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TUSB1142IRNQR

Texas Instruments

TUSB1142IRNQR by Texas Instruments

TUSB1142IRNQR by Texas Instruments is a surface mount interface IC with 40 terminals and a rectangular package chip carrier. It operates at a min supply voltage of 3V and max supply voltage of 3.6V, making it suitable for various applications requiring reliable data transfer.

Median Price

$7.020

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 5,203 parts In-Stock

1+ parts

$4.560

100+ parts

$3.717

1k+ parts

$2.478

10k+ parts

-

5,203

$4.560

$3.717

$2.478

-

DigiKey

USA . 432 parts In-Stock

1+ parts

$7.020

100+ parts

$4.570

1k+ parts

$4.128

10k+ parts

$3.821

432

$7.020

$4.570

$4.128

$3.821

Mouser Electronics

USA . 2,321 parts In-Stock

1+ parts

$7.230

100+ parts

$4.710

1k+ parts

$3.960

10k+ parts

$3.910

2,321

$7.230

$4.710

$3.960

$3.910

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,345 parts In-Stock

1+ parts

$4.332

100+ parts

-

1k+ parts

-

10k+ parts

-

2,345

$4.332

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.477

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$4.477

-

-

-

Bristol Electronics

USA . 125 parts In-Stock

1+ parts

$5.152

100+ parts

$2.404

1k+ parts

$2.232

10k+ parts

-

125

$5.152

$2.404

$2.232

-

Vyrian

USA . 2,999 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,999

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,933 parts In-Stock

1+ parts

$3.880

100+ parts

-

1k+ parts

-

10k+ parts

-

2,933

$3.880

-

-

-

Corphita

USA . 2,160 parts In-Stock

1+ parts

$4.104

100+ parts

-

1k+ parts

-

10k+ parts

-

2,160

$4.104

-

-

-

Argo Parts USA

USA . 3,514 parts In-Stock

1+ parts

$4.477

100+ parts

-

1k+ parts

-

10k+ parts

-

3,514

$4.477

-

-

-

Continental Prestige Electronics

USA . 1,027 parts In-Stock

1+ parts

$4.477

100+ parts

-

1k+ parts

-

10k+ parts

$4.388

1,027

$4.477

-

-

$4.388

Parana Technologies

USA . 248 parts In-Stock

1+ parts

$7.259

100+ parts

-

1k+ parts

$7.760

10k+ parts

-

248

$7.259

-

$7.760

-

DigiPath Technology Company

USA . 1,413 parts In-Stock

1+ parts

$7.993

100+ parts

$7.353

1k+ parts

-

10k+ parts

-

1,413

$7.993

$7.353

-

-

ChromeModa Solutions

Germany . 6,674 parts In-Stock

1+ parts

$8.156

100+ parts

$6.688

1k+ parts

-

10k+ parts

-

6,674

$8.156

$6.688

-

-

IDEA Electronic Components Group

UK . 2,033 parts In-Stock

1+ parts

$8.156

100+ parts

-

1k+ parts

$7.340

10k+ parts

-

2,033

$8.156

-

$7.340

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$4.388

1k+ parts

$4.254

10k+ parts

$4.164

2,000

-

$4.388

$4.254

$4.164

Overview

Discover the TUSB1142IRNQR by Texas Instruments, a high-quality interface IC that offers unmatched performance and reliability. As a leading manufacturer in the industry, Texas Instruments ensures that their products meet the highest standards. The TUSB1142IRNQR is perfect for a wide range of applications, providing seamless connectivity and efficient data transfer. With its advanced features and innovative design, this product delivers exceptional value to customers. Experience the benefits of this interface IC and unlock new possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and excellent thermal properties, making this product a reliable choice for various applications.

Surface Mount: YES

The surface mount feature allows for easy integration onto printed circuit boards, enabling efficient manufacturing processes and space-saving designs.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this product can handle a wide range of power inputs, providing versatility and compatibility with different power sources.

No. of Functions: 1

Although compact, this product performs a single important function, offering simplicity and focused functionality for specific applications.

Package Shape: RECTANGULAR

The rectangular package shape facilitates easier handling and placement within electronic systems, contributing to convenient assembly processes.

No. of Terminals: 40

The abundance of terminals allows for a diverse range of connections, ensuring compatibility with various devices and interfaces.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG

This package style incorporates both a chip carrier and a heat sink/slug, maximizing thermal dissipation and promoting efficient heat management, making it suitable for high-performance applications.

Minimum Supply Voltage: 3 V

With a low minimum supply voltage requirement, this product can operate efficiently even in situations where power sources are limited or restricted.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature enables the product to withstand challenging environments or intensive usage scenarios, increasing its reliability and lifespan.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function consistently in cold climates or refrigerated environments, ensuring reliability in a wide range of conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold as the terminal finish enhances corrosion resistance and conductivity, ensuring reliable and long-lasting connections.

Terminal Position: QUAD

The quad terminal position facilitates stable and secure connections, reducing the risk of signal loss or intermittent fluctuations.

Maximum Seated Height: 0.8 mm

The low maximum seated height enables the product to be integrated into space-constrained systems, ensuring compatibility with compact designs.

Width: 4 mm

The narrow width of the product allows for efficient utilization of PCB space, enabling dense circuit layouts and maximizing the functionality of electronic systems.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures optimal soldering and assembly processes, guaranteeing robust and reliable connections.

Length: 6 mm

The compact length of the product further contributes to space-saving designs, allowing for flexible placement within electronic systems.

No. of Channels: 2

With two channels available, the product can support simultaneous data transmission or processing, enhancing its performance and versatility.

Terminal Form: NO LEAD

The no lead terminal form eliminates the use of traditional lead-based materials, complying with environmental regulations and promoting sustainable electronics.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage provides a standard operating voltage, ensuring compatibility and ease of use in various electronic systems.

Terminal Pitch: 0.4 mm

The terminal pitch of 0.4 mm enables fine-pitch surface mount technology, allowing for more miniature and compact designs.

Moisture Sensitivity Level (MSL): 1

With a moisture sensitivity level of 1, the product is designed to withstand moisture exposure during handling and storage, ensuring long-term reliability.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit, this product serves as a crucial intermediary to establish reliable communication and compatibility between different electronic components, making it an essential choice for many applications.

Technical Specifications

Other Function Interface ICs TUSB1142IRNQR attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N40

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

40

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.8 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

TUSB1142IRNQR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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