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TUSB1142RNQT

Texas Instruments

TUSB1142RNQT by Texas Instruments

TUSB1142RNQT by Texas Instruments is a 40-terminal interface IC with 2 channels, operating at 3.3V nominal voltage and supporting surface mount installation. With a max supply voltage of 3.6V, it is ideal for applications requiring high-speed data transfer in compact electronic devices.

Median Price

$5.732

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,250 parts In-Stock

1+ parts

$5.732

100+ parts

$4.673

1k+ parts

$3.115

10k+ parts

-

5,250

$5.732

$4.673

$3.115

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 80 parts In-Stock

1+ parts

$4.670

100+ parts

-

1k+ parts

-

10k+ parts

-

80

$4.670

-

-

-

Digiode

USA . 1,536 parts In-Stock

1+ parts

$5.445

100+ parts

-

1k+ parts

-

10k+ parts

-

1,536

$5.445

-

-

-

Vyrian

USA . 7,101 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,101

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,326 parts In-Stock

1+ parts

$3.600

100+ parts

-

1k+ parts

-

10k+ parts

-

2,326

$3.600

-

-

-

Continental Prestige Electronics

USA . 3,475 parts In-Stock

1+ parts

$4.670

100+ parts

-

1k+ parts

-

10k+ parts

$4.577

3,475

$4.670

-

-

$4.577

Corphita

USA . 2,716 parts In-Stock

1+ parts

$5.159

100+ parts

-

1k+ parts

-

10k+ parts

-

2,716

$5.159

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-

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Parana Technologies

USA . 2,347 parts In-Stock

1+ parts

$8.858

100+ parts

-

1k+ parts

$9.542

10k+ parts

-

2,347

$8.858

-

$9.542

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DigiPath Technology Company

USA . 605 parts In-Stock

1+ parts

$9.754

100+ parts

$8.974

1k+ parts

-

10k+ parts

-

605

$9.754

$8.974

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-

ChromeModa Solutions

Germany . 1,112 parts In-Stock

1+ parts

$9.953

100+ parts

$8.161

1k+ parts

-

10k+ parts

-

1,112

$9.953

$8.161

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IDEA Electronic Components Group

UK . 972 parts In-Stock

1+ parts

$9.953

100+ parts

$9.455

1k+ parts

$8.958

10k+ parts

-

972

$9.953

$9.455

$8.958

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Argo Parts USA

USA . 2,919 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,919

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Overview

Elevate your electronic devices with the TUSB1142RNQT by Texas Instruments, a top-quality interface IC that delivers unmatched performance and reliability. Designed by a trusted manufacturer, this product is perfect for a wide range of applications in need of seamless connectivity. With its cutting-edge features and innovative design, the TUSB1142RNQT offers customers exceptional value, benefits, and advantages, making it the ideal choice for your next project. Upgrade your technology today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Surface Mount: YES

Its surface-mount capability allows for easy installation on circuit boards.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient use of space on the PCB.

No. of Terminals: 40

Having 40 terminals provides ample connectivity options for various components.

Package Style: CHIP CARRIER, HEAT SINK/SLUG

This package style ensures effective heat dissipation for improved performance.

Minimum Supply Voltage: 3 V

The low minimum supply voltage allows for energy-efficient operation.

Maximum Operating Temperature: 70 °C

This high operating temperature range makes the product suitable for use in various environments.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold for terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: QUAD

The quad terminal position offers improved stability and reliability in connectivity.

Maximum Seated Height: 0.8 mm

The low maximum seated height ensures compatibility with compact designs.

Width: 4 mm

The narrow width of the product allows for space-saving installation on the PCB.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature ensures secure soldering during assembly.

Length: 6 mm

The moderate length of the product allows for versatile placement on the circuit board.

No. of Channels: 2

Having two channels provides flexibility in signal routing and processing.

Terminal Form: NO LEAD

The lead-free terminal form is environmentally friendly and compliant with RoHS regulations.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V offers stable performance in various applications.

Terminal Pitch: 0.4 mm

The compact terminal pitch allows for high-density mounting on the PCB.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type enables seamless communication between different components.

Technical Specifications

Other Function Interface ICs TUSB1142RNQT attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TUSB1142RNQT Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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