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PCA9600DP

NXP Semiconductors

PCA9600DP by NXP Semiconductors

PCA9600DP by NXP Semiconductors is a small outline, thin profile interface IC with 8 terminals. It operates at a supply voltage range of 2.5V to 15V and has a max supply current of 7.3mA. This bus buffer is commonly used in industrial applications for signal amplification and level shifting.

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Cyclops Electronics Ltd

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Prism Electronics

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Nova Conductors

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500

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Component Sense

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$3.792

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Corohmni

South Africa . 962 parts In-Stock

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AZTECH Wire

Italy . 511 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,049 parts In-Stock

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Ampacity Inc.

Singapore . 1,430 parts In-Stock

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One Stop Electronics

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Semicontronic

India . 934 parts In-Stock

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Overview

Discover the PCA9600DP, a game-changing product by NXP Semiconductors! As a leading manufacturer in the industry, NXP delivers exceptional quality and reliability. The PCA9600DP falls under the category of Other Function Interface ICs, opening up a world of possibilities for seamless connectivity. This innovative device offers unrivaled value, boasting benefits such as easy installation, efficient power supply management, and enhanced performance. With its compact design and robust features, the PCA9600DP is perfect for various applications. Experience the advantage of NXP Semiconductors and unlock new levels of efficiency and connectivity with the PCA9600DP.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to external elements, making it a reliable choice for various application environments.

Surface Mount: YES

The surface mount feature allows for easy and convenient installation, enhancing space utilization and enabling efficient PCB design.

Maximum Supply Voltage: 15 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, making it suitable for diverse circuit requirements.

No. of Functions: 1

Despite its compact size, this product offers a single powerful function, providing a cost-effective solution for specific application needs.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on the PCB, ensuring ease of integration and minimizing interference with adjacent components.

Power Supplies (V): 2.5/15

This product supports a wide range of power supply voltages, allowing for flexibility in various operating scenarios and ensuring compatibility with diverse systems.

No. of Terminals: 8

With eight terminals, this product provides sufficient connectivity options for seamless integration into the system, offering versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style contribute to space-saving designs while maintaining optimal performance, making it ideal for compact applications.

Minimum Supply Voltage: 2.5 V

The low minimum supply voltage requirement allows for operation in power-constrained environments and ensures compatibility with low-power systems, expanding its range of applications.

Maximum Operating Temperature: 85 °C

This product can withstand high operating temperatures, enhancing its reliability and suitability for industrial applications with demanding temperature conditions.

Minimum Operating Temperature: -40 °C

With a wide temperature range, this product is suitable for both extreme cold and hot environments, making it a reliable choice in diverse operating conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The nickel/palladium/gold terminal finish provides excellent conductivity, corrosion resistance, and durability, ensuring reliable and long-lasting connections.

Terminal Position: DUAL

The dual-terminal position allows for more flexible PCB layout and compatibility with various system designs, enhancing integration options and ease of use.

Maximum Seated Height: 1.1 mm

The compact maximum seated height of only 1.1 mm enables the use of this product in space-constrained applications while maintaining optimal performance.

Width: 3 mm

With a narrow width, this product offers efficient space utilization on the PCB, enabling versatile and compact designs.

Maximum Time At Peak Reflow Temperature (s): 30

This product can withstand a peak reflow temperature for up to 30 seconds, ensuring reliable soldering during the manufacturing process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring excellent solder joint quality and reliability.

Length: 3 mm

The compact length of 3 mm contributes to space-saving designs, enabling flexible PCB layouts and efficient use of available board space.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this product meets the temperature and reliability requirements demanded by harsh operating environments, making it a suitable choice for industrial automation and control systems.

Terminal Form: GULL WING

The gull-wing terminal form offers easy and reliable soldering, ensuring secure connections and simplifying the assembly process.

Maximum Supply Current: 7.3 mA

With a maximum supply current of 7.3 mA, this product operates with low power consumption, making it energy-efficient and suitable for battery-powered devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5 V ensures compatibility with standard voltage levels, enhancing integration possibilities and making it readily compatible with many systems.

Terminal Pitch: 0.65 mm

With a tight terminal pitch of 0.65 mm, this product supports high-density circuit designs, enabling efficient use of available board space and allowing for intricate system layouts.

Moisture Sensitivity Level (MSL): 1

This product has a moisture sensitivity level of 1, indicating that it is safe for standard reflow soldering processes, ensuring reliable and moisture-free operation.

Interface IC Type: BUS BUFFERS

This product belongs to the category of bus buffers, providing essential signal buffering and driving capabilities for reliable and efficient data transmission between various subsystems and components.

Technical Specifications

Other Function Interface ICs PCA9600DP attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

Other Interface ICs

Maximum Supply Current:

7.3 mA

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

PCA9600DP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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