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FOD8332V

Onsemi

FOD8332V by Onsemi

INTERFACE CIRCUIT; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30;

Median Price

$4.690

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 928 parts In-Stock

1+ parts

$6.230

100+ parts

$3.430

1k+ parts

$3.100

10k+ parts

-

928

$6.230

$3.430

$3.100

-

DigiKey

USA . 5,317 parts In-Stock

1+ parts

$8.480

100+ parts

$5.282

1k+ parts

$5.036

10k+ parts

-

5,317

$8.480

$5.282

$5.036

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Flip Electronics (Authorized)

USA . 6,680 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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6,680

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Rochester

USA . 2,719 parts In-Stock

1+ parts

-

100+ parts

$2.810

1k+ parts

$2.520

10k+ parts

$2.370

2,719

-

$2.810

$2.520

$2.370

Verical

USA . 2,719 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.150

10k+ parts

-

2,719

-

-

$3.150

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,088 parts In-Stock

1+ parts

$2.974

100+ parts

-

1k+ parts

-

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2,088

$2.974

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-

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Nova Conductors

Japan . 90 parts In-Stock

1+ parts

$4.453

100+ parts

-

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90

$4.453

-

-

-

Chip Stock

USA . 28,000 parts In-Stock

1+ parts

-

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28,000

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Flip Electronics

USA . 6,680 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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6,680

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Vyrian

USA . 3,558 parts In-Stock

1+ parts

-

100+ parts

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3,558

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DigiKey Marketplace

USA . 2,719 parts In-Stock

1+ parts

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100+ parts

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2,719

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,825 parts In-Stock

1+ parts

$2.660

100+ parts

-

1k+ parts

-

10k+ parts

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3,825

$2.660

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-

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Semicontronic

India . 3,463 parts In-Stock

1+ parts

$2.660

100+ parts

$2.594

1k+ parts

$2.580

10k+ parts

-

3,463

$2.660

$2.594

$2.580

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Corphita

USA . 566 parts In-Stock

1+ parts

$2.817

100+ parts

-

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566

$2.817

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-

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Corohmni

South Africa . 82 parts In-Stock

1+ parts

$3.130

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82

$3.130

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Aranea Global

USA . 2,000 parts In-Stock

1+ parts

$4.364

100+ parts

-

1k+ parts

$4.189

10k+ parts

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2,000

$4.364

-

$4.189

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Argo Parts USA

USA . 3,592 parts In-Stock

1+ parts

$4.453

100+ parts

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10k+ parts

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3,592

$4.453

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-

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Continental Prestige Electronics

USA . 1,036 parts In-Stock

1+ parts

$4.453

100+ parts

-

1k+ parts

-

10k+ parts

$4.364

1,036

$4.453

-

-

$4.364

Aztec Data Supply Inc.

USA . 4,360 parts In-Stock

1+ parts

$10.226

100+ parts

-

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10k+ parts

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4,360

$10.226

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iodParts Technologies Inc.

India . 7,016 parts In-Stock

1+ parts

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7,016

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SupplyDigital Components

Austria . 6,513 parts In-Stock

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6,513

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Kulean Microsystems

USA . 5,777 parts In-Stock

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5,777

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Problanco Electronics

Mexico . 4,958 parts In-Stock

1+ parts

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4,958

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TANS Electronics

Latvia . 4,291 parts In-Stock

1+ parts

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4,291

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Supply Digital

USA . 1,490 parts In-Stock

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1,490

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UHIMA Technologies

Türkiye . 411 parts In-Stock

1+ parts

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411

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Technical Specifications

Other Function Interface ICs FOD8332V attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FOD8332V Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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