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FOD8333V

Onsemi

FOD8333V by Onsemi

INTERFACE CIRCUIT; Terminal Finish: MATTE TIN; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 1; Maximum Time At Peak Reflow Temperature (s): 30; JESD-609 Code: e3;

Median Price

$4.525

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,215 parts In-Stock

1+ parts

$6.250

100+ parts

$3.170

1k+ parts

$2.940

10k+ parts

-

1,215

$6.250

$3.170

$2.940

-

Rochester

USA . 1,250 parts In-Stock

1+ parts

-

100+ parts

$2.800

1k+ parts

$2.510

10k+ parts

$2.360

1,250

-

$2.800

$2.510

$2.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.506

100+ parts

-

1k+ parts

-

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10

$4.506

-

-

-

Digiode

USA . 1,834 parts In-Stock

1+ parts

$6.555

100+ parts

-

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10k+ parts

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1,834

$6.555

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-

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Vyrian

USA . 842 parts In-Stock

1+ parts

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842

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$4.416

100+ parts

-

1k+ parts

$4.239

10k+ parts

-

1,000

$4.416

-

$4.239

-

Continental Prestige Electronics

USA . 4,620 parts In-Stock

1+ parts

$4.506

100+ parts

-

1k+ parts

-

10k+ parts

$4.416

4,620

$4.506

-

-

$4.416

Argo Parts USA

USA . 2,744 parts In-Stock

1+ parts

$4.506

100+ parts

-

1k+ parts

-

10k+ parts

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2,744

$4.506

-

-

-

Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$5.224

100+ parts

$4.806

1k+ parts

$4.503

10k+ parts

-

40

$5.224

$4.806

$4.503

-

Semicontronic

India . 752 parts In-Stock

1+ parts

$5.300

100+ parts

$5.168

1k+ parts

$5.141

10k+ parts

-

752

$5.300

$5.168

$5.141

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Corphita

USA . 1,608 parts In-Stock

1+ parts

$6.210

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-

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1,608

$6.210

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-

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Corohmni

South Africa . 405 parts In-Stock

1+ parts

$6.900

100+ parts

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405

$6.900

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-

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Aztec Data Supply Inc.

USA . 4,390 parts In-Stock

1+ parts

$7.450

100+ parts

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4,390

$7.450

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-

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Ampacity Inc.

Singapore . 1,161 parts In-Stock

1+ parts

$11.530

100+ parts

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1,161

$11.530

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QUARKTWIN TECHNOLOGY LTD

USA . 12,918 parts In-Stock

1+ parts

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12,918

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TANS Electronics

Latvia . 5,445 parts In-Stock

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5,445

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SupplyDigital Components

Austria . 3,846 parts In-Stock

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3,846

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-

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Problanco Electronics

Mexico . 3,062 parts In-Stock

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3,062

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-

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Kulean Microsystems

USA . 2,217 parts In-Stock

1+ parts

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2,217

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-

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Supply Digital

USA . 1,230 parts In-Stock

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1,230

-

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iodParts Technologies Inc.

India . 750 parts In-Stock

1+ parts

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750

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UHIMA Technologies

Türkiye . 705 parts In-Stock

1+ parts

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705

-

-

-

-

Technical Specifications

Other Function Interface ICs FOD8333V attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FOD8333V Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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