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FOD8332R2V

Onsemi

FOD8332R2V by Onsemi

INTERFACE CIRCUIT; Peak Reflow Temperature (C): 260; JESD-609 Code: e3; Terminal Finish: MATTE TIN; Maximum Time At Peak Reflow Temperature (s): 30; Moisture Sensitivity Level (MSL): 1;

Median Price

$4.815

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,882 parts In-Stock

1+ parts

$6.480

100+ parts

$3.919

1k+ parts

-

10k+ parts

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3,882

$6.480

$3.919

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-

Mouser Electronics

USA . 692 parts In-Stock

1+ parts

$6.480

100+ parts

$3.550

1k+ parts

$3.170

10k+ parts

$3.150

692

$6.480

$3.550

$3.170

$3.150

Flip Electronics (Authorized)

USA . 15,750 parts In-Stock

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-

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15,750

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Rochester

USA . 1,639 parts In-Stock

1+ parts

-

100+ parts

$2.810

1k+ parts

$2.520

10k+ parts

$2.370

1,639

-

$2.810

$2.520

$2.370

Verical

USA . 1,639 parts In-Stock

1+ parts

-

100+ parts

-

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$3.150

10k+ parts

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1,639

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-

$3.150

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 378 parts In-Stock

1+ parts

$2.974

100+ parts

-

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378

$2.974

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Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$4.758

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50

$4.758

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Flip Electronics

USA . 15,954 parts In-Stock

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15,954

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Vyrian

USA . 5,494 parts In-Stock

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5,494

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 5,392 parts In-Stock

1+ parts

$2.660

100+ parts

-

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5,392

$2.660

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Corphita

USA . 2,487 parts In-Stock

1+ parts

$2.817

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2,487

$2.817

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Corohmni

South Africa . 273 parts In-Stock

1+ parts

$3.130

100+ parts

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273

$3.130

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Continental Prestige Electronics

USA . 2,610 parts In-Stock

1+ parts

$4.758

100+ parts

-

1k+ parts

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10k+ parts

$4.662

2,610

$4.758

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-

$4.662

Metaverse IC Inc.

Canada . 36,800 parts In-Stock

1+ parts

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36,800

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QUARKTWIN TECHNOLOGY LTD

USA . 25,227 parts In-Stock

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25,227

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TANS Electronics

Latvia . 8,364 parts In-Stock

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8,364

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Problanco Electronics

Mexico . 6,723 parts In-Stock

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6,723

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Lixinc

USA . 3,639 parts In-Stock

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3,639

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Argo Parts USA

USA . 2,174 parts In-Stock

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2,174

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Supply Digital

USA . 1,246 parts In-Stock

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1,246

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SupplyDigital Components

Austria . 1,081 parts In-Stock

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1,081

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Kulean Microsystems

USA . 981 parts In-Stock

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981

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Perfect Parts

USA . 560 parts In-Stock

1+ parts

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560

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Bastille Electronics

Australia . 500 parts In-Stock

1+ parts

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100+ parts

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500

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UHIMA Technologies

Türkiye . 134 parts In-Stock

1+ parts

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134

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Technical Specifications

Other Function Interface ICs FOD8332R2V attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Peak Reflow Temperature (C):

260

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FOD8332R2V Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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