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ISO7760FDBQR

Texas Instruments

ISO7760FDBQR by Texas Instruments

ISO7760FDBQR by Texas Instruments is a 16-terminal IC with 6 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and uses CMOS technology. Ideal for military applications requiring small outline, surface-mount interface circuits.

Median Price

$2.826

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 31,903 parts In-Stock

1+ parts

$1.947

100+ parts

$1.608

1k+ parts

$0.869

10k+ parts

-

31,903

$1.947

$1.608

$0.869

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Arrow

USA . 17 parts In-Stock

1+ parts

$2.302

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-

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17

$2.302

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Mouser Electronics

USA . 5,346 parts In-Stock

1+ parts

$3.350

100+ parts

$2.080

1k+ parts

$1.850

10k+ parts

$1.780

5,346

$3.350

$2.080

$1.850

$1.780

DigiKey

USA . 3,634 parts In-Stock

1+ parts

$3.350

100+ parts

$2.075

1k+ parts

$1.939

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3,634

$3.350

$2.075

$1.939

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Verical

USA . 17 parts In-Stock

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17

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Digiode

USA . 971 parts In-Stock

1+ parts

$1.850

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971

$1.850

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Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$2.220

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10

$2.220

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Vyrian

USA . 11,444 parts In-Stock

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11,444

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Chip Stock

USA . 6,040 parts In-Stock

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6,040

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Cyclops Electronics Ltd

UK . 2,088 parts In-Stock

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2,088

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Inventory MP

USA . 250 parts In-Stock

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250

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Bristol Electronics

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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Semicontronic

India . 7,873 parts In-Stock

1+ parts

$1.210

100+ parts

$1.180

1k+ parts

$1.174

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7,873

$1.210

$1.180

$1.174

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Ampacity Inc.

Singapore . 11,797 parts In-Stock

1+ parts

$1.650

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11,797

$1.650

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Corphita

USA . 4,166 parts In-Stock

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$1.752

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$1.752

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Continental Prestige Electronics

USA . 6,262 parts In-Stock

1+ parts

$2.220

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$2.176

6,262

$2.220

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-

$2.176

Argo Parts USA

USA . 1,063 parts In-Stock

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$2.220

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1,063

$2.220

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$2.366

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$2.248

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$2.248

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1,000

$2.366

$2.248

$2.248

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Corohmni

South Africa . 188 parts In-Stock

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$2.774

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188

$2.774

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Parana Technologies

USA . 1,296 parts In-Stock

1+ parts

$6.125

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$6.895

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1,296

$6.125

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$6.895

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IDEA Electronic Components Group

UK . 2,335 parts In-Stock

1+ parts

$6.882

100+ parts

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$6.194

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2,335

$6.882

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$6.194

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ChromeModa Solutions

Germany . 1,237 parts In-Stock

1+ parts

$6.882

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$5.643

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1,237

$6.882

$5.643

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Lixinc

USA . 13,657 parts In-Stock

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Futuretech Components

Singapore . 1,860 parts In-Stock

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1,860

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Netroflash

USA . 1,000 parts In-Stock

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$2.176

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$2.109

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$2.065

1,000

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$2.109

$2.065

GreenTree Electronics

Israel . 1,000 parts In-Stock

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1,000

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DigiPath Technology Company

USA . 721 parts In-Stock

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$6.205

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721

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$6.205

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Overview

Elevate your electronic designs with the Texas Instruments ISO7760FDBQR, a cutting-edge Interface IC that offers unmatched quality and reliability. Manufactured by industry leader Texas Instruments, this product boasts 6 functions in a compact rectangular package, making it ideal for a wide range of applications. From automotive to industrial, this versatile IC provides customers with high-performance solutions that deliver exceptional value and benefits. Trust Texas Instruments for your interface circuit needs and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the IC, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy and efficient installation on PCBs, making the product suitable for automated manufacturing processes.

Maximum Supply Voltage: 5.5 V

Supports a wide range of supply voltages, making the IC versatile for different applications.

No. of Functions: 6

Offers multiple functions in a single IC, reducing the need for additional components and simplifying circuit design.

Package Shape: RECTANGULAR

Facilitates easy placement and orientation on the PCB, optimizing space utilization in compact electronic devices.

No. of Terminals: 16

Provides sufficient connectivity options for various input and output signals, enhancing the versatility of the IC.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Reduces the overall size of the IC package, ideal for applications where space constraints are a concern.

Minimum Supply Voltage: 2.25 V

Allows operation at lower supply voltages, enabling energy-efficient performance in battery-operated devices.

Maximum Operating Temperature: 125 °C

Ensures reliable operation in high-temperature environments, making the IC suitable for industrial and automotive applications.

Minimum Operating Temperature: -55 °C

Maintains functionality in extreme cold conditions, expanding the range of environments where the IC can be used.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent corrosion resistance and conductivity for reliable electrical connections, ensuring long-term performance.

Terminal Position: DUAL

Facilitates easy PCB layout and soldering, improving the overall reliability of the connections.

Maximum Seated Height: 1.75 mm

Low profile design saves space in compact electronic devices, making the IC suitable for small form factor applications.

Width: 3.895 mm

Compact width dimension allows for efficient placement on the PCB, optimizing board real estate.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper solder reflow during manufacturing, minimizing the risk of solder joint defects.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during manufacturing processes, ensuring the reliability of solder joints.

Length: 4.905 mm

Optimal length dimension for easy integration in various electronic assemblies, enhancing design flexibility.

Temperature Grade: MILITARY

Meets stringent military standards for reliability and performance, making the IC suitable for demanding military applications.

No. of Channels: 6

Offers multiple channels for enhanced functionality and data processing capabilities, suitable for applications requiring multiple inputs/outputs.

Technology: CMOS

Utilizes CMOS technology for low power consumption and high noise immunity, ideal for battery-powered and sensitive electronic devices.

Terminal Form: GULL WING

Gull wing terminals provide secure mechanical and electrical connections, ensuring reliable performance under various operating conditions.

Nominal Supply Voltage: 2.5 V

Optimal supply voltage for stable operation and performance, ensuring consistent functionality across different applications.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for high-density mounting on the PCB, suitable for designs requiring compact circuit layouts.

Moisture Sensitivity Level (MSL): 2

MSL 2 rating indicates moderate sensitivity to moisture, requiring standard precautions during component storage and handling.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing different components or systems, facilitating seamless communication and data exchange between devices.

Technical Specifications

Other Function Interface ICs ISO7760FDBQR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7760FDBQR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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