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FOD8333R2V

Onsemi

FOD8333R2V by Onsemi

INTERFACE CIRCUIT; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; JESD-609 Code: e3;

Median Price

$3.688

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 524 parts In-Stock

1+ parts

$6.480

100+ parts

$3.919

1k+ parts

-

10k+ parts

-

524

$6.480

$3.919

-

-

Rochester

USA . 1,771 parts In-Stock

1+ parts

-

100+ parts

$2.800

1k+ parts

$2.510

10k+ parts

$2.360

1,771

-

$2.800

$2.510

$2.360

Verical

USA . 918 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.688

10k+ parts

-

918

-

-

$3.688

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,218 parts In-Stock

1+ parts

$2.974

100+ parts

-

1k+ parts

-

10k+ parts

-

2,218

$2.974

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.610

100+ parts

-

1k+ parts

-

10k+ parts

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50

$4.610

-

-

-

Chip Stock

USA . 10,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10,250

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-

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Vyrian

USA . 965 parts In-Stock

1+ parts

-

100+ parts

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965

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-

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-

ACDS - Activité Composants Distribution Service

France . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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750

-

-

-

-

Bristol Electronics

USA . 750 parts In-Stock

1+ parts

-

100+ parts

$2.241

1k+ parts

$1.969

10k+ parts

-

750

-

$2.241

$1.969

-

Dan-Mar Components

USA . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

750

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 739 parts In-Stock

1+ parts

$2.660

100+ parts

-

1k+ parts

-

10k+ parts

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739

$2.660

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-

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Corphita

USA . 345 parts In-Stock

1+ parts

$2.817

100+ parts

-

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10k+ parts

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345

$2.817

-

-

-

Corohmni

South Africa . 444 parts In-Stock

1+ parts

$3.130

100+ parts

-

1k+ parts

-

10k+ parts

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444

$3.130

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-

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Modulus Dynamics

Lithuania . 2,990 parts In-Stock

1+ parts

$10.841

100+ parts

$10.841

1k+ parts

$10.841

10k+ parts

-

2,990

$10.841

$10.841

$10.841

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QUARKTWIN TECHNOLOGY LTD

USA . 18,657 parts In-Stock

1+ parts

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18,657

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Lixinc

USA . 8,774 parts In-Stock

1+ parts

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8,774

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-

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TANS Electronics

Latvia . 6,424 parts In-Stock

1+ parts

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6,424

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-

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Kepictronics

USA . 5,500 parts In-Stock

1+ parts

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5,500

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-

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Argo Parts USA

USA . 5,227 parts In-Stock

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5,227

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-

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SupplyDigital Components

Austria . 5,055 parts In-Stock

1+ parts

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100+ parts

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5,055

-

-

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Kulean Microsystems

USA . 4,978 parts In-Stock

1+ parts

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100+ parts

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4,978

-

-

-

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Continental Prestige Electronics

USA . 4,617 parts In-Stock

1+ parts

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100+ parts

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4,617

-

-

-

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Problanco Electronics

Mexico . 3,428 parts In-Stock

1+ parts

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100+ parts

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3,428

-

-

-

-

Perfect Parts

USA . 1,635 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,635

-

-

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Supply Digital

USA . 1,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,610

-

-

-

-

iodParts Technologies Inc.

India . 750 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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750

-

-

-

-

Authorized Procurement Solutions

USA . 500 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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500

-

-

-

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UHIMA Technologies

Türkiye . 270 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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270

-

-

-

-

Technical Specifications

Other Function Interface ICs FOD8333R2V attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FOD8333R2V Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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