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ISO7731DBQR

Texas Instruments

ISO7731DBQR by Texas Instruments

ISO7731DBQR by Texas Instruments is a 16-terminal IC with 3 functions, operating b/w -55 to 125 °C. It has a supply voltage range of 2.25-5.5 V and uses CMOS technology. Ideal for military applications, this interface circuit comes in a small outline package with dual terminals and Gull Wing form factor.

Median Price

$1.322

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 9,177 parts In-Stock

1+ parts

$1.463

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$1.208

1k+ parts

$0.653

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9,177

$1.463

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$0.653

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DigiKey

USA . 1,995 parts In-Stock

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$1.180

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$1.180

Distributors (In-Stock)

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Nova Conductors

Japan . 50 parts In-Stock

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$1.380

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50

$1.380

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Digiode

USA . 4,340 parts In-Stock

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$1.390

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$1.390

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Vyrian

USA . 4,837 parts In-Stock

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Chip Stock

USA . 4,501 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 4,837 parts In-Stock

1+ parts

$1.240

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$1.240

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Semicontronic

India . 4,770 parts In-Stock

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$1.240

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$1.209

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$1.203

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4,770

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$1.203

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Corphita

USA . 2,194 parts In-Stock

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$1.317

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Argo Parts USA

USA . 4,121 parts In-Stock

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$1.380

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Continental Prestige Electronics

USA . 2,652 parts In-Stock

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$1.380

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$1.352

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Netroflash

USA . 50 parts In-Stock

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$1.380

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$1.380

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Advanced Electronics

New Zealand . 2,500 parts In-Stock

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$7.701

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$7.316

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$7.316

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$7.701

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$7.316

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Parana Technologies

USA . 1,877 parts In-Stock

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$9.357

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$9.980

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DigiPath Technology Company

USA . 2,371 parts In-Stock

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$10.304

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ChromeModa Solutions

Germany . 6,889 parts In-Stock

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$10.514

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$8.621

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IDEA Electronic Components Group

UK . 2,228 parts In-Stock

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$10.514

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$9.988

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$9.463

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$9.463

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Corohmni

South Africa . 212 parts In-Stock

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$14.050

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A-Z Elektronik GmbH

Germany . 9,591 parts In-Stock

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Lixinc

USA . 3,463 parts In-Stock

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Robosynatics

Brazil . 250 parts In-Stock

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Lucentia Tech

USA . 250 parts In-Stock

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Overview

Experience the ultimate in quality and reliability with the Texas Instruments ISO7731DBQR. As a leader in the industry, Texas Instruments delivers unmatched performance and precision in their products. The ISO7731DBQR falls into the category of Other Function Interface ICs, offering a wide range of applications for customers. With its small outline, shrink pitch package style and dual terminal position, this interface circuit provides exceptional value and benefits to users. Trust Texas Instruments to provide top-of-the-line technology that meets all your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Being surface mountable allows for easy installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, increasing versatility.

No. of Functions: 3

Having multiple functions integrated into one IC eliminates the need for additional components, simplifying the design and reducing costs.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and allows for easy placement on circuit boards.

No. of Terminals: 16

With a higher number of terminals, more connections can be made, enhancing functionality and flexibility.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch design saves space on the PCB, making it ideal for compact electronic devices.

Minimum Supply Voltage: 2.25 V

The low minimum supply voltage ensures efficient operation even with lower power sources.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the IC to withstand demanding environmental conditions, ensuring reliability.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures the IC can be used in a wide range of environments, including harsh cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The use of nickel/palladium/gold terminal finish enhances conductivity and corrosion resistance, improving the reliability and lifespan of the IC.

Terminal Position: DUAL

Dual terminal positions provide redundancy and increased stability in connections, reducing the risk of signal loss or failure.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a slimmer profile, making it suitable for applications with limited space constraints.

Width: 3.895 mm

The compact width of the IC allows for efficient use of space on the PCB, enabling more components to be integrated.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time at peak temperature reduces the risk of thermal damage during soldering, ensuring the integrity of the IC.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable and secure solder joints, ensuring long-term performance.

Length: 4.905 mm

The compact length of the IC contributes to a space-saving design, making it suitable for compact electronic devices.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the IC can withstand extreme temperatures and harsh environments, making it suitable for rugged applications.

No. of Channels: 3

Having three channels allows for multi-functional capability, enabling the IC to handle multiple tasks simultaneously.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the IC efficient and reliable in various applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring secure connections and reliable performance.

Nominal Supply Voltage: 2.5 V

The nominal supply voltage provides a stable operating voltage for the IC, ensuring consistent performance.

Terminal Pitch: 0.635 mm

The fine terminal pitch allows for high-density mounting on the PCB, enabling compact and space-efficient designs.

Moisture Sensitivity Level (MSL): 2

With a low moisture sensitivity level, the IC is less prone to moisture damage during storage or soldering, ensuring long-term reliability.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type allows for seamless communication between different components, making it an essential part for various electronic applications.

Technical Specifications

Other Function Interface ICs ISO7731DBQR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

3

No. of Functions:

3

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7731DBQR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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