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ISO7731DWR

Texas Instruments

ISO7731DWR by Texas Instruments

ISO7731DWR by Texas Instruments is a 16-terminal IC with 3 functions, operating at -55 to 125°C. It has a supply voltage range of 2.25V to 5.5V and uses CMOS technology. Ideal for military-grade applications requiring small outline packages and interface circuits with high reliability.

Median Price

$2.720

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 51,748 parts In-Stock

1+ parts

$1.765

100+ parts

$1.458

1k+ parts

$0.788

10k+ parts

-

51,748

$1.765

$1.458

$0.788

-

Chip1Stop

Japan . 1,924 parts In-Stock

1+ parts

$2.720

100+ parts

$1.650

1k+ parts

$1.400

10k+ parts

$1.320

1,924

$2.720

$1.650

$1.400

$1.320

Mouser Electronics

USA . 2,095 parts In-Stock

1+ parts

$3.180

100+ parts

$1.970

1k+ parts

$1.790

10k+ parts

$1.660

2,095

$3.180

$1.970

$1.790

$1.660

DigiKey

USA . 2,009 parts In-Stock

1+ parts

$3.180

100+ parts

$1.965

1k+ parts

$1.831

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-

2,009

$3.180

$1.965

$1.831

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Verical

USA . 1,924 parts In-Stock

1+ parts

-

100+ parts

$1.506

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$1.391

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1,924

-

$1.506

$1.391

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.620

100+ parts

-

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500

$1.620

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Digiode

USA . 2,081 parts In-Stock

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$1.677

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2,081

$1.677

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Vyrian

USA . 14,532 parts In-Stock

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14,532

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Chip Stock

USA . 10,550 parts In-Stock

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10,550

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Elcom Components

USA . 4,011 parts In-Stock

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4,011

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LIBRA Elektronik GmbH

Germany . 32 parts In-Stock

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32

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Distributors (Availability)

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Ampacity Inc.

Singapore . 14,151 parts In-Stock

1+ parts

$1.500

100+ parts

-

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14,151

$1.500

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Semicontronic

India . 13,985 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

10k+ parts

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13,985

$1.500

$1.462

$1.455

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Corphita

USA . 2,638 parts In-Stock

1+ parts

$1.588

100+ parts

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2,638

$1.588

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Continental Prestige Electronics

USA . 4,319 parts In-Stock

1+ parts

$1.620

100+ parts

-

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$1.588

4,319

$1.620

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-

$1.588

Argo Parts USA

USA . 1,423 parts In-Stock

1+ parts

$1.620

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1,423

$1.620

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Netroflash

USA . 50 parts In-Stock

1+ parts

$1.620

100+ parts

$1.588

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50

$1.620

$1.588

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Modulus Dynamics

Lithuania . 700 parts In-Stock

1+ parts

$1.798

100+ parts

$1.780

1k+ parts

$1.726

10k+ parts

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700

$1.798

$1.780

$1.726

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Corohmni

South Africa . 590 parts In-Stock

1+ parts

$8.673

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590

$8.673

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$9.693

100+ parts

$9.209

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$9.209

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200

$9.693

$9.209

$9.209

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Parana Technologies

USA . 493 parts In-Stock

1+ parts

$11.235

100+ parts

-

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$11.672

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493

$11.235

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$11.672

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ChromeModa Solutions

Germany . 1,993 parts In-Stock

1+ parts

$12.624

100+ parts

$10.352

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1,993

$12.624

$10.352

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IDEA Electronic Components Group

UK . 12 parts In-Stock

1+ parts

$12.624

100+ parts

$11.993

1k+ parts

$11.362

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12

$12.624

$11.993

$11.362

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GreenTree Electronics

Israel . 11,705 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,525 parts In-Stock

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Lixinc

USA . 1,111 parts In-Stock

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DigiPath Technology Company

USA . 629 parts In-Stock

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$11.382

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629

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$11.382

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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$13.572

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$13.572

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$13.572

500

-

$13.572

$13.572

$13.572

Overview

Discover the innovative ISO7731DWR by Texas Instruments, a top-quality interface circuit offering unparalleled performance and reliability. With its advanced technology and military-grade temperature grade, this versatile IC is perfect for a wide range of applications. From industrial automation to automotive systems, this product ensures seamless communication and precise control. Trust in Texas Instruments' reputation for excellence and experience the benefits of superior quality and unmatched value with the ISO7731DWR. Elevate your projects with this cutting-edge solution today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the integrated circuits, ensuring long-term reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort during assembly.

Maximum Supply Voltage: 5.5 V

Supports a wide range of applications with a higher voltage tolerance, enhancing versatility.

No. of Functions: 3

Offers multiple functions in a single IC, reducing the need for additional components and simplifying circuit design.

Package Shape: RECTANGULAR

Facilitates space-efficient placement on a PCB, allowing for more compact and streamlined designs.

No. of Terminals: 16

Provides ample connectivity options for interfacing with other components, enhancing flexibility in circuit integration.

Package Style (Meter): SMALL OUTLINE

Enables a compact footprint on the PCB, maximizing board space for other components or features.

Minimum Supply Voltage: 2.25 V

Supports low-power operation and extends battery life in portable devices or energy-efficient applications.

Maximum Operating Temperature: 125 °C

Ensures reliable performance in a wide range of environmental conditions, suitable for demanding industrial or automotive applications.

Minimum Operating Temperature: -55 °C

Allows for operation in extreme cold environments without compromising functionality or reliability.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Offers excellent conductivity and corrosion resistance, ensuring reliable signal transmission and longevity.

Terminal Position: DUAL

Facilitates easy and secure connection during installation, reducing the risk of errors or damage to the IC.

Maximum Seated Height: 2.65 mm

Fits easily within compact enclosures or assemblies, allowing for a more streamlined and space-efficient design.

Width: 7.5 mm

Saves valuable board space while providing sufficient room for routing traces and connections within the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow during assembly, reducing the risk of defects and ensuring a secure connection.

Peak Reflow Temperature °C: 260

Compatible with standard reflow soldering processes, ensuring reliable and consistent manufacturing outcomes.

Length: 10.3 mm

Optimizes board layout and component placement, contributing to an efficient and well-organized circuit design.

Temperature Grade: MILITARY

Meets rigorous standards for reliability and performance in harsh environments, suitable for military or aerospace applications.

No. of Channels: 3

Supports multiple data or signal channels, enabling more versatile and complex functionality in the circuit.

Technology: CMOS

Provides low power consumption and high noise immunity, ideal for battery-powered devices or noise-sensitive applications.

Terminal Form: GULL WING

Facilitates easy soldering and strong mechanical connection, ensuring a secure and reliable interface with the PCB.

Nominal Supply Voltage: 2.5 V

Optimal voltage level for efficient and stable operation, ensuring consistent performance under varying load conditions.

Terminal Pitch: 1.27 mm

Enables precise and secure connection on the PCB, reducing the risk of signal interference or poor contact.

Moisture Sensitivity Level (MSL): 2

Resistant to moisture-related damage during assembly or operation, ensuring long-term reliability in various environmental conditions.

Interface IC Type: INTERFACE CIRCUIT

Specialized for interfacing with other components or systems, providing robust communication and data exchange capabilities.

Technical Specifications

Other Function Interface ICs ISO7731DWR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7731DWR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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