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ISO7742FDBQ

Texas Instruments

ISO7742FDBQ by Texas Instruments

ISO7742FDBQ by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -55 to 125°C. It features a supply voltage range of 2.25-5.5V and CMOS technology, suitable for military-grade applications requiring interface circuitry in compact spaces. The package style is small outline with shrink pitch, making it ideal for surface mount designs.

Median Price

$3.630

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 27,378 parts In-Stock

1+ parts

$3.037

100+ parts

$2.509

1k+ parts

$1.356

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27,378

$3.037

$2.509

$1.356

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Mouser Electronics

USA . 1,362 parts In-Stock

1+ parts

$3.630

100+ parts

$2.530

1k+ parts

$1.940

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$1.800

1,362

$3.630

$2.530

$1.940

$1.800

DigiKey

USA . 79 parts In-Stock

1+ parts

$3.880

100+ parts

$2.471

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-

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79

$3.880

$2.471

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Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.034

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10

$2.034

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Digiode

USA . 2,774 parts In-Stock

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$2.885

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2,774

$2.885

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Vyrian

USA . 9,993 parts In-Stock

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9,993

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Chip Stock

USA . 4,300 parts In-Stock

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4,300

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Distributors (Availability)

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Continental Prestige Electronics

USA . 1,772 parts In-Stock

1+ parts

$2.034

100+ parts

-

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-

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$1.993

1,772

$2.034

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-

$1.993

Argo Parts USA

USA . 506 parts In-Stock

1+ parts

$2.034

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-

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506

$2.034

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Netroflash

USA . 50 parts In-Stock

1+ parts

$2.034

100+ parts

$1.993

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50

$2.034

$1.993

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Ampacity Inc.

Singapore . 9,587 parts In-Stock

1+ parts

$2.580

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9,587

$2.580

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Corphita

USA . 2,224 parts In-Stock

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$2.733

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$2.733

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$3.054

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$2.901

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$2.901

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1,000

$3.054

$2.901

$2.901

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Semicontronic

India . 9,966 parts In-Stock

1+ parts

$5.620

100+ parts

$5.480

1k+ parts

$5.451

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9,966

$5.620

$5.480

$5.451

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Corohmni

South Africa . 1,063 parts In-Stock

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$10.541

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$10.541

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Parana Technologies

USA . 687 parts In-Stock

1+ parts

$12.336

100+ parts

$1,145.612

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$11.103

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687

$12.336

$1,145.612

$11.103

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DigiPath Technology Company

USA . 1,462 parts In-Stock

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$13.584

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1,462

$13.584

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ChromeModa Solutions

Germany . 3,028 parts In-Stock

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$13.861

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$11.366

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3,028

$13.861

$11.366

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IDEA Electronic Components Group

UK . 1,091 parts In-Stock

1+ parts

$13.861

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$13.168

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$12.475

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1,091

$13.861

$13.168

$12.475

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Lixinc

USA . 17,527 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,380 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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Perfect Parts

USA . 532 parts In-Stock

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532

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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350

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Overview

Experience the superior quality and reliability of Texas Instruments with the ISO7742FDBQ interface IC. This versatile component offers four functions in a compact package, making it ideal for a wide range of applications. With a wide supply voltage range and military-grade temperature tolerance, this IC is built to perform in even the most demanding environments. Trust Texas Instruments for cutting-edge technology and unmatched value in every product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and protection for the integrated circuits inside.

Surface Mount: YES

Surface mount technology allows for efficient and compact mounting of the IC, making it suitable for space-constrained applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage of 5.5V, this IC can handle varying power supply conditions without any risk of damage.

No. of Functions: 4

Having multiple functions in a single IC reduces the need for additional components, saving space and cost in the overall system design.

Package Shape: RECTANGULAR

The rectangular package shape offers compatibility with standard PCB layouts, simplifying the integration process.

No. of Terminals: 16

Having a higher number of terminals allows for more connections and functionalities to be supported, enhancing versatility.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage requirement of 2.25V enables operation in power-constrained environments while maintaining performance.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance even in extreme temperature conditions.

Minimum Operating Temperature: -55 °C

The wide operating temperature range from -55°C to 125°C makes this IC suitable for use in various environments with varying temperatures.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel, palladium, and gold finishes on the terminals provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: DUAL

Dual terminal positions offer flexibility in PCB layout and enable multiple connection options for seamless integration.

Maximum Seated Height: 1.75 mm

The low maximum seated height of 1.75mm allows for a compact form factor, ideal for applications with limited vertical space.

Width: 3.895 mm

The small width of 3.895mm contributes to the overall compact size of the IC, making it suitable for densely populated PCB designs.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C ensures secure soldering during the manufacturing process for reliable connections.

Length: 4.905 mm

The short length of 4.905mm further adds to the compactness of the IC, enabling it to fit into tight spaces within the system.

Temperature Grade: MILITARY

The military-grade temperature rating signifies the IC's ruggedness and reliability in harsh operating conditions, making it suitable for demanding applications.

No. of Channels: 4

Having four channels allows for multiple data streams or functions to be processed simultaneously, increasing the efficiency of the IC.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the IC energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull-wing terminal form provides mechanical strength and ease of soldering during assembly, ensuring robust connections on the PCB.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage of 2.5V indicates the recommended operating voltage for optimal performance and efficiency.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm offers high-density mounting capability, suitable for applications requiring compact PCB layouts.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the IC is moisture-resistant and can withstand standard reflow soldering processes without degradation.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different components in a system, enabling seamless data exchange and control.

Technical Specifications

Other Function Interface ICs ISO7742FDBQ attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.895 mm

Trade Compliance

ISO7742FDBQ Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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