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XISO7021FDR

Texas Instruments

XISO7021FDR by Texas Instruments

XISO7021FDR by Texas Instruments is an 8-terminal interface IC with a supply voltage range of 1.71V to 1.89V, suitable for military-grade applications. It features CMOS technology, operates b/w -55°C to 125°C, and has a small outline rectangular package style ideal for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,208 parts In-Stock

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8,208

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Digiode

USA . 3,238 parts In-Stock

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3,238

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Distributors (Availability)

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Parana Technologies

USA . 1,731 parts In-Stock

1+ parts

$1.930

100+ parts

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$2.465

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1,731

$1.930

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$2.465

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ChromeModa Solutions

Germany . 4,744 parts In-Stock

1+ parts

$2.168

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$1.778

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4,744

$2.168

$1.778

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IDEA Electronic Components Group

UK . 1,117 parts In-Stock

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$2.168

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$1.951

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1,117

$2.168

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$1.951

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$8.705

100+ parts

$8.269

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$8.269

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2,000

$8.705

$8.269

$8.269

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AZTECH Wire

Italy . 222 parts In-Stock

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$9.801

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222

$9.801

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Corohmni

South Africa . 188 parts In-Stock

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$14.339

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188

$14.339

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One Stop Electronics

USA . 663 parts In-Stock

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$40.500

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663

$40.500

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Semicontronic

India . 591 parts In-Stock

1+ parts

$49.500

100+ parts

$48.262

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$48.015

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591

$49.500

$48.262

$48.015

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Ampacity Inc.

Singapore . 480 parts In-Stock

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$49.500

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480

$49.500

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Continental Prestige Electronics

USA . 6,942 parts In-Stock

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DigiPath Technology Company

USA . 876 parts In-Stock

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$1.955

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876

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$1.955

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Corphita

USA . 667 parts In-Stock

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667

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Bastille Electronics

Australia . 200 parts In-Stock

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200

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Argo Parts USA

USA . 131 parts In-Stock

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131

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Overview

Enhance your electronic systems with the XISO7021FDR by Texas Instruments, a top-quality interface circuit that offers unparalleled performance and reliability. Manufactured by industry leader Texas Instruments, this product is ideal for a wide range of applications. With its small outline package and military-grade temperature rating, this IC provides exceptional value and benefits to customers seeking high-quality components for their projects. Upgrade your designs today with the XISO7021FDR and experience the advantages of superior technology and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy materials are known for their durability and resistance to heat, making this product suitable for various operating conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, enhancing the overall manufacturing process.

Maximum Supply Voltage: 1.89 V

With a high maximum supply voltage, this product can handle higher power requirements without risk of damage.

Package Shape: RECTANGULAR

Rectangular packages are space-efficient and allow for easy integration into existing circuit designs.

Minimum Operating Temperature: -55 °C

The wide temperature range enables this product to operate reliably in harsh environments, making it suitable for industrial applications.

Terminal Position: DUAL

Dual terminal positions provide flexibility in PCB layout and enable efficient signal routing.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Temperature Grade: MILITARY

Military-grade components undergo rigorous testing and meet stringent quality standards, ensuring exceptional performance and reliability.

Technical Specifications

Other Function Interface ICs XISO7021FDR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

Length:

4.905 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

1.89 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.895 mm

Trade Compliance

XISO7021FDR Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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