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TUSB4041IPAPR

Texas Instruments

TUSB4041IPAPR by Texas Instruments

TUSB4041IPAPR by Texas Instruments is an interface IC with a max supply voltage of 1.26V and a min supply voltage of 0.99V. It is commonly used in industrial applications due to its temperature grade and moisture sensitivity level (MSL).

Median Price

$5.117

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 28,589 parts In-Stock

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$3.916

100+ parts

$3.192

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$2.128

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-

28,589

$3.916

$3.192

$2.128

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Farnell

UK . 26 parts In-Stock

1+ parts

$5.030

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$3.360

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$2.860

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26

$5.030

$3.360

$2.860

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Arrow

USA . 621 parts In-Stock

1+ parts

$5.117

100+ parts

$3.197

1k+ parts

$2.729

10k+ parts

-

621

$5.117

$3.197

$2.729

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Chip1Stop

Japan . 625 parts In-Stock

1+ parts

$5.609

100+ parts

$3.453

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$2.729

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625

$5.609

$3.453

$2.729

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Newark

USA . 8 parts In-Stock

1+ parts

$6.700

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$5.070

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-

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8

$6.700

$5.070

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Element14

Singapore . 92 parts In-Stock

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$8.019

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$6.085

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92

$8.019

$6.085

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Verical

USA . 621 parts In-Stock

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-

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$3.197

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$2.729

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621

-

$3.197

$2.729

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$3.192

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150

$3.192

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Digiode

USA . 144 parts In-Stock

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$3.720

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144

$3.720

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 3,896 parts In-Stock

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Cyclops Electronics Ltd

UK . 3,011 parts In-Stock

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Bristol Electronics

USA . 46 parts In-Stock

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ComSIT Distribution GmbH

Germany . 11 parts In-Stock

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11

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NexGen Digital

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Semicontronic

India . 3,761 parts In-Stock

1+ parts

$2.520

100+ parts

$2.457

1k+ parts

$2.444

10k+ parts

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3,761

$2.520

$2.457

$2.444

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Ampacity Inc.

Singapore . 3,688 parts In-Stock

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$2.520

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3,688

$2.520

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Modulus Dynamics

Lithuania . 4,590 parts In-Stock

1+ parts

$2.998

100+ parts

$2.998

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$2.998

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4,590

$2.998

$2.998

$2.998

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Continental Prestige Electronics

USA . 6,175 parts In-Stock

1+ parts

$3.192

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-

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$3.128

6,175

$3.192

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-

$3.128

Argo Parts USA

USA . 52 parts In-Stock

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$3.192

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52

$3.192

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Corphita

USA . 1,522 parts In-Stock

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$3.524

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1,522

$3.524

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Parana Technologies

USA . 2,175 parts In-Stock

1+ parts

$4.675

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-

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$5.158

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2,175

$4.675

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$5.158

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DigiPath Technology Company

USA . 2,301 parts In-Stock

1+ parts

$5.148

100+ parts

$4.736

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2,301

$5.148

$4.736

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ChromeModa Solutions

Germany . 5,627 parts In-Stock

1+ parts

$5.253

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$4.307

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5,627

$5.253

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IDEA Electronic Components Group

UK . 1,994 parts In-Stock

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$5.253

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$4.728

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1,994

$5.253

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$6.322

100+ parts

$6.006

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$6.006

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5,000

$6.322

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$6.006

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Corohmni

South Africa . 696 parts In-Stock

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$11.350

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Lixinc

USA . 7,932 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,354 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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Futuretech Components

Singapore . 500 parts In-Stock

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Robosynatics

Brazil . 450 parts In-Stock

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$22.351

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$22.351

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$22.351

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-

$22.351

$22.351

$22.351

Lucentia Tech

USA . 450 parts In-Stock

1+ parts

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100+ parts

$22.351

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$22.351

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$22.351

450

-

$22.351

$22.351

$22.351

Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Discover the power of seamless connectivity with the TUSB4041IPAPR by Texas Instruments. As a trusted manufacturer known for its superior quality, Texas Instruments has once again delivered an exceptional product. The TUSB4041IPAPR is a versatile interface IC that opens up endless possibilities for various applications. With its compact design and advanced features, this device offers unmatched value and benefits to customers. Experience hassle-free connections, enhanced performance, and unparalleled reliability with the TUSB4041IPAPR. Upgrade your devices today and revolutionize the way you connect.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the IC, ensuring long-term reliability.

Surface Mount: YES

Surface mount capability allows for easy installation on circuit boards, saving time and effort during manufacturing processes.

Maximum Supply Voltage: 1.26 V

High maximum supply voltage tolerance makes this IC suitable for a wide range of applications.

Package Shape: SQUARE

Square package shape allows for efficient use of space on a circuit board, ideal for compact designs.

No. of Terminals: 64

With 64 terminals, this IC offers multiple connection points for interfacing with other components in a circuit.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Versatile package styles offer flexibility in design and allow for customization based on specific project requirements.

Minimum Supply Voltage: 0.99 V

Low minimum supply voltage ensures efficient power usage and compatibility with different power sources.

Maximum Operating Temperature: 85 °C

High maximum operating temperature tolerance allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures that the IC can function in extreme cold environments without issues.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel Palladium Gold finish provides excellent conductivity and corrosion resistance for reliable signal transmission.

Terminal Position: QUAD

Quad terminal position offers improved stability and connectivity for secure attachment to the circuit board.

Maximum Seated Height: 1.2 mm

Low maximum seated height allows for a compact design and contributes to space-saving on the circuit board.

Width: 10 mm

10mm width provides a balance between compact size and ease of handling during installation.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for a sufficient duration for reflow soldering, ensuring proper bonding of the IC to the circuit board.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures proper melting of solder for secure connections.

Length: 10 mm

10mm length offers a compact footprint, ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable performance in harsh industrial environments with temperature fluctuations.

Terminal Form: GULL WING

Gull wing terminal form offers mechanical strength for secure attachment to the circuit board and ease of soldering.

Nominal Supply Voltage: 1.1 V

Stable nominal supply voltage ensures consistent and reliable operation of the IC within specified voltage range.

Terminal Pitch: 0.5 mm

0.5mm terminal pitch allows for high-density mounting on the circuit board, saving space and enabling efficient routing.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate sensitivity to moisture, requiring proper handling and storage to prevent damage.

Interface IC Type: INTERFACE CIRCUIT

Designed specifically for interfacing circuits, making it suitable for a wide range of applications in electronics.

Technical Specifications

Other Function Interface ICs TUSB4041IPAPR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

IT ALSO REQUIRES 3.3V

Interface IC Type:

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

.99 V

Nominal Supply Voltage:

1.1 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Trade Compliance

TUSB4041IPAPR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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