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XSN6505BQDBVTQ1

Texas Instruments

XSN6505BQDBVTQ1 by Texas Instruments

XSN6505BQDBVTQ1 by Texas Instruments is a small outline interface IC with 6 terminals, operating at -40 to 125°C. It has a supply voltage range of 2.25-5.5V and AEC-Q100 screening for automotive applications. The package is rectangular, low profile, with gull wing terminals suitable for surface mount assembly.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,528 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,528

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-

-

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Digiode

USA . 1,596 parts In-Stock

1+ parts

-

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-

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1,596

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

-

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-

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450

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 550 parts In-Stock

1+ parts

$6.086

100+ parts

$5.782

1k+ parts

$5.782

10k+ parts

-

550

$6.086

$5.782

$5.782

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Corohmni

South Africa . 330 parts In-Stock

1+ parts

$6.237

100+ parts

-

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330

$6.237

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-

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Parana Technologies

USA . 332 parts In-Stock

1+ parts

$7.933

100+ parts

-

1k+ parts

$8.493

10k+ parts

-

332

$7.933

-

$8.493

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DigiPath Technology Company

USA . 685 parts In-Stock

1+ parts

$8.735

100+ parts

$8.036

1k+ parts

-

10k+ parts

-

685

$8.735

$8.036

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-

ChromeModa Solutions

Germany . 4,521 parts In-Stock

1+ parts

$8.913

100+ parts

$7.309

1k+ parts

-

10k+ parts

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4,521

$8.913

$7.309

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IDEA Electronic Components Group

UK . 1,649 parts In-Stock

1+ parts

$8.913

100+ parts

$8.467

1k+ parts

$8.022

10k+ parts

-

1,649

$8.913

$8.467

$8.022

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AZTECH Wire

Italy . 479 parts In-Stock

1+ parts

$18.224

100+ parts

-

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479

$18.224

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One Stop Electronics

USA . 1,630 parts In-Stock

1+ parts

$20.500

100+ parts

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10k+ parts

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1,630

$20.500

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Ampacity Inc.

Singapore . 1,154 parts In-Stock

1+ parts

$23.500

100+ parts

-

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10k+ parts

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1,154

$23.500

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-

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Semicontronic

India . 135 parts In-Stock

1+ parts

$35.500

100+ parts

$34.612

1k+ parts

$34.435

10k+ parts

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135

$35.500

$34.612

$34.435

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Continental Prestige Electronics

USA . 6,714 parts In-Stock

1+ parts

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6,714

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Argo Parts USA

USA . 4,718 parts In-Stock

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4,718

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Corphita

USA . 3,911 parts In-Stock

1+ parts

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3,911

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Bastille Electronics

Australia . 550 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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550

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Robosynatics

Brazil . 100 parts In-Stock

1+ parts

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100+ parts

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100

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Lucentia Tech

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$0.056

1k+ parts

$0.056

10k+ parts

$0.056

100

-

$0.056

$0.056

$0.056

Modulus Dynamics

Lithuania . 82 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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82

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-

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Overview

Enhance your automotive electronic systems with the XSN6505BQDBVTQ1 by Texas Instruments. Manufactured with top-quality materials and designed for reliability, this interface circuit IC offers superior performance in a compact package. Perfect for automotive applications, this product provides a wide supply voltage range and operates seamlessly in extreme temperatures. Trust Texas Instruments to deliver cutting-edge solutions that bring value and efficiency to your projects. Upgrade your designs today with the XSN6505BQDBVTQ1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the integrated circuit, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage inputs, suitable for a wide range of applications without risk of damage.

Screening Level: AEC-Q100

Meets automotive industry standards for reliability and performance, ensuring it can withstand harsh operating conditions.

Package Shape: RECTANGULAR

Compact shape makes it easy to integrate into different electronic devices, saving space and allowing for versatile design options.

No. of Terminals: 6

Provides sufficient connection points for interfacing with other components, enhancing functionality and versatility.

Package Style (Meter): SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Compact size and low profile design allow for easy integration into space-constrained applications, while shrink pitch enables high-density mounting.

Minimum Supply Voltage: 2.25 V

Can operate at low voltage levels, ideal for energy-efficient and battery-powered devices.

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures without performance degradation, suitable for automotive and industrial environments.

Minimum Operating Temperature: -40 °C

Can operate in cold temperatures without issues, making it suitable for a wide range of operating conditions.

Terminal Position: DUAL

Dual terminal position provides redundancy and ensures reliable connections for enhanced performance and stability.

Maximum Seated Height: 1.45 mm

Low height profile allows for compact and streamlined design, suitable for applications with limited vertical space.

Width: 1.6 mm

Compact width enables easy integration into various electronic devices and circuit layouts, enhancing design flexibility.

Length: 2.9 mm

Optimal length for fitting into different electronic assemblies, providing a balanced form factor for versatile applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature tolerance and performance, ensuring reliability in automotive applications.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections, ensuring robust electrical connections for stable operation.

Nominal Supply Voltage: 5 V

Stable supply voltage for consistent performance, suitable for a wide range of electronic devices and applications.

Terminal Pitch: 0.95 mm

Close terminal pitch allows for high-density mounting, making it suitable for compact and miniaturized electronic devices.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, providing connectivity and communication between various components for seamless operation.

Technical Specifications

Other Function Interface ICs XSN6505BQDBVTQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G6

Length:

2.9 mm

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Screening Level:

AEC-Q100

Maximum Seated Height:

1.45 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.95 mm

Terminal Position:

DUAL

Width:

1.6 mm

Trade Compliance

XSN6505BQDBVTQ1 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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