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ISO7741FDBQR

Texas Instruments

ISO7741FDBQR by Texas Instruments

ISO7741FDBQR by Texas Instruments is a 16-terminal IC with 4 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and uses CMOS technology. Ideal for military-grade applications requiring interface circuitry in compact spaces.

Median Price

$2.149

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 25,297 parts In-Stock

1+ parts

$1.608

100+ parts

$1.328

1k+ parts

$0.718

10k+ parts

-

25,297

$1.608

$1.328

$0.718

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DigiKey

USA . 3,316 parts In-Stock

1+ parts

$2.690

100+ parts

$1.645

1k+ parts

$1.519

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-

3,316

$2.690

$1.645

$1.519

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Mouser Electronics

USA . 101 parts In-Stock

1+ parts

$2.690

100+ parts

$1.650

1k+ parts

$1.450

10k+ parts

$1.380

101

$2.690

$1.650

$1.450

$1.380

Arrow

USA . 75,000 parts In-Stock

1+ parts

-

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$1.088

75,000

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$1.088

Distributors (In-Stock)

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Digiode

USA . 4,175 parts In-Stock

1+ parts

$1.528

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-

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4,175

$1.528

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Nova Conductors

Japan . 900 parts In-Stock

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$1.695

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900

$1.695

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Vyrian

USA . 26,635 parts In-Stock

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26,635

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Chip Stock

USA . 10,880 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,626 parts In-Stock

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1,626

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Inventory MP

USA . 96 parts In-Stock

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96

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Bristol Electronics

USA . 96 parts In-Stock

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96

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Distributors (Availability)

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Ampacity Inc.

Singapore . 26,628 parts In-Stock

1+ parts

$0.920

100+ parts

-

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26,628

$0.920

-

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Semicontronic

India . 26,143 parts In-Stock

1+ parts

$0.920

100+ parts

$0.897

1k+ parts

$0.892

10k+ parts

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26,143

$0.920

$0.897

$0.892

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Corphita

USA . 2,333 parts In-Stock

1+ parts

$1.447

100+ parts

-

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2,333

$1.447

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Argo Parts USA

USA . 2,577 parts In-Stock

1+ parts

$1.695

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2,577

$1.695

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Continental Prestige Electronics

USA . 1,581 parts In-Stock

1+ parts

$1.695

100+ parts

-

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$1.661

1,581

$1.695

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-

$1.661

Netroflash

USA . 500 parts In-Stock

1+ parts

$1.695

100+ parts

-

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$1.610

10k+ parts

$1.576

500

$1.695

-

$1.610

$1.576

Parana Technologies

USA . 2,002 parts In-Stock

1+ parts

$2.930

100+ parts

-

1k+ parts

$3.429

10k+ parts

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2,002

$2.930

-

$3.429

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DigiPath Technology Company

USA . 1,667 parts In-Stock

1+ parts

$3.226

100+ parts

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1,667

$3.226

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ChromeModa Solutions

Germany . 6,317 parts In-Stock

1+ parts

$3.292

100+ parts

$2.699

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6,317

$3.292

$2.699

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IDEA Electronic Components Group

UK . 435 parts In-Stock

1+ parts

$3.292

100+ parts

-

1k+ parts

$2.963

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435

$3.292

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$2.963

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Corohmni

South Africa . 737 parts In-Stock

1+ parts

$11.899

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737

$11.899

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Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$12.587

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$11.957

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$11.957

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150

$12.587

$11.957

$11.957

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Lixinc

USA . 14,945 parts In-Stock

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Alle Elektronik GmbH

Germany . 7,595 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,142 parts In-Stock

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Robosynatics

Brazil . 450 parts In-Stock

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450

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Lucentia Tech

USA . 450 parts In-Stock

1+ parts

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$7.550

1k+ parts

$7.550

10k+ parts

$7.550

450

-

$7.550

$7.550

$7.550

GreenTree Electronics

Israel . 50 parts In-Stock

1+ parts

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50

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Overview

Discover the superior quality and reliability of the Texas Instruments ISO7741FDBQR, a cutting-edge Other Function Interface IC designed to excel in a variety of applications. With a focus on innovation and excellence, Texas Instruments delivers a product that offers unmatched value and benefits to customers. Whether you're looking for enhanced performance, durability, or functionality, this versatile IC has you covered. Trust in Texas Instruments to provide the solutions you need for success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is lightweight and durable, making the product suitable for various applications.

Surface Mount: YES

Surface mount technology helps to save space on the PCB and enables automated assembly, improving efficiency.

Maximum Supply Voltage: 5.5 V

High maximum supply voltage allows for flexibility in the power input, accommodating a wide range of voltage levels.

No. of Functions: 4

Having multiple functions in a single IC provides versatility and can simplify circuit design.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and facilitates easy PCB layout.

No. of Terminals: 16

Having a sufficient number of terminals allows for connectivity to other components and peripherals.

Package Style: SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style helps in reducing PCB footprint and enhances the overall compactness of the design.

Minimum Supply Voltage: 2.25 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

High maximum operating temperature indicates the IC's ability to withstand harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the IC to function reliably even in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel, palladium, and gold terminal finish provides excellent conductivity and corrosion resistance for reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting and connection options.

Maximum Seated Height: 1.75 mm

Low seated height helps in maintaining a compact overall product design.

Width: 3.895 mm

Narrow width enables dense packing of components on the PCB.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures reliable soldering during assembly processes.

Length: 4.905 mm

Short length contributes to space-saving and compact product design.

Temperature Grade: MILITARY

Military-grade temperature tolerance makes the IC suitable for rugged and demanding environments.

No. of Channels: 4

Multiple channels provide versatility in signal processing and interfacing capabilities.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient performance.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and PCB mounting.

Nominal Supply Voltage: 2.5 V

Stable nominal supply voltage ensures consistent performance under varying load conditions.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density mounting and miniaturization of the PCB.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates moderate moisture sensitivity, suitable for standard production environments.

Interface IC Type: INTERFACE CIRCUIT

Specialized interface circuit type ensures seamless communication between different components in the system.

Technical Specifications

Other Function Interface ICs ISO7741FDBQR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

4

No. of Functions:

4

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.895 mm

Trade Compliance

ISO7741FDBQR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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