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XSN6505DQDBVTQ1

Texas Instruments

XSN6505DQDBVTQ1 by Texas Instruments

XSN6505DQDBVTQ1 by Texas Instruments is a small outline, low profile interface IC with 6 terminals. It operates b/w -40 to 125 °C and has a supply voltage range of 2.25-5.5 V, making it ideal for automotive applications requiring AEC-Q100 screening.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,612 parts In-Stock

1+ parts

-

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6,612

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Digiode

USA . 1,961 parts In-Stock

1+ parts

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1,961

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

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50

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 1 parts In-Stock

1+ parts

$6.798

100+ parts

-

1k+ parts

-

10k+ parts

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1

$6.798

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Semicontronic

India . 592 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

10k+ parts

-

592

$7.500

$7.312

$7.275

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$8.840

100+ parts

$8.398

1k+ parts

$8.398

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-

450

$8.840

$8.398

$8.398

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Parana Technologies

USA . 1,311 parts In-Stock

1+ parts

$10.068

100+ parts

-

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$10.620

10k+ parts

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1,311

$10.068

-

$10.620

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One Stop Electronics

USA . 973 parts In-Stock

1+ parts

$10.500

100+ parts

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973

$10.500

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DigiPath Technology Company

USA . 2,357 parts In-Stock

1+ parts

$11.086

100+ parts

$10.199

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2,357

$11.086

$10.199

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ChromeModa Solutions

Germany . 5,160 parts In-Stock

1+ parts

$11.312

100+ parts

$9.276

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-

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5,160

$11.312

$9.276

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IDEA Electronic Components Group

UK . 2,042 parts In-Stock

1+ parts

$11.312

100+ parts

$10.746

1k+ parts

$10.181

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2,042

$11.312

$10.746

$10.181

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AZTECH Wire

Italy . 390 parts In-Stock

1+ parts

$15.104

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390

$15.104

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Ampacity Inc.

Singapore . 158 parts In-Stock

1+ parts

$36.500

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158

$36.500

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Continental Prestige Electronics

USA . 6,268 parts In-Stock

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6,268

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Argo Parts USA

USA . 638 parts In-Stock

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638

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Corphita

USA . 475 parts In-Stock

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475

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Robosynatics

Brazil . 300 parts In-Stock

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300

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Lucentia Tech

USA . 300 parts In-Stock

1+ parts

-

100+ parts

$0.165

1k+ parts

$0.165

10k+ parts

$0.165

300

-

$0.165

$0.165

$0.165

Bastille Electronics

Australia . 75 parts In-Stock

1+ parts

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75

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Overview

Experience seamless integration and superior performance with the XSN6505DQDBVTQ1 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This interface IC is perfect for automotive applications, providing a wide operating temperature range and AEC-Q100 screening level. With its compact design and low profile package style, customers can enjoy easy installation and space-saving benefits. Trust in Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability, making the product suitable for automotive applications.

Surface Mount: YES

Surface mount feature allows for easy installation and saves space on the PCB.

Maximum Supply Voltage: 5.5 V

Suitable for applications requiring higher supply voltages, providing flexibility in design.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and quality, important for automotive electronic components.

Package Shape: RECTANGULAR

Rectangular package shape optimizes space utilization on the PCB and facilitates easy integration.

No. of Terminals: 6

6 terminals provide sufficient connectivity options for the interface circuit.

Minimum Supply Voltage: 2.25 V

Supports operation at low supply voltages, making it efficient and versatile in various applications.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliable performance in harsh environments or automotive settings.

Minimum Operating Temperature: -40 °C

Wide temperature range allows the product to function in extreme cold conditions, suitable for automotive use.

Terminal Position: DUAL

Dual terminal position offers flexibility in PCB layout and connections.

Maximum Seated Height: 1.45 mm

Low profile design saves space and allows for compact device integration.

Width: 1.6 mm

Compact width dimension enables efficient use of PCB real estate.

Length: 2.9 mm

Optimal length size for the package, ensuring compatibility with standard PCB layouts.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications that require high temperature tolerance and reliability.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and robust mechanical connection on the PCB.

Nominal Supply Voltage: 5 V

5 V nominal supply voltage is common in many applications, providing compatibility and ease of integration.

Terminal Pitch: 0.95 mm

Compact terminal pitch allows for high density PCB designs and efficient layout.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications, ensuring optimal performance and functionality.

Technical Specifications

Other Function Interface ICs XSN6505DQDBVTQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Trade Compliance

XSN6505DQDBVTQ1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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