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ISO7021FDR

Texas Instruments

ISO7021FDR by Texas Instruments

ISO7021FDR by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 1.71V to 5.5V, it comes in a small outline package ideal for surface mount assembly.

Median Price

$2.202

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 153,365 parts In-Stock

1+ parts

$2.202

100+ parts

$1.929

1k+ parts

$1.090

10k+ parts

-

153,365

$2.202

$1.929

$1.090

-

Mouser Electronics

USA . 1,766 parts In-Stock

1+ parts

$3.910

100+ parts

$2.390

1k+ parts

$2.250

10k+ parts

$1.900

1,766

$3.910

$2.390

$2.250

$1.900

DigiKey

USA . 2,367 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.990

2,367

-

-

-

$1.990

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.635

100+ parts

-

1k+ parts

-

10k+ parts

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500

$1.635

-

-

-

Digiode

USA . 4,150 parts In-Stock

1+ parts

$2.092

100+ parts

-

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10k+ parts

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4,150

$2.092

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-

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Vyrian

USA . 51,777 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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51,777

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 500 parts In-Stock

1+ parts

$1.602

100+ parts

-

1k+ parts

$1.538

10k+ parts

-

500

$1.602

-

$1.538

-

Argo Parts USA

USA . 4,433 parts In-Stock

1+ parts

$1.635

100+ parts

-

1k+ parts

-

10k+ parts

-

4,433

$1.635

-

-

-

Continental Prestige Electronics

USA . 3,001 parts In-Stock

1+ parts

$1.635

100+ parts

-

1k+ parts

-

10k+ parts

$1.602

3,001

$1.635

-

-

$1.602

Semicontronic

India . 51,791 parts In-Stock

1+ parts

$1.870

100+ parts

$1.823

1k+ parts

$1.814

10k+ parts

-

51,791

$1.870

$1.823

$1.814

-

Ampacity Inc.

Singapore . 51,655 parts In-Stock

1+ parts

$1.870

100+ parts

-

1k+ parts

-

10k+ parts

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51,655

$1.870

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-

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Corphita

USA . 2,071 parts In-Stock

1+ parts

$1.982

100+ parts

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2,071

$1.982

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-

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Parana Technologies

USA . 532 parts In-Stock

1+ parts

$4.875

100+ parts

-

1k+ parts

$5.402

10k+ parts

-

532

$4.875

-

$5.402

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ChromeModa Solutions

Germany . 5,469 parts In-Stock

1+ parts

$5.477

100+ parts

$4.491

1k+ parts

-

10k+ parts

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5,469

$5.477

$4.491

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IDEA Electronic Components Group

UK . 1,668 parts In-Stock

1+ parts

$5.477

100+ parts

-

1k+ parts

$4.929

10k+ parts

-

1,668

$5.477

-

$4.929

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Corohmni

South Africa . 306 parts In-Stock

1+ parts

$8.683

100+ parts

-

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306

$8.683

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-

-

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$14.874

100+ parts

$14.131

1k+ parts

$14.131

10k+ parts

-

150

$14.874

$14.131

$14.131

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Lixinc

USA . 18,376 parts In-Stock

1+ parts

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18,376

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DigiPath Technology Company

USA . 189 parts In-Stock

1+ parts

-

100+ parts

$4.938

1k+ parts

-

10k+ parts

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189

-

$4.938

-

-

Overview

Discover the power and precision of the ISO7021FDR by Texas Instruments, a cutting-edge Interface IC that brings unmatched quality and reliability to your projects. With a MILITARY-grade temperature grade and advanced CMOS technology, this versatile IC offers endless possibilities for applications in a variety of industries. From aerospace to automotive, the ISO7021FDR delivers seamless performance and peace of mind. Trust in Texas Instruments' renowned expertise and innovation, and unlock the full potential of your designs with this exceptional product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage ensures compatibility with a wide range of power sources for flexible application.

Package Shape: RECTANGULAR

Rectangular shape saves space on the PCB, making the product suitable for compact designs.

No. of Terminals: 8

Having 8 terminals provides sufficient connectivity options for interfacing with other components in the system.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows the product to function reliably in extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold for terminal finish ensures excellent conductivity and corrosion resistance for long-term reliability.

Width: 3.895 mm

Narrow width makes the product suitable for applications where space is limited.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance enables robust soldering process during assembly.

Temperature Grade: MILITARY

Military-grade temperature rating indicates superior reliability and performance under harsh conditions.

No. of Channels: 2

Dual channels provide versatility for multiple input/output functionalities in the device.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient signal processing.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent operation of the product within specified limits.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates moderate sensitivity to moisture, suitable for standard handling and storage conditions.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit IC, this product facilitates communication between different parts of the system.

Technical Specifications

Other Function Interface ICs ISO7021FDR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7021FDR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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