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TUSB1210BQRHBRQ1

Texas Instruments

TUSB1210BQRHBRQ1 by Texas Instruments

TUSB1210BQRHBRQ1 by Texas Instruments is an AEC-Q100 compliant interface IC with 32 terminals. It operates b/w -40 to 125 °C, suitable for automotive applications. With a supply voltage range of 2.7V to 4.8V, it features a chip carrier package style and 0.5mm terminal pitch for compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,777 parts In-Stock

1+ parts

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9,777

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Digiode

USA . 2,814 parts In-Stock

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2,814

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 687 parts In-Stock

1+ parts

$6.542

100+ parts

-

1k+ parts

$7.282

10k+ parts

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687

$6.542

-

$7.282

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DigiPath Technology Company

USA . 301 parts In-Stock

1+ parts

$7.203

100+ parts

$6.627

1k+ parts

-

10k+ parts

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301

$7.203

$6.627

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ChromeModa Solutions

Germany . 6,100 parts In-Stock

1+ parts

$7.350

100+ parts

$6.027

1k+ parts

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10k+ parts

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6,100

$7.350

$6.027

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IDEA Electronic Components Group

UK . 552 parts In-Stock

1+ parts

$7.350

100+ parts

-

1k+ parts

$6.615

10k+ parts

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552

$7.350

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$6.615

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AZTECH Wire

Italy . 657 parts In-Stock

1+ parts

$17.038

100+ parts

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657

$17.038

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One Stop Electronics

USA . 541 parts In-Stock

1+ parts

$29.500

100+ parts

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541

$29.500

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Corphita

USA . 781 parts In-Stock

1+ parts

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781

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Overview

Enhance your automotive electronics with the TUSB1210BQRHBRQ1 by Texas Instruments, a top-quality interface circuit designed to meet the rigorous AEC-Q100 screening standards. With a wide supply voltage range and high operating temperature, this chip carrier IC offers reliability and performance in various automotive applications. Trust in Texas Instruments' reputation for excellence in semiconductor manufacturing and experience seamless integration with the TUSB1210BQRHBRQ1's surface mount feature and compact design. Upgrade your systems today with this versatile solution that delivers value, efficiency, and innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good mechanical strength and electrical insulation, making the product durable and reliable.

Surface Mount: YES

Surface mounting allows for easy and efficient assembly onto circuit boards, saving time and enhancing production efficiency.

Maximum Supply Voltage: 4.8 V

The high maximum supply voltage ensures compatibility with various power sources, increasing the versatility of the product.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets automotive-grade standards for quality and reliability, making it suitable for automotive applications.

Package Shape: SQUARE

The square package shape allows for efficient use of space on the circuit board, optimizing design flexibility and layout efficiency.

No. of Terminals: 32

Having a high number of terminals enables connectivity with multiple external components, expanding the functionality of the product.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures effective thermal management and compact form factor, ideal for space-constrained applications.

Minimum Supply Voltage: 2.7 V

The low minimum supply voltage allows for operation in low-power scenarios, enhancing energy efficiency and prolonging battery life.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions, ensuring reliable performance in demanding applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables operation in cold environments, making the product suitable for a wide range of temperature conditions.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connection to the circuit board, ensuring stable and reliable electrical connections.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a compact profile and space-saving design, making the product ideal for applications with limited vertical clearance.

Width: 5 mm

The compact width dimension allows for efficient use of board space, contributing to a streamlined and optimized overall system design.

Length: 5 mm

The small length dimension helps reduce footprint on the circuit board, enabling greater flexibility in layout and placement of components.

Temperature Grade: AUTOMOTIVE

Being automotive-grade ensures that the product meets stringent industry standards for performance and reliability, making it suitable for automotive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly and improves reliability by eliminating the risk of solder joint failure, enhancing the overall robustness of the product.

Nominal Supply Voltage: 3.6 V

The nominal supply voltage provides a stable operating voltage, ensuring consistent performance and compatibility with a wide range of power sources.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on the circuit board, enabling compact and space-efficient designs for crowded PCB layouts.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type indicates the product's function, providing connectivity and communication capabilities between different components, enhancing system integration and functionality.

Technical Specifications

Other Function Interface ICs TUSB1210BQRHBRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.8 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

TUSB1210BQRHBRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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