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Vyrian

USA . 4,563 parts In-Stock

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4,563

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Cyclops Electronics Ltd

UK . 194 parts In-Stock

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194

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Distributors (Availability)

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Ampacity Inc.

Singapore . 12,031 parts In-Stock

1+ parts

$2.890

100+ parts

-

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12,031

$2.890

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Bastille Electronics

Australia . 37 parts In-Stock

1+ parts

$3.108

100+ parts

$2.953

1k+ parts

$2.805

10k+ parts

$2.766

37

$3.108

$2.953

$2.805

$2.766

Argo Parts USA

USA . 1,624 parts In-Stock

1+ parts

$3.108

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1,624

$3.108

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Corphita

USA . 4,848 parts In-Stock

1+ parts

$4.177

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4,848

$4.177

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Semicontronic

India . 12,028 parts In-Stock

1+ parts

$6.280

100+ parts

$6.123

1k+ parts

$6.092

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12,028

$6.280

$6.123

$6.092

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Parana Technologies

USA . 973 parts In-Stock

1+ parts

$7.722

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$8.256

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973

$7.722

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$8.256

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DigiPath Technology Company

USA . 2,202 parts In-Stock

1+ parts

$8.502

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$7.822

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2,202

$8.502

$7.822

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IDEA Electronic Components Group

UK . 1,151 parts In-Stock

1+ parts

$8.676

100+ parts

$8.242

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$7.808

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1,151

$8.676

$8.242

$7.808

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ChromeModa Solutions

Germany . 165 parts In-Stock

1+ parts

$8.676

100+ parts

$7.114

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165

$8.676

$7.114

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$11.481

100+ parts

$10.907

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$10.907

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350

$11.481

$10.907

$10.907

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Corohmni

South Africa . 100 parts In-Stock

1+ parts

$13.897

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100

$13.897

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Lixinc

USA . 4,755 parts In-Stock

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4,755

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Overview

Unlock a world of possibilities with the Texas Instruments ISO7760FDW, a top-quality interface IC designed to elevate your projects to new heights. With its advanced technology and military-grade temperature grade, this product offers unrivaled reliability and performance. Ideal for a wide range of applications, this versatile IC boasts six functions and six channels, making it the perfect solution for all your interface circuit needs. Trust in Texas Instruments' reputation for excellence and choose the ISO7760FDW for seamless integration and superior results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Offers durability and protection for the internal components, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient mounting on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Supports a wide range of voltage inputs, providing flexibility in power supply options.

No. of Functions: 6

Offers multiple functions in a single IC, reducing the need for multiple components and simplifying circuit design.

Package Shape: RECTANGULAR

Facilitates easy placement and alignment on the PCB, optimizing space utilization.

No. of Terminals: 16

Provides ample connectivity options for various external components, enhancing versatility.

Package Style (Meter): SMALL OUTLINE

Compact size saves space on the PCB and allows for high-density circuit designs.

Minimum Supply Voltage: 2.25 V

Supports lower voltage operation, making it suitable for a wide range of applications.

Maximum Operating Temperature: 125 °C

Can withstand high operational temperatures, ensuring reliability in challenging environments.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold temperatures, making it suitable for diverse conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Allows for flexible mounting orientations, accommodating different PCB layouts.

Maximum Seated Height: 2.65 mm

Low profile design saves space on the PCB and enables compact device designs.

Width: 7.5 mm

Compact width allows for efficient use of PCB real estate and fits well in space-constrained applications.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during the soldering process, ensuring proper assembly.

Length: 10.3 mm

Optimal length for easy integration into PCB layouts and overall space efficiency.

Temperature Grade: MILITARY

Designed to meet stringent military standards for reliability and performance in harsh environments.

No. of Channels: 6

Multiple channels provide versatility for handling various signals and data streams.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ensuring efficient operation.

Terminal Form: GULL WING

Gull wing terminals provide secure connections and allow for easy soldering during assembly.

Nominal Supply Voltage: 2.5 V

Standard supply voltage for compatibility with common power sources in electronic systems.

Terminal Pitch: 1.27 mm

Optimal pitch spacing for easy routing of traces on the PCB and efficient signal transmission.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates moderate sensitivity to moisture, suitable for standard soldering processes and storage conditions.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface applications, ensuring seamless communication between different components.

Technical Specifications

Other Function Interface ICs ISO7760FDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.5 mm

Trade Compliance

ISO7760FDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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