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VNI8200XP

STMicroelectronics

VNI8200XP by STMicroelectronics

VNI8200XP by STMicroelectronics is a 36V interface IC with 8-bit driver, 0.7A output current, and -40 to 125 °C operating temp. Ideal for automotive applications, it features a small outline package with gull wing terminals and matte tin finish.

Median Price

$5.222

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 1,225 parts In-Stock

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1,225

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Arrow

USA . 1,225 parts In-Stock

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-

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$5.213

1,225

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$5.213

Verical

USA . 1,225 parts In-Stock

1+ parts

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$5.230

1,225

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$5.230

Distributors (In-Stock)

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Digiode

USA . 2,213 parts In-Stock

1+ parts

$6.441

100+ parts

-

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2,213

$6.441

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Nova Conductors

Japan . 300 parts In-Stock

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$7.980

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300

$7.980

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Chip Stock

USA . 3,500 parts In-Stock

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3,500

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Anansix

USA . 2,242 parts In-Stock

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2,242

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Vyrian

USA . 1,070 parts In-Stock

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1,070

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ComSIT Distribution GmbH

Germany . 49 parts In-Stock

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49

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 863 parts In-Stock

1+ parts

$5.760

100+ parts

-

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863

$5.760

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Semicontronic

India . 736 parts In-Stock

1+ parts

$5.760

100+ parts

$5.616

1k+ parts

$5.587

10k+ parts

-

736

$5.760

$5.616

$5.587

-

Corphita

USA . 4,004 parts In-Stock

1+ parts

$6.102

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4,004

$6.102

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

1+ parts

$7.153

100+ parts

$6.796

1k+ parts

$6.796

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-

2,000

$7.153

$6.796

$6.796

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Continental Prestige Electronics

USA . 4,646 parts In-Stock

1+ parts

$7.980

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$7.820

4,646

$7.980

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$7.820

IDEA Electronic Components Group

UK . 1,254 parts In-Stock

1+ parts

$8.664

100+ parts

-

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$7.797

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1,254

$8.664

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$7.797

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Aztec Data Supply Inc.

USA . 1,784 parts In-Stock

1+ parts

$9.940

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1,784

$9.940

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Corohmni

South Africa . 201 parts In-Stock

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$11.380

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201

$11.380

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MKK Technologies

India . 1,105 parts In-Stock

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$16.291

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1,105

$16.291

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DigiPath Technology Company

USA . 1,105 parts In-Stock

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$16.291

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1,105

$16.291

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Microchip USA

USA . 2,067 parts In-Stock

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$35.196

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2,067

$35.196

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Lixinc

USA . 16,470 parts In-Stock

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16,470

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Futuretech Components

Singapore . 7,865 parts In-Stock

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Perfect Parts

USA . 3,512 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 2,197 parts In-Stock

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$10.359

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2,197

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$10.359

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Argo Parts USA

USA . 299 parts In-Stock

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299

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Overview

Experience the power and reliability of the VNI8200XP by STMicroelectronics. Crafted with precision and quality, this innovative product offers seamless integration and superior performance in various applications. From automotive to industrial settings, this interface circuit provides unmatched value and benefits to customers. Trust in the expertise of STMicroelectronics to deliver cutting-edge solutions that exceed expectations. Elevate your projects with the VNI8200XP and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material is lightweight and durable, making the product easy to handle and resistant to damage.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the circuit board.

Maximum Supply Voltage: 36 V

With a high maximum supply voltage, this product is suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of board space and easy alignment during assembly.

Power Supplies (V): 10.5/36

The wide range of power supply options allows for flexibility in different operating conditions.

No. of Terminals: 36

Having a large number of terminals enables connectivity with multiple components, enhancing functionality.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style ensures efficient heat dissipation and a compact design, ideal for space-constrained applications.

Minimum Supply Voltage: 10.5 V

The low minimum supply voltage allows for operation in low-power situations, increasing energy efficiency.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand demanding thermal conditions.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliable performance in extreme environments.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides good solderability and corrosion resistance, enhancing the product's lifespan.

Terminal Position: DUAL

Dual terminal positions allow for multiple connection options, increasing versatility in circuit design.

Maximum Seated Height: 2.47 mm

The low seated height saves space and allows for compact designs in electronic systems.

Width: 7.5 mm

The narrow width of the product facilitates integration into tight spaces on the circuit board.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time reduces the risk of thermal damage during the manufacturing process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature enables efficient soldering and ensures strong joints.

Length: 10.3 mm

The compact length of the product contributes to a space-saving design in electronic assemblies.

Temperature Grade: AUTOMOTIVE

The automotive-grade temperature rating ensures reliable performance in automotive applications subjected to harsh conditions.

Maximum Output Current: 0.7 A

The high maximum output current capability supports applications requiring power delivery to connected components.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical support and secure solder connections.

Nominal Supply Voltage: 24 V

The nominal supply voltage of 24V aligns with standard power requirements in many electronic systems.

Terminal Pitch: 0.5 mm

The fine terminal pitch allows for high-density mounting on the circuit board, maximizing space efficiency.

Driver No. of Bits: 8

The 8-bit driver configuration provides sufficient resolution and control for various interface circuit applications.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, the product can withstand moderate exposure to moisture during storage and assembly.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type enables communication and interaction between different components in electronic systems.

Technical Specifications

Other Function Interface ICs VNI8200XP attributes and parameters. Explore more Other Function Interface ICs devices from STMicroelectronics

Specs

Driver No. of Bits:

8

Interface IC Type:

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.7 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.4,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

10.5/36

Qualification:

Not Qualified

Maximum Seated Height:

2.47 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

36 V

Minimum Supply Voltage:

10.5 V

Nominal Supply Voltage:

24 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

VNI8200XP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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