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TUSB2E111YCGR

Texas Instruments

TUSB2E111YCGR by Texas Instruments

TUSB2E111YCGR by Texas Instruments is a 15-terminal interface IC with a supply voltage range of 3-4.32V, operating b/w -20 to 85°C. Its grid array package style and thin profile make it suitable for applications requiring high-speed data transfer in compact spaces like mobile devices or IoT gadgets.

Median Price

$2.260

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 1,465 parts In-Stock

1+ parts

$2.080

100+ parts

$1.250

1k+ parts

$1.100

10k+ parts

$1.030

1,465

$2.080

$1.250

$1.100

$1.030

DigiKey

USA . 2,892 parts In-Stock

1+ parts

$2.260

100+ parts

$1.365

1k+ parts

$1.203

10k+ parts

$1.133

2,892

$2.260

$1.365

$1.203

$1.133

Texas Instruments

USA . 15,598 parts In-Stock

1+ parts

$3.636

100+ parts

$3.186

1k+ parts

$1.800

10k+ parts

-

15,598

$3.636

$3.186

$1.800

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 87 parts In-Stock

1+ parts

$2.250

100+ parts

-

1k+ parts

-

10k+ parts

-

87

$2.250

-

-

-

Digiode

USA . 4,111 parts In-Stock

1+ parts

$2.660

100+ parts

-

1k+ parts

-

10k+ parts

-

4,111

$2.660

-

-

-

Vyrian

USA . 10,244 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,244

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 709 parts In-Stock

1+ parts

$2.250

100+ parts

-

1k+ parts

-

10k+ parts

$2.205

709

$2.250

-

-

$2.205

Argo Parts USA

USA . 377 parts In-Stock

1+ parts

$2.250

100+ parts

-

1k+ parts

-

10k+ parts

-

377

$2.250

-

-

-

Semicontronic

India . 10,286 parts In-Stock

1+ parts

$2.380

100+ parts

$2.320

1k+ parts

$2.309

10k+ parts

-

10,286

$2.380

$2.320

$2.309

-

Ampacity Inc.

Singapore . 10,214 parts In-Stock

1+ parts

$2.380

100+ parts

-

1k+ parts

-

10k+ parts

-

10,214

$2.380

-

-

-

Corphita

USA . 2,011 parts In-Stock

1+ parts

$2.520

100+ parts

-

1k+ parts

-

10k+ parts

-

2,011

$2.520

-

-

-

Parana Technologies

USA . 1,395 parts In-Stock

1+ parts

$6.635

100+ parts

-

1k+ parts

$7.354

10k+ parts

-

1,395

$6.635

-

$7.354

-

DigiPath Technology Company

USA . 262 parts In-Stock

1+ parts

$7.306

100+ parts

$6.721

1k+ parts

-

10k+ parts

-

262

$7.306

$6.721

-

-

ChromeModa Solutions

Germany . 6,438 parts In-Stock

1+ parts

$7.455

100+ parts

$6.113

1k+ parts

-

10k+ parts

-

6,438

$7.455

$6.113

-

-

IDEA Electronic Components Group

UK . 1,382 parts In-Stock

1+ parts

$7.455

100+ parts

-

1k+ parts

$6.710

10k+ parts

-

1,382

$7.455

-

$6.710

-

Overview

Elevate your electronics with the TUSB2E111YCGR by Texas Instruments, a top-tier manufacturer known for delivering unparalleled quality in the category of Other Function Interface ICs. This surface-mount device offers customers a seamless experience with its sleek rectangular package style and versatile terminal finish. From increased efficiency to improved performance, this interface circuit provides a wide range of benefits, making it an essential component for various applications. Trust Texas Instruments to deliver cutting-edge technology that enhances your projects and sets you apart from the competition.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient mounting onto PCBs, saving time and effort during assembly.

Maximum Supply Voltage: 4.32 V

Can handle higher voltage inputs, providing flexibility in power supply options.

Package Shape: RECTANGULAR

Standard rectangular shape that is easy to handle and integrate into circuits.

No. of Terminals: 15

Offers multiple connection points for interfacing with other components, increasing versatility.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact and precise package style that saves space on the PCB and allows for high-density circuit designs.

Minimum Supply Voltage: 3 V

Can operate at low voltage levels, suitable for a wide range of applications with varying power requirements.

Maximum Operating Temperature: 85 °C

Capable of functioning reliably in high-temperature environments, ensuring stable performance under challenging conditions.

Minimum Operating Temperature: -20 °C

Can operate in low-temperature conditions, making it suitable for use in diverse environments.

Terminal Finish: TIN SILVER COPPER

Provides good conductivity and corrosion resistance, ensuring long-term reliability in electrical connections.

Terminal Position: BOTTOM

Facilitates easy installation and connections on the PCB, enhancing ease of use and accessibility.

Maximum Seated Height: 0.5 mm

Low profile design that minimizes space requirements and allows for compact device designs.

Width: 1.303 mm

Narrow width that contributes to the compact form factor of the product, saving space on the PCB.

Peak Reflow Temperature °C: 260

Can withstand high temperatures during manufacturing processes such as reflow soldering, ensuring robust assembly.

Length: 2.003 mm

Compact length that contributes to the overall small footprint of the product, ideal for space-constrained applications.

Terminal Form: BALL

Ball terminals provide reliable electrical connections and are suitable for fine pitch applications, ensuring secure connections.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance, suitable for a wide range of electronic devices and systems.

Terminal Pitch: 0.35 mm

Fine pitch terminals allow for high-density mounting on the PCB, enabling compact circuit designs with improved signal integrity.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface functions, making it a reliable choice for connecting different parts of a circuit and facilitating communication between components.

Technical Specifications

Other Function Interface ICs TUSB2E111YCGR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-XBGA-B15

JESD-609 Code:

e1

Length:

2.003 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

BGA15,3X5,14

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

4.32 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

BOTTOM

Width:

1.303 mm

Trade Compliance

TUSB2E111YCGR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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