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ISO7762QDBQRQ1

Texas Instruments

ISO7762QDBQRQ1 by Texas Instruments

ISO7762QDBQRQ1 by Texas Instruments is a digital isolator with 6 channels, operating at -40 to 125°C. It features a supply voltage range of 2.25-5.5V and AEC-Q100 screening for automotive applications. The package is small outline with dual gull wing terminals, suitable for surface mount assembly.

Median Price

$3.490

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 8,656 parts In-Stock

1+ parts

$1.810

100+ parts

$1.586

1k+ parts

$0.896

10k+ parts

-

8,656

$1.810

$1.586

$0.896

-

DigiKey

USA . 2,983 parts In-Stock

1+ parts

$3.490

100+ parts

$2.170

1k+ parts

$1.932

10k+ parts

$1.837

2,983

$3.490

$2.170

$1.932

$1.837

Mouser Electronics

USA . 2,729 parts In-Stock

1+ parts

$3.920

100+ parts

$2.450

1k+ parts

$2.340

10k+ parts

$1.980

2,729

$3.920

$2.450

$2.340

$1.980

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,133 parts In-Stock

1+ parts

$1.720

100+ parts

-

1k+ parts

-

10k+ parts

-

3,133

$1.720

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$2.365

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$2.365

-

-

-

Vyrian

USA . 3,606 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,606

-

-

-

-

Chip Stock

USA . 2,257 parts In-Stock

1+ parts

-

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-

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2,257

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 3,853 parts In-Stock

1+ parts

$0.950

100+ parts

-

1k+ parts

-

10k+ parts

-

3,853

$0.950

-

-

-

Semicontronic

India . 3,843 parts In-Stock

1+ parts

$0.950

100+ parts

$0.926

1k+ parts

$0.922

10k+ parts

-

3,843

$0.950

$0.926

$0.922

-

Corphita

USA . 2,141 parts In-Stock

1+ parts

$1.629

100+ parts

-

1k+ parts

-

10k+ parts

-

2,141

$1.629

-

-

-

Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.318

100+ parts

-

1k+ parts

$2.225

10k+ parts

-

100

$2.318

-

$2.225

-

Argo Parts USA

USA . 3,506 parts In-Stock

1+ parts

$2.365

100+ parts

-

1k+ parts

-

10k+ parts

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3,506

$2.365

-

-

-

Continental Prestige Electronics

USA . 2,992 parts In-Stock

1+ parts

$2.365

100+ parts

-

1k+ parts

-

10k+ parts

$2.318

2,992

$2.365

-

-

$2.318

Parana Technologies

USA . 565 parts In-Stock

1+ parts

$5.658

100+ parts

-

1k+ parts

$6.454

10k+ parts

-

565

$5.658

-

$6.454

-

DigiPath Technology Company

USA . 658 parts In-Stock

1+ parts

$6.230

100+ parts

$5.731

1k+ parts

-

10k+ parts

-

658

$6.230

$5.731

-

-

IDEA Electronic Components Group

UK . 1,626 parts In-Stock

1+ parts

$6.357

100+ parts

-

1k+ parts

$5.721

10k+ parts

-

1,626

$6.357

-

$5.721

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ChromeModa Solutions

Germany . 238 parts In-Stock

1+ parts

$6.357

100+ parts

$5.213

1k+ parts

-

10k+ parts

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238

$6.357

$5.213

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-

Corohmni

South Africa . 108 parts In-Stock

1+ parts

$11.930

100+ parts

-

1k+ parts

-

10k+ parts

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108

$11.930

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 15,483 parts In-Stock

1+ parts

-

100+ parts

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15,483

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-

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Lixinc

USA . 13,949 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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13,949

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Overview

Discover the cutting-edge technology of the ISO7762QDBQRQ1 by Texas Instruments, a premium digital isolator designed for automotive applications. With Texas Instruments' reputation for excellence and reliability, this innovative product offers customers unmatched quality and performance. Ideal for a wide range of functions, this digital isolator provides a safe and efficient solution for your automotive needs. Experience the value and benefits of the ISO7762QDBQRQ1 today and elevate your projects to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 5.5 V

Supports a high supply voltage range for versatile application scenarios.

No. of Functions: 6

Offers multiple functions in a single component, saving space and cost.

Screening Level: AEC-Q100

AEC-Q100 compliant for automotive applications, ensuring high quality and performance.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient PCB layout and space utilization.

No. of Terminals: 16

Provides multiple terminals for enhanced connectivity and functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Small outline and shrink pitch package style saves space on the PCB.

Minimum Supply Voltage: 2.25 V

Supports a low supply voltage range for power efficiency in diverse applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability in various environments.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Nickel/Palladium/Gold terminal finish provides a reliable and corrosion-resistant connection.

Terminal Position: DUAL

Dual terminal position enhances connectivity and signal transmission.

Maximum Seated Height: 1.75 mm

Low seated height saves space and enables compact device designs.

Width: 3.895 mm

Narrow width facilitates efficient PCB layout and component arrangement.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for sufficient reflow time during assembly, ensuring proper soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature enables reliable solder joints during assembly.

Length: 4.905 mm

Compact length contributes to space-saving design and efficient PCB layout.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade ensures performance and reliability in automotive applications.

No. of Channels: 6

Multiple channels provide versatility and functionality for different signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and secure connection on the PCB.

Nominal Supply Voltage: 2.5 V

Standard nominal supply voltage for compatibility with various systems and devices.

Terminal Pitch: 0.635 mm

Narrow terminal pitch allows for high-density PCB integration and space savings.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates moderate sensitivity to moisture during storage and handling.

Interface IC Type: DIGITAL ISOLATOR

Digital isolator interface IC provides electrical isolation for improved signal integrity and protection.

Technical Specifications

Other Function Interface ICs ISO7762QDBQRQ1 attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRED VCC2 2.25-5.5V SUPPLY; ALSO OPERATE WITH 3.3V AND 5V SUPPLY

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

6

No. of Functions:

6

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

2.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7762QDBQRQ1 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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